RE-123 SUPERCONDUCTING WIRE AND MANUFACTURING METHOD THEREFOR
    4.
    发明公开
    RE-123 SUPERCONDUCTING WIRE AND MANUFACTURING METHOD THEREFOR 有权
    SUPRALEITENDER RE-123-DRAHT UND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号:EP2940698A1

    公开(公告)日:2015-11-04

    申请号:EP13868055.8

    申请日:2013-12-24

    摘要: An RE123-based superconducting wire (10) of the invention includes: a substrate (11); an intermediate layer (12) provided above the substrate (11); and an oxide superconducting layer (14) that is provided above the intermediate layer (12) and is made of an oxide superconductor expressed by a composition formula of RE 1 Ba 2 Cu 3 O 7-δ where RE represents one kind of or two or more kinds of rare earth elements in the formula, wherein an Hf-containing compound of 0.5 to 10 mol% is introduced into the oxide superconducting layer (14), a different phase containing Hf is dispersed in the oxide superconducting layer (14) as a flux pinning center, and the a-axial-ratio of the oxide superconducting layer (14) is less than or equal to 1.5%.

    摘要翻译: 本发明的基于RE123的超导线(10)包括:衬底(11); 设置在所述基板(11)上方的中间层(12); 以及设置在所述中间层(12)的上方并由RE 1 Ba 2 Cu 3 O 7-'的组成式表示的氧化物超导体制成的氧化物超导层(14),其中RE表示一种或两种或 式中的更多种稀土元素,其中将0.5-10mol%的含Hf化合物引入氧化物超导层(14)中,将含有Hf的不同相分散在氧化物超导层(14)中,作为 磁通钉扎中心,氧化物超导层(14)的a轴比率小于或等于1.5%。

    FILM FORMING METHOD AND FILM FORMING DEVICE
    10.
    发明公开
    FILM FORMING METHOD AND FILM FORMING DEVICE 有权
    方法和装置电影的制作

    公开(公告)号:EP1371746A1

    公开(公告)日:2003-12-17

    申请号:EP02710513.9

    申请日:2002-02-05

    IPC分类号: C23C14/28 C23C14/46

    摘要: A film deposition method and apparatus capable of forming a film on a substrate having a large area are provided. The film deposition method of forming a film by scattering a deposition material from a surface of a target material (14) and depositing the scattered deposition material onto a surface of a substrate (12), comprising a step of arranging the substrate (12) and the target material (14) such that the surface of the substrate (12) forms an angle to the surface of the target material (14), and a deposition step of forming the film on the substrate (12) in such a manner that an area of a film surface is continuously increased in a two-dimensional direction, while moving a relative position of the substrate (12) with respect to the target material (14).