摘要:
A bit mounting device (10; 30) includes a holder (12) that may be mounted to a spindle of the power tool or may be a part of the spindle. A bit push member (15) is disposed within a bit receiving hole (12b) that is formed in the holder (12) for receiving a tool bit (1). The movement of the operation member (20; 31) is transmitted to the bit push member (15) via a transmission mechanism (14, 15d, 20b; 14, 15d, 31b), so that the tool bit (1) is pushed in a removing direction from the bit receiving hole (12b) by the bit push member (15).
摘要:
The present invention relates to a changing device for replaceably holding a sensor, sensing element or tool on a machine or a machine part or a rotating pivoting device on a machine or a machine part, preferably a coordinate measuring device. The changing device has a holding part with a first bearing and a corresponding element (22) with a counter bearing which corresponds to the first bearing (23). A releasable clamping device (25), for example a magnetic clamping device, is provided, by means of which a clamping force is produced between the first and the second bearings (26) when a corresponding element (22) is held in the holding part. A locking device with a first closure element (29) is provided on the holding part and a corresponding element, for example in the form of a slide (30), which corresponds to the closure element (29) of the holding part is provided on the corresponding element (22). By means of the locking device, the corresponding element can be mechanically coupled to the holding part in the state in which it is held on the holding part. The closure element (29) has a joint (31), and a securing element (33) in the form of a cable which is prestressed by a compression spring (35) is provided, by means of which a separation of the separating surface (31) is limited to a predetermined distance. The closure element with joint ensures that even in the event of a collision excessively large forces are not exerted on the components by the closure element (29) being lifted out of its seat at the joint (31). In the event of a collision the securing element also ensures that the corresponding element (22) remains connected to the holding part (21) and a component which is supported on the corresponding element does not drop off.
摘要:
Present invention provides a method of holding substrate and a substrate holding system where the amount of foreign substances on the back surface can be decreased, and a little amount of foreign substances may be transferred from a mounting table to a substrate. The substrate holding system comprises a ring-shaped leakage-proof surface having smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic ttraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
摘要:
A semiconductor wafer processing apparatus, and more specifically, a semiconductor substrate support pedestal having a substrate support, an isolator, and first and second heat transfer plates for providing a controllable, uniform temperature distribution across the diameter of a semiconductor wafer. A semiconductor wafer placed upon the pedestal is maintained uniformly at a predetermined temperature by heating the wafer with one or more electrodes embedded within the substrate support and cooling the wafer with a fluid passing through the first and second heat transfer plates.
摘要:
This invention relates to a plasma reactor apparatus (1) having improved etch uniformity and throughput. Higher etch uniformity is achieved through the use of a new gas delivery mechanism (9a) and a thermally insulated wafer chuck (42). The vacuum insulated chuck (42) also results in lower energy consumption and higher throughput.
摘要:
A lithographic projection apparatus comprising: a radiation system (Ex,IL) for providing a projection beam (PB) of radiation; a support structure (MT) for supporting patterning means (MA), the patterning means serving to pattern the projection beam according to a desired pattern; a substrate holder (1) comprising a plurality of protrusions (2) defining a protrusion configuration for providing a substantially flat plane of support for supporting a substantially flat substrate (W), the substrate holder comprising at least one clamping electrode (8) for generating an electric field, for clamping a substrate against the substrate holder by said electric field; the substrate holder further comprising a peripheral supporting edge (3) arranged to contact a substrate; and a projection system (PL) for projecting the patterned beam onto a target portion of the substrate. According to the invention, the said at least one electrode extends beyond said peripheral supporting edge.