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    LAMINATE, AND METHOD FOR PRODUCING LAMINATE
    11.
    发明公开
    LAMINATE, AND METHOD FOR PRODUCING LAMINATE 审中-公开
    LAMINAT UND VERFAHREN ZUR HERSTELLUNG DES LAMINATS

    公开(公告)号：EP3115481A1

    公开(公告)日：2017-01-11

    申请号：EP15758220.6

    申请日：2015-02-25

    Applicant: NHK Spring Co., Ltd.

    Inventor： TAKIMOTO, Masaru ,  YAMAUCHI, Yuichiro ,  HIRANO, Satoshi ,  AIKAWA, Naoya

    IPC: C23C24/08

    CPC classification number: C23C24/04

    Abstract: For a laminate according to the present invention, a metallic coating is formed by accelerating copper powder containing 0.002% to 0.020% by weight of phosphorus and having been subjected to reduction treatment together with gas heated to a temperature lower than the melting point of the copper powder, spraying the copper powder onto the surface of a substrate while keeping the copper powder in the solid state, and depositing the copper powder on the substrate.

    Abstract translation: 对于根据本发明的层压材料，通过加速含有0.002％至0.020重量％的磷的铜粉并通过加热到低于铜的熔点的温度进行还原处理来形成金属涂层 粉末，同时将铜粉末保持在固体状态下，将铜粉末喷涂到基材表面上，并将铜粉末沉积在基材上。

    STRUCTURE WITH EMBEDDED PIPE AND MANUFACTURING METHOD THEREFOR
    12.
    发明公开
    STRUCTURE WITH EMBEDDED PIPE AND MANUFACTURING METHOD THEREFOR 审中-公开
    具有嵌入管的结构及其制造方法

    公开(公告)号：EP2871262A1

    公开(公告)日：2015-05-13

    申请号：EP13813481.2

    申请日：2013-07-01

    Applicant: NHK Spring Co., Ltd.

    Inventor： MORI, Shogo ,  YAMAUCHI, Yuichiro ,  AKABAYASHI, Masaru

    IPC: C23C24/04 ,  F16L1/00

    CPC classification number: F28F3/12 ,  C23C24/04 ,  F28D2021/0029 ,  F28F1/00 ,  F28F1/20 ,  F28F2255/146 ,  F28F2275/02

    Abstract: To provide a pipe embedded structure that improves adhesive properties between a pipe that forms a passage and a metal member, and a method of manufacturing the pipe embedded structure. A pipe embedded structure 1 includes a pipe 10, a base material 11, and a deposited layer 12. The pipe 10 is made of a metal or an alloy, and has a periphery that forms a circular shape in a transverse section. The base material 11 is made of a metal or an alloy, in which a recessed portion 11a is formed. The recessed portion 11a allows the pipe 10 to be fitted therein, and has an inner wall on which a part of the periphery abuts, and a ratio h/R of a protruding amount h by which the pipe 10 protrudes from the upper surface 11b and a curvature R of the periphery is not smaller than 0.3 and not greater than 0.7. The deposited layer 12 is formed such that powder formed of a metal or an alloy is accelerated together with a gas in a state where the pipe 10 is fitted into the recessed portion 11a, and the powder is sprayed and deposited on surfaces of the pipe 10 and the base material 11 while remaining in a solid phase state.

    Abstract translation: 为了提供改善形成通道的管和金属构件之间的粘合性的管嵌入结构以及制造该管嵌入结构的方法。 管埋入结构体1具有管10，基材11和蒸镀层12.管10由金属或合金构成，其周面形成为横截面为圆形。 基材11由金属或合金形成，其中形成有凹部11a。 凹部11a使配管10嵌合，并且具有与周面的一部分抵接的内壁和配管10从上表面11b突出的突出量h的比率h / R， 周边的曲率R不小于0.3且不大于0.7。 沉积层12被形成为使得由金属或合金形成的粉末在管10被装配到凹入部分11a中的状态下与气体一起被加速，并且粉末被喷射并沉积在管10的表面上 和基材11同时保持固相状态。

    STRUCTURE WITH EMBEDDED PIPE AND MANUFACTURING METHOD THEREFOR
    15.
    发明公开
    STRUCTURE WITH EMBEDDED PIPE AND MANUFACTURING METHOD THEREFOR 审中-公开
    STRUKTUR MIT EINGEBETTETEM ROHR UND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号：EP2871261A1

    公开(公告)日：2015-05-13

    申请号：EP13813218.8

    申请日：2013-07-01

    Applicant: NHK Spring Co., Ltd.

