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    REINFORCED CONTACT ELEMENTS
    11.
    发明公开
    REINFORCED CONTACT ELEMENTS 审中-公开
    增大的接触ELEMENTS

    公开(公告)号：EP2095141A1

    公开(公告)日：2009-09-02

    申请号：EP07864756.7

    申请日：2007-11-25

    申请人： FormFactor, Inc.

    发明人： GRITTERS, John K.

    IPC分类号： G01R31/02

    CPC分类号： H01R13/2407 ,  H01R4/4809 ,  Y10T29/49222

    摘要： Embodiments of reinforced resilient elements and methods for fabricating same are provided herein. In one embodiment, a reinforced resilient element includes a resilient element configured to electrically probe a device to be tested, the resilient element having a first end and an opposing second end; and a reinforcement member having a first end affixed to the resilient element at the first end thereof or at a point disposed between the first and the second ends of the resilient element, an opposing second end disposed in a direction towards the second end of the resilient member, and a resilient portion disposed between the first and second ends, wherein the resilient portion is not affixed to the resilient member.

    ATTACHMENT OF AN ELECTRICAL ELEMENT TO AN ELECTRONIC DEVICE USING A CONDUCTIVE MATERIAL
    12.
    发明公开
    ATTACHMENT OF AN ELECTRICAL ELEMENT TO AN ELECTRONIC DEVICE USING A CONDUCTIVE MATERIAL 审中-公开
    固氮菌电气部件与导电性材料的电子设备

    公开(公告)号：EP2069807A2

    公开(公告)日：2009-06-17

    申请号：EP07842828.1

    申请日：2007-09-20

    申请人： FormFactor, Inc.

    发明人： KIM, Tae, Ma

    IPC分类号： G01R31/02

    CPC分类号： G01R1/07342 ,  G01R1/06727 ,  G01R3/00 ,  Y10T29/49117 ,  Y10T29/49149 ,  Y10T29/49718 ,  Y10T29/49726 ,  Y10T29/4973 ,  Y10T29/53174 ,  Y10T428/20

    摘要： An electrical element can be attached and electrically connected to a substrate by a conductive adhesive material. The conductive adhesive material can electrically connect the electrical element to a terminal or other electrical conductor on the substrate. The conductive adhesive material can be cured by directing a flow of heated gas onto the material or by heating the material through a support structure on which the substrate is located. A non-conductive adhesive material can attach the electrical element to the substrate with a greater adhesive strength than the conductive adhesive. The non-conductive adhesive material can also be cured by directing a flow of heated gas onto the material or by heating the material through the support structure on which the substrate is located. The non-conductive adhesive material can cover the conductive adhesive material.

    PROBE CARD ASSEMBLY WITH AN INTERCHANGEABLE PROBE INSERT
    15.
    发明公开
    PROBE CARD ASSEMBLY WITH AN INTERCHANGEABLE PROBE INSERT 审中-公开
    具有可互换测试插入PRÜFKARTENBAUGRUPPE

    公开(公告)号：EP1904861A2

    公开(公告)日：2008-04-02

    申请号：EP06774597.6

    申请日：2006-07-07

    申请人： FormFactor, Inc.

    发明人： ELDRIDGE, Benjamin, N. ,  SAEKI, Takao ,  KAWAMATA, Nobuhiro ,  REYNOLDS, Carl, V.

    IPC分类号： G01R31/02

    CPC分类号： G01R1/07364 ,  G01R1/07378

    摘要： A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder.

    Electromagnetically coupled interconnect system architecture
    17.
    发明公开
    Electromagnetically coupled interconnect system architecture 有权
    Elektromagnetisch gekoppelte Verbindungssystemarchitektur

    公开(公告)号：EP1830280A1

    公开(公告)日：2007-09-05

    申请号：EP07009480.0

    申请日：2001-11-13

    申请人： FormFactor, Inc.

    发明人： Miller, Charles A.

    IPC分类号： G06F13/40

    CPC分类号： H04B5/0012 ,  H01L23/48 ,  H01L2924/0002 ,  H01L2924/3011 ,  H04B5/0075 ,  H04B5/02 ,  H05K1/141 ,  H05K1/181 ,  H05K3/366 ,  H05K2201/10098 ,  Y02P70/611 ,  H01L2924/00

    摘要： The invention relates to an electronics system comprising a first integrated circuit (112(i), 600, 604) including a first electromagnetic coupler (118(i), 601, 602), and a second integrated circuit (112(i), 600, 604) including a second electromagnetic coupler (118(i), 601, 602). According to the invention said first integrated circuit and said second integrated circuit are disposed such that said first electromagnetic coupler and said second electromagnetic coupler are spaced from each other but within sufficient proximity to be electromagnetically coupled, whereby data provided to said first electromagnetic coupler is contactlessly communicated to said second electromagnetic coupler.

    摘要翻译： 本发明涉及一种电子系统，其包括包括第一电磁耦合器（118（i），601,602）的第一集成电路（112（i），600,604））和第二集成电路（112（i），600 ，604）包括第二电磁耦合器（118（i），601,602））。 根据本发明，所述第一集成电路和所述第二集成电路被布置成使得所述第一电磁耦合器和所述第二电磁耦合器彼此间隔开但在足够接近的范围内被电磁耦合，由此提供给所述第一电磁耦合器的数据是非接触的 传送到所述第二电磁耦合器。

    METHOD AND APPARATUS FOR REMOTELY BUFFERING TEST CHANNELS
    18.
    发明公开
    METHOD AND APPARATUS FOR REMOTELY BUFFERING TEST CHANNELS 审中-公开
    对于测试方法和装置中的频道，FERNPUFFERUNG

    公开(公告)号：EP1794607A2

    公开(公告)日：2007-06-13

    申请号：EP05795133.7

    申请日：2005-09-08

    申请人： FormFactor, Inc.

    发明人： MILLER, Charles, A.

    IPC分类号： G01R31/28

    CPC分类号： G01R31/3008

    摘要： A system is provided to enable leakage current measurement or parametric tests to be performed with an isolation buffer provided in a channel line. Multiple such isolation buffers are used to connect a single signal channel to multiple lines. Leakage current measurement is provided by providing a buffer bypass element, such as a resistor or transmission gate, between the input and output of each buffer. The buffer bypass element can be used to calibrate buffer delay out of the test system by using TDR measurements to determine the buffer delay based on reflected pulses through the buffer bypass element. Buffer delay can likewise be calibrated out by comparing measurements of a buffered and non-buffered channel line, or by measuring a device having a known delay.

    MECHANICALLY RECONFIGURABLE VERTICAL TESTER INTERFACE FOR IC PROBING
    20.
    发明公开
    MECHANICALLY RECONFIGURABLE VERTICAL TESTER INTERFACE FOR IC PROBING 审中-公开
    机械可重构垂直测试仪接口，用于IC PROBE

    公开(公告)号：EP1779471A2

    公开(公告)日：2007-05-02

    申请号：EP05761831.6

    申请日：2005-06-15

    申请人： FormFactor, Inc.

    发明人： ELDRIDGE, Benjamin, N. ,  VASQUEZ, Barbara ,  SHINDE, Makarand, S. ,  MATHIEU, Gaetan, L. ,  SPORCK, Nicholas, A.

    IPC分类号： H01R11/18

    CPC分类号： G01R31/2889 ,  G01R1/0416 ,  G01R1/07307

    摘要： A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.