摘要:
Disclosed is an oxide superconductor in which S, Se, Te or Po is added to an oxide high transition temperature superconductive material. As a result, the critical current density is increased, especially in a ranfe of and a high controllability and a large critical current density can be obtained stably and at high reproducibility. Furthermore, by depositing a thin film of this kind of material by ion process, a thin film of superconductor large in critical current density can be formed. Also disclosed are superconductive materials high in controllability and having high critical current density, the method for fabricating thin film of such materials, and the target for sputtering to be used in such fabrication.
摘要:
Bi-Ti-O or Bi-W-O thin film of stable crystal phase is manufactured by forming a Bi-Ti-O of Bi-W-O thin film periodically in an environment including activated oxygen. A layered structure of Bi-Sr-Ca-Cu-O thin films and Bi-Ti-O or Bi-W-O thin films is manufactured by forming a Bi-Ti-O of Bi-W-O thin film periodically in an environment including activated oxygen. A stable superconductor thin film of high superconducting transition temperature is manufactured reproducibly by layering alternately a layered oxide superconductor thin film of Tl-Ba-Ca-Cu-O system and a Bi-W-O insulator thin film.
摘要:
A field-effect type superconducting device includes a channel layer (2). The channel layer includes superimposed first and second sub-layers (11, 12) which include respective first and second Bi-based oxide compounds containing Cu. Both source electrode (5) and drain electrode (6) contact the channel layer. A gate insulating film (3) made of insulating material extends on the channel layer. A gate electrode (4, 14, 15, 16) extends on the gate insulating film.
摘要:
A surface acoustic module is stable, and its operation frequencies can be varied with high precision. A method of manufacturing the surface acoustic module prevents the module's electrodes from being broken during separation of a sheet of modules into individual components. The surface acoustic module includes an electrode (42) for transmitting a surface acoustic wave and another electrode (44) for receiving a surface acoustic wave, a surface acoustic wave transmitting substrate (41), a high resistance thin film (47), and a thin film (46) for differentiating the transmission velocity of a surface acoustic wave at the high resistance thin film (47) from that at the substrate (41). The method includes the steps of forming a metallic film on a sheet of the surface acoustic wave transmitting substrate (41), of forming the electrodes (42, 44) on the metallic film, and of irradiating light or the like to the metallic film so as to increase the film's resistivity.
摘要:
An oxide is formed which will form an oxide superconductor containing a Cu-O atomic layer. The oxide is hydrogenated. The oxide is oxidized after it is hydrogenated. The hydrogenation and the oxidization are executed simultaneously with or after the oxide is formed. The hydrogenation and the oxidization improve the superconducting characteristics of the oxide superconductor.
摘要:
In the method for fabricating a semiconductor device of the present invention, a collector layer (102) of a first conductivity type is formed in a region of a semiconductor substrate (100) sandwiched by device isolation. A collector opening (110) is formed through a first insulating layer (108) deposited on the semiconductor substrate (100) so that the range of the collector opening (110) covers the collector layer (102) and part of the device isolation. A semiconductor layer of a second conductivity type (111) as an external base is formed on a portion of the semiconductor substrate located inside the collector opening (110), while junction leak prevention layers of the same conductivity type as the external base are formed in the semiconductor substrate. Thus, the active region is narrower than the collector opening reducing the transistor area, while minimizing junction leak.
摘要:
In the method for fabricating a semiconductor device of the present invention, a collector layer of a first conductivity type is formed in a region of a semiconductor substrate sandwiched by device isolation. A collector opening is formed through a first insulating layer deposited on the semiconductor substrate so that the range of the collector opening covers the collector layer and part of the device isolation. A semiconductor layer of a second conductivity type as an external base is formed on a portion of the semiconductor substrate located inside the collector opening, while junction leak prevention layers of the same conductivity type as the external base are formed in the semiconductor substrate. Thus, the active region is narrower than the collector opening reducing the transistor area, while minimizing junction leak.