METHOD FOR PRODUCING A LAMINATE
    1.
    发明授权

    公开(公告)号:EP3115481B1

    公开(公告)日:2018-10-03

    申请号:EP15758220.6

    申请日:2015-02-25

    CPC classification number: C23C24/04

    Abstract: For a laminate according to the present invention, a metallic coating is formed by accelerating copper powder containing 0.002% to 0.020% by weight of phosphorus and having been subjected to reduction treatment together with gas heated to a temperature lower than the melting point of the copper powder, spraying the copper powder onto the surface of a substrate while keeping the copper powder in the solid state, and depositing the copper powder on the substrate.

    JOINED BODY
    2.
    发明公开
    JOINED BODY 审中-公开

    公开(公告)号:EP3871823A1

    公开(公告)日:2021-09-01

    申请号:EP19875649.6

    申请日:2019-10-23

    Abstract: A joined body according to the present invention includes: a main body section including a wall section that forms a passage along which a medium for accelerating heat exchange flows; and a cover configured to cover a surface of the main body section on which the passage is formed. The cover includes: a covering section provided on a side facing the main body section and configured to cover the surface of the main body section on which the passage is formed; a groove section provided on the side facing the main body section and configured to accommodate an end portion of the wall section; and a stirred joint section provided on a side opposite to a side on which the covering section and the groove section are provided. The stirred joint section is at least partly frictionally stirred by a depth reaching a bottom of the groove section from a surface on a side opposite to the side facing the main body section, and bonded to the end portion of the wall section.

    STAGE, AND METHOD FOR MANUFACTURING STAGE
    4.
    发明公开

    公开(公告)号:EP3933065A1

    公开(公告)日:2022-01-05

    申请号:EP20766608.2

    申请日:2020-02-25

    Abstract: A stage includes a base material having a first surface and a second surface adjacent to the first surface, and an insulating film including a plurality of particles, each of the plurality of particles having a flat surface. The flat surface is provided along the first surface and the second surface. The base material includes a third surface in a direction 180 degrees opposite to the first surface, and a part of the flat surface included in the insulating film is provided along the third surface, and a surface obtained by extending the first surface and a surface obtained by extending the second surface intersect at 90 degrees. The base material includes a third surface in a direction 180 degrees opposite to the first surface, and a part of the flat surface included in the insulating film is provided along the third surface.

    JOINING METHOD AND JOINT BODY
    6.
    发明公开

    公开(公告)号:EP3900867A1

    公开(公告)日:2021-10-27

    申请号:EP19900978.8

    申请日:2019-12-13

    Abstract: A joining method according to the present invention is a joining method of joining a main body which is made of aluminum or an aluminum alloy and is formed with a passage through which a medium for promoting heat exchange is circulated and a cover which is made of aluminum or an aluminum alloy and covers the passage of the main body. The method includes: a covering step of covering the main body with the cover; and a diffusion bonding step of joining the main body and the cover by diffusion bonding under a condition in which a joining temperature is 500°C or higher and 640°C or lower, and a joining surface pressure is 0.7 MPa or higher.

    LAMINATE, AND METHOD FOR PRODUCING LAMINATE
    7.
    发明公开
    LAMINATE, AND METHOD FOR PRODUCING LAMINATE 审中-公开
    LAMINAT UND VERFAHREN ZUR HERSTELLUNG DES LAMINATS

    公开(公告)号:EP3115481A1

    公开(公告)日:2017-01-11

    申请号:EP15758220.6

    申请日:2015-02-25

    CPC classification number: C23C24/04

    Abstract: For a laminate according to the present invention, a metallic coating is formed by accelerating copper powder containing 0.002% to 0.020% by weight of phosphorus and having been subjected to reduction treatment together with gas heated to a temperature lower than the melting point of the copper powder, spraying the copper powder onto the surface of a substrate while keeping the copper powder in the solid state, and depositing the copper powder on the substrate.

    Abstract translation: 对于根据本发明的层压材料,通过加速含有0.002%至0.020重量%的磷的铜粉并通过加热到低于铜的熔点的温度进行还原处理来形成金属涂层 粉末,同时将铜粉末保持在固体状态下,将铜粉末喷涂到基材表面上,并将铜粉末沉积在基材上。

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