    Inventor： MORI, Shogo ,  YAMAUCHI, Yuichiro ,  AKABAYASHI, Masaru

    IPC: C23C24/04 ,  F16L1/00

    CPC classification number: F16L3/00 ,  B05D1/12 ,  C23C24/04 ,  F28D2021/0029 ,  F28F1/00 ,  F28F1/02 ,  F28F1/20 ,  F28F2255/146 ,  F28F2275/02

    Abstract: Provided is a pipe buried structure with improved adhesiveness between a pipe forming a flow path and a metal member, and a method of manufacturing the same. A pipe buried structure 1 is provided with a pipe 10 made of metal or alloy, an outer periphery on a cross section of which has a flattened shape obtained by curving both ends in a longitudinal direction, a base material 11 made of metal or alloy on which a concave portion 11a is formed, the portion including an inner wall which an outer peripheral portion 10c in the longitudinal direction abuts and to which the pipe 10 is fitted, and a deposition layer 12 formed by accelerating powder made of metal or alloy together with gas and spraying the same in a solid phase state on surfaces of the pipe 10 and the base material 11, thereby depositing the powder in a state in which the pipe 10 is fitted to the concave portion 11a, wherein a ratio h/R between a protruding amount h by which the pipe 10 protrudes from the surface of the base material 11 and a curvature R at ends 10a and 10b is not smaller than 0.25 and not larger than 0.5.

    Abstract translation: 提供一种具有改善的形成流路的管道与金属构件的粘合性的管埋式结构体及其制造方法。 管埋结构体1具有由金属或合金构成的管10，其外周的横截面为通过使长度方向的两端弯曲而得到的扁平形状，由金属或合金制成的基材11 形成有凹部11a的部分，该部分包括外壁部分10c在纵向方向上邻接并且配管10的内壁，以及沉积层12，其通过将由金属或合金制成的粉末与 气体并在管10和基材11的表面上以固相状态喷涂，从而将管10装配到凹部11a的状态下沉积粉末，其中a 管10从基材11的表面突出的突出量h，端部10a，10b的曲率R为0.25以上，0.5以下。

    CONDUCTIVE MEMBER
    17.
    发明公开
    CONDUCTIVE MEMBER 审中-公开
    导电成员

    公开(公告)号：EP2662473A1

    公开(公告)日：2013-11-13

    申请号：EP11854649.8

    申请日：2011-12-26

    Applicant: NHK Spring Co., Ltd.

    Inventor： KAYAMOTO, Takashi ,  SAITO, Shinji ,  YAMAUCHI, Yuichiro

    IPC: C23C24/04 ,  H01B5/02

    CPC classification number: H01B5/02 ,  C23C24/04 ,  H01B1/02

    Abstract: A conductive member (1) disposed as a power supply line and the like includes: a first conductive material (11) and a second conductive material (12), at least one of which includes a conductive material having electrical resistance lower than that of aluminum; and a metal film (13) formed by depositing powder including a metal, which is accelerated together with a gas and sprayed, in a sold state, onto a surface of a butting part, where the first conductive material (11) and the second conductive material (12) are butted against each other.

