摘要:
A rectangular parallelepiped p-channel MOS transistor 21 having a height of H B and a width of W B is formed on a silicon substrate, and a gate oxide film is formed on a part of the top surface and the side surface of the p-channel MOS transistor 21. A source and a drain are formed on both sides of a gate electrode 26 to form a MOS transistor. The MOS transistor configures a direct conversion receiving circuit. Thus, an error between an I signal and a Q signal in a direct conversion receiving frequency conversion circuit can be reduced.
摘要:
A mixer circuit is configured using a CMOS transistor (800), comprising a p-channel transistor (840A) and an n-channel transistor (840B) in which semiconductor substrates (810A, 810) with at least two crystal planes and a gate insulator (820A) formed on at least two of the crystal planes on the semiconductor substrate are comprised and the channel width of a channel formed in the semiconductor substrate along with the gate insulator is represented by summation of each of the channel widths of channels individually formed on said at least two crystal planes. Such a configuration allows reduction of 1/f noise, DC offset generated in output signals due to variation in electrical characteristics of a transistor element, and signal distortion based on the channel length modulation effect.
摘要:
A mask repeater for transferring the pattern of a master mask onto a real mask by exposure and transferring the pattern on the real mask onto a substrate such as a semiconductor wafer. The size of the master mask is larger than that of the real mask. By using an optical system for reduction-projecting soft X-rays, a 1:1 magnification mask, which is the next generation mask, is fabricated. In a scan exposure system, the shape of a slit used for scanning is made fixed, and exposure is conducted only for the exposed region to realize oblique exposure. When the shape of the slit is a trapezoid and when the exposed region is reciprocated in the scanning direction, the number of joint exposures can be decreased.
摘要:
A pressure type flow rate control apparatus to be used in a gas supply system for semiconductor manufacturing equipment, which calculates a flow rate (Q = KP1) by using a detected pressure P1 of a pressure detector (4) installed between an orifice (5) and a control valve provided upstream of the orifice (5) and outputs the difference between the calculated flow rate and a flow rate control signal as a control signal to the control valve. The orifice (5) is formed as a direct touch type metal diaphragm, and an annular gap between a valve seat and a diaphragm is made variable to allow the flow rate control range to be changed easily.
摘要:
With the diaphragm valve in the vacuum exhaustion system applied to the semiconductor manufacturing facilities, it is possible to prevent the corrosion of the valve members caused by the accumulation and adherence of the substances as produced by the thermal decomposition, the clogging caused by the substances as produced, and the seat leakage. Further, it is possible to make the facilities for the vacuum exhaustion system small-sized, and, as a result, to lower the costs. It is also possible to reduce the diameter of the vacuum exhaustion system pipings for shortening the vacuum exhaustion time. Specifically, the diaphragm valve 1 is provided with a body 2 having a flow-in passage 6, a flow-out passage 7, and a valve seat 8 formed between the passages; a diaphragm 3 installed in the body 2 and permitted to rest on and move away from the valve seat 8; and a driving means 4 installed on the body 2 to allow the diaphragm 3 to rest on and move away from the valve seat 8, wherein synthetic resin films 5 of predetermined thickness are coated on fluid-contacting parts 25 of the afore-mentioned body 2 and diaphragm 3.
摘要:
A fluid supply apparatus comprising a pressure flow controller for controlling the rate of flow of fluid, a fluid selector valve for opening/closing the fluid passage on the secondary side, and a fluid supply controller for controlling the operation of them, wherein the pressure flow controller is provided with an orifice (5), a control valve (1) provided on the upstream side of the orifice (5), a pressure sensor (3) provided between the control valve (1) and the orifice (5), and an operation controller (6) for outputting to a driver (2) of the control valve (1) a control signal (Qy) representing the difference between a rate-of-flow signal (Qc=KP1) generated by calculation based on the pressure (P1) measured by the pressure sensor (3) and a rate-of-flow command signal (Qs), and the pressure (P1) on the upstream side of the orifice (5) is adjusted by opening/closing the control valve (1) so as to regulate the rate of flow on the downstream side of the orifice (5).
摘要:
A CMOS device includes a p-channel MOS transistor and an n-channel MOS transistor having a structure formed on a (100) surface of a silicon substrate and having a different crystal surface, a high-quality gate insulation film formed on such a structure by a microwave plasma process, and a gate electrode formed thereon, wherein the size and the shape of the foregoing structure is set such that the carrier mobility is balanced between the p-channel MOS transistor and the n-channel MOS transistor.
摘要:
In a semiconductor device in which a plurality of field effect transistors are formed on a silicon surface having substantially a orientation, the field effect transistors are disposed on the silicon surface such that a direction connecting a source region and a drain region of the field effect transistor is coincident to a substantially direction.
摘要:
A microwave is introduced into a process chamber through a waveguide (26) of the plasma process apparatus, thereby generating plasma. A reflection monitor (40) and an electric power monitor (42) monitor the electric power of a reflected wave reflected by the plasma that is generated in the process chamber. Moreover, an incidence monitor (36) and a frequency monitor (48) monitor the frequency of the,microwave generated by a magnetron (24). An electric power supplied to the magnetron (24) is controlled based on the monitored electric power of the reflected wave and the monitored frequency. This method thus controls plasma density to a constant level.
摘要:
In a fabrication method of a semiconductor device including a plurality of silicon-based transistors or capacitors, there exist hydrogen at least in a part of a silicon surface in advance, and the hydrogen is removed by exposing the silicon surface to a first inert gas plasma. Thereafter, plasma is generated by a mixed gas of a second inert gas and one or more gaseous molecules, and a silicon compound layer containing at least a part of the elements constituting the gaseous molecules is formed on the surface of the silicon gas.