Abstract:
For a laminate according to the present invention, a metallic coating is formed by accelerating copper powder containing 0.002% to 0.020% by weight of phosphorus and having been subjected to reduction treatment together with gas heated to a temperature lower than the melting point of the copper powder, spraying the copper powder onto the surface of a substrate while keeping the copper powder in the solid state, and depositing the copper powder on the substrate.
Abstract:
A joined body according to the present invention includes: a main body section including a wall section that forms a passage along which a medium for accelerating heat exchange flows; and a cover configured to cover a surface of the main body section on which the passage is formed. The cover includes: a covering section provided on a side facing the main body section and configured to cover the surface of the main body section on which the passage is formed; a groove section provided on the side facing the main body section and configured to accommodate an end portion of the wall section; and a stirred joint section provided on a side opposite to a side on which the covering section and the groove section are provided. The stirred joint section is at least partly frictionally stirred by a depth reaching a bottom of the groove section from a surface on a side opposite to the side facing the main body section, and bonded to the end portion of the wall section.
Abstract:
A small diameter sheath heater with improved reliability is provided. The sheath heater according to one embodiment of the present invention includes a metal sheath, a heating wire having a band shape, the heating wire arranged with a space within the metal sheath so as to rotate with respect to an axis direction of the metal sheath, an insulating material arranged in the space, and connection terminals arranged at one end of the metal sheath, the connection terminals electrically connected with both ends of the heating wire respectively.
Abstract:
A stage includes a base material having a first surface and a second surface adjacent to the first surface, and an insulating film including a plurality of particles, each of the plurality of particles having a flat surface. The flat surface is provided along the first surface and the second surface. The base material includes a third surface in a direction 180 degrees opposite to the first surface, and a part of the flat surface included in the insulating film is provided along the third surface, and a surface obtained by extending the first surface and a surface obtained by extending the second surface intersect at 90 degrees. The base material includes a third surface in a direction 180 degrees opposite to the first surface, and a part of the flat surface included in the insulating film is provided along the third surface.
Abstract:
A member for a plasma processing device according to the present invention includes an aluminum base material, and an oxide film formed on the aluminum base material and has a porous structure. The oxide film includes a first oxide film formed on a surface of the aluminum base material, a second oxide film formed opposite to the aluminum base material side of the first oxide film, and a third oxide film formed opposite to the first oxide film side of the second oxide film. The first oxide film is harder than the second oxide film and the third oxide film. A hole formed in each of the first oxide film, the second oxide film and the third oxide film is sealed.
Abstract:
A joining method according to the present invention is a joining method of joining a main body which is made of aluminum or an aluminum alloy and is formed with a passage through which a medium for promoting heat exchange is circulated and a cover which is made of aluminum or an aluminum alloy and covers the passage of the main body. The method includes: a covering step of covering the main body with the cover; and a diffusion bonding step of joining the main body and the cover by diffusion bonding under a condition in which a joining temperature is 500°C or higher and 640°C or lower, and a joining surface pressure is 0.7 MPa or higher.
Abstract:
For a laminate according to the present invention, a metallic coating is formed by accelerating copper powder containing 0.002% to 0.020% by weight of phosphorus and having been subjected to reduction treatment together with gas heated to a temperature lower than the melting point of the copper powder, spraying the copper powder onto the surface of a substrate while keeping the copper powder in the solid state, and depositing the copper powder on the substrate.