    Abstract translation: 作为电源线等配置的导电性构件（1）包括：第一导电性材料（11）和第二导电性材料（12），其至少一方具有电阻比铝低的导电性材料 ; 和金属膜（13），所述金属膜（13）通过将包含金属的粉末沉积在对接部分的表面上而形成，所述金属与气体一起被加速并被喷射，所述金属膜以销售状态沉积在所述对接部分的表面上，其中所述第一导电材料（11）和所述第二导电材料 材料（12）彼此对接。

    CIRCUIT BOARD AND MANUFACTURING METHOD
    18.
    发明公开
    CIRCUIT BOARD AND MANUFACTURING METHOD 审中-公开

    公开(公告)号：EP4292743A1

    公开(公告)日：2023-12-20

    申请号：EP22752596.1

    申请日：2022-01-27

    Applicant: NHK Spring Co., Ltd.

    Inventor： TANAKA, Ryo ,  YAMAUCHI, Yuichiro ,  SUZUKI, Kohei

    IPC: B23K1/00 ,  B23K20/10 ,  H01L23/13 ,  H01L23/12 ,  H01L23/36

    Abstract: Provided are a circuit board and a manufacturing method, capable of further improving heat dissipation of a semiconductor chip such as a semiconductor chip mounted on an additional metal layer using solder, the additional metal layer bonded to a circuit pattern diverting an ultrasonic bonding technique. The circuit board having a circuit pattern 3 on a base plate 5 and an additional metal layer 9 laid and bonded on the circuit pattern 3, wherein the additional metal layer 9 comprises an attachment plane portion 13 configured to fix a semiconductor chip 11 using solder, and an engagement uneven portion 17 provided adjacent to the attachment plane portion 13 to be engaged with a tool uneven portion of a tool for vibration transmission to bond the additional metal layer 9 on the circuit pattern 3 with ultrasonic vibration, wherein the attachment plane portion 13 is a face having unevenness smaller than the engagement uneven portion 17.

    COILING MACHINE, METHOD FOR MANUFACTURING COIL SPRING, AND COIL SPRING
    19.
    发明公开
    COILING MACHINE, METHOD FOR MANUFACTURING COIL SPRING, AND COIL SPRING 审中-公开

    公开(公告)号：EP3903958A1

    公开(公告)日：2021-11-03

    申请号：EP19901655.1

    申请日：2019-12-26

    Applicant: NHK Spring Co., Ltd.

    Inventor： FURUSE, Takeshi ,  HAGIWARA, Daiki ,  SATO, Takuya ,  YAMAUCHI, Yuichiro

    IPC: B21F3/02 ,  B21F3/06 ,  B21F11/00 ,  B21F35/00

    Abstract: A coiling machine (10) includes feed rollers (11a, 11b) for moving a wire (1), a wire guide (12), a first forming roller (13), a second forming roller (14), a pitch tool (21), a cutting mechanism (23), and a support mechanism (24) for supporting the wire (1). The cutting mechanism (23) includes a cutting rotor (22). The wire (1) coming out of the wire guide (12) is formed into a helical shape by the first forming roller (13), the second forming roller (14) and the pitch tool (21). After one coil spring of a predetermined length is formed, the wire (1) is cut by moving the cutting rotor (22) in the radial direction of the wire (1). The cutting rotor (22) cuts the wire (1) supported by the support mechanism (24) in the radial direction of the wire (1) between the second forming roller (14) and the pitch tool (21).

    METHOD FOR PRODUCING A LAMINATE
    20.
    发明授权
    METHOD FOR PRODUCING A LAMINATE 有权

    公开(公告)号：EP3115481B1

    公开(公告)日：2018-10-03

    申请号：EP15758220.6

    申请日：2015-02-25

    Applicant: NHK Spring Co., Ltd.

    Inventor： TAKIMOTO, Masaru ,  YAMAUCHI, Yuichiro ,  HIRANO, Satoshi ,  AIKAWA, Naoya

    IPC: C23C24/04

    CPC classification number: C23C24/04

    Abstract: For a laminate according to the present invention, a metallic coating is formed by accelerating copper powder containing 0.002% to 0.020% by weight of phosphorus and having been subjected to reduction treatment together with gas heated to a temperature lower than the melting point of the copper powder, spraying the copper powder onto the surface of a substrate while keeping the copper powder in the solid state, and depositing the copper powder on the substrate.

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