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    THERMALLY CONDUCTIVE PRESSURE SENSITIVE ADHESIVE
    134.
    发明公开
    THERMALLY CONDUCTIVE PRESSURE SENSITIVE ADHESIVE 审中-公开
    Ä。。。。。。。。。。。。。

    公开(公告)号：EP3127973A1

    公开(公告)日：2017-02-08

    申请号：EP15180186.7

    申请日：2015-08-07

    Applicant: 3M Innovative Properties Company

    Inventor： Wieneke, Mr. Jan ,  Rieder-Otterburg, Susanne ,  Kuester, Frank ,  Raynoschek, Simone ,  Kayser, Armin ,  Uibel, Krishna

    IPC: C09J7/02 ,  C09J133/06 ,  C08K3/38

    CPC classification number: C09J11/04 ,  C08K3/38 ,  C08K7/00 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C08K2201/014 ,  C09J9/00 ,  C09J133/06 ,  C09J133/08

    Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising:
    a) an acrylic polymer component; and
    b) a boron nitride mixture composition comprising:
    i. a first type of hexagonal boron nitride primary particle agglomerates having a first average agglomerate size d 50 comprised between 100 and 420 µm;
    ii. optionally, hexagonal boron nitride primary particles having an average primary particle size d 50 comprised between 3 and 25 µm;
    iii. optionally, a second type of hexagonal boron nitride primary particle agglomerates having a second average agglomerate size d 50 which is lower than the first average agglomerate size d 50 ;
    iv. optionally, a third type of hexagonal boron nitride primary particle agglomerates having a third average agglomerate size d 50 , wherein the third average agglomerate size d 50 is lower than the first average agglomerate size d 50 and is different from second average agglomerate size d 50 ; and

    wherein the hexagonal boron nitride primary particles have a platelet shape;
    wherein the envelope density of the first type of agglomerates, and optionally, the second type of agglomerates and the third type of agglomerates, are comprised between 0.3 and 2.2 g/cm 3 , when measured according to the test method described in the experimental section; and wherein the content of the boron nitride mixture composition is greater than 15 vol%, based on the volume of the thermally conductive pressure sensitive adhesive composition.
    The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.

    Abstract translation: 本发明涉及导热压敏粘合剂组合物，其包含：a）丙烯酸类聚合物组分; 和b）氮化硼混合物组合物，其包含： 第一类型的六方氮化硼一次粒子聚集体具有100至420μm之间的第一平均聚集体尺寸d 50; II。 任选地，平均一次粒径d 50的六方氮化硼一次粒子在3和25μm之间; III。 任选地，具有低于第一平均团聚体尺寸d 50的第二平均团聚体尺寸d 50的第二类型的六方氮化硼一次粒子附聚物; IV。 可选地，具有第三平均团聚体尺寸d 50的第三类型的六方氮化硼一次粒子附聚物，其中第三平均团聚体尺寸d 50低于第一平均团聚体尺寸d 50，并且不同于第二平均团聚体尺寸d 50; 并且其中所述六方氮化硼一次粒子具有血小板形状; 其中当根据实验部分中描述的测试方法测量时，第一类型附聚物和任选的第二类型附聚物和第三类型附聚物的包络密度为0.3至2.2g / cm 3; 并且其中氮化硼混合物组合物的含量基于导热压敏粘合剂组合物的体积大于15体积％。 本公开还涉及制造这种导热压敏粘合剂的方法及其用途。

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