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1701 条记录 (耗时 0.021 秒)

    Ink composition for printing
    162.
    发明公开
    Ink composition for printing 失效
    墨水组合物印刷

    公开(公告)号：EP0515861A3

    公开(公告)日：1993-06-16

    申请号：EP92107404.3

    申请日：1992-04-30

    申请人： CHISSO CORPORATION

    发明人： Yano, Hitoshi

    IPC分类号： H05K3/28 ,  C08L75/12 ,  C08L75/06 ,  C09D11/10

    CPC分类号： H05K3/285 ,  C08L63/00 ,  C08L75/06 ,  C09D11/102 ,  H05K2201/09872 ,  C08L75/04

    摘要： The present invention provides an ink composition for printing which comprises a blend of 100 parts by weight of a copolymer comprising a polycaprolactonepolyol, a diamine and a diisocyanate, 30 to 300 parts by weight of a novolac type epoxy resin, 30 to 300 parts by weight of a bisphenol type epoxy resin, 0.2 to 20 parts by weight of a thixotropic agent, 0.1 to 30 parts by weight of a defoaming agent, and 0.1 to 10 parts by weight of a leveling agent. It can be used for covering circuit boards.

    Process for producing molded articles of polyimide precursor
    164.
    发明公开
    Process for producing molded articles of polyimide precursor 失效
    Verfahren zur Herstellung von Formmassen aus Polyimidvorprodukt。

    公开(公告)号：EP0541055A1

    公开(公告)日：1993-05-12

    申请号：EP92118873.6

    申请日：1992-11-04

    申请人： CHISSO CORPORATION

    发明人： Kurita, Mitsuo ,  Kikuta, Kazutsune ,  Oka, Keizo

    IPC分类号： C08J3/14 ,  C08G73/10 ,  C08L79/08

    CPC分类号： C08J3/091 ,  B29C47/0021 ,  B29C47/786 ,  B29C47/822 ,  B29C47/862 ,  B29C47/8805 ,  C08G73/1028 ,  C08G73/1032 ,  C08J2379/08

    摘要： The present invention provides a process for producing molded articles of a polyimide precursor by the use of a usual extrusion technique, and physical properties of polyimide products prepared by the heat treatment of the molded articles of the polyimide precursor at 400°C are excellent. This process is characterized by drying a solid obtained by pouring a dilute solution of a polyimide precursor comprising an aromatic tetracarboxylic acid component and an aromatic diamine component in a bad solvent to obtain a dry solid having a polyimide precursor concentration of 50-70% by weight, and then extruding this dry solid at 80-130°C.

    摘要翻译： 本发明提供了通过使用通常的挤出技术制造聚酰亚胺前体的模制品的方法，并且通过在400℃下对聚酰亚胺前体的模塑制品进行热处理制备的聚酰亚胺产品的物理性能是优异的。 该方法的特征在于将通过将包含芳族四羧酸组分和芳族二胺组分的聚酰亚胺前体的稀溶液倒入不良溶剂中而获得的固体进行干燥，得到聚酰亚胺前体浓度为50-70重量％的干固体 ，然后在80-130℃下挤出该干燥固体。

    PHOTOSENSITIVE POLYMER COMPOSITION AND PATTERN FORMATION
    168.
    发明公开
    PHOTOSENSITIVE POLYMER COMPOSITION AND PATTERN FORMATION 失效
    镭射唱片专辑“MUSTERHERSTELLUNG”。

    公开(公告)号：EP0526650A1

    公开(公告)日：1993-02-10

    申请号：EP92905096.1

    申请日：1992-02-25

    申请人： CHISSO CORPORATION

    发明人： KATOU, Kouichi 10-3, Otsutomocho ,  MAEDA, Hirotoshi 10-2, Otsutomocho ,  KUNIMUNE, Kouichi 12-2, Ichihara

    IPC分类号： G03F7/023 ,  G03F7/038 ,  G03F7/039 ,  G03F7/075 ,  H01L21/027

    CPC分类号： G03F7/0757 ,  G03F7/0233

    摘要： A photosensitive polymer composition comprising mainly a poly(amide)imide precursor containing repeating units represented by general formula (I), at least one quinone diazide compound and an organic solvent; and a method of pattern formation by using the composition (I), wherein R 1 represents a tri- or tetravalent carbocyclic aromatic or heterocyclic group; R 2 represents a C 2 or higher aliphatic, alicyclic, araliphatic, carbocyclic aromatic or heterocyclic group, or a polysiloxane group; X represents -O- or -NR 5 -, wherein R 5 represents hydrogen or a C 10 or lower organic group; R 3 represents a divalent organic group; R 4 represents hydrogen or a monovalent C 20 or lower organic group; Ar represents the hexa- or decavalent organic group: a, β, ψ or δ; k is an integer of 1 to 5; the sum of j, k and I is equal to the number of free valencies of Ar; m is 1 or 2; n is 0 or 1; and 1 m + n

    摘要翻译： 一种主要包含含有由通式（I）表示的重复单元的聚（酰胺）酰亚胺前体，至少一种醌二叠氮化合物和有机溶剂的光敏聚合物组合物; 和使用组合物（I）的图案形成方法，其中R 1表示三价或四价碳环芳族或杂环基团; R 2表示C2或更高级脂族，脂环族，芳脂族，碳环芳族或杂环基或聚硅氧烷基; X表示-O-或-NR 5 - ，其中R 5表示氢或C10或更低级的有机基团; R 3表示二价有机基团; R 4表示氢或一价C 20或更低级有机基团; Ar表示六价或十价有机基团：α，β，psi或δ; k为1〜5的整数， j，k和l的和等于Ar的自由价数; m为1或2; n为0或1; 该组合物包含容易生产且仅含有少量杂质的光敏聚合物，并且可以提供具有优异储存稳定性的聚酰胺酰亚胺膜，良好的 灵敏度和良好的浮雕格局。