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1176 条记录 (耗时 0.019 秒)

    IN-MOLD ELECTRONIC STRUCTURE USING PLATING PROCESS AND METHOD THEREFOR
    12.
    发明公开
    IN-MOLD ELECTRONIC STRUCTURE USING PLATING PROCESS AND METHOD THEREFOR 审中-公开

    公开(公告)号：EP4011593A1

    公开(公告)日：2022-06-15

    申请号：EP21158443.8

    申请日：2021-02-22

    申请人： Intops. Co., Ltd.

    发明人： HONG, Tae Yong ,  AHN, Jun Young

    IPC分类号： B29C45/16 ,  B29C45/14 ,  H05K3/00 ,  H05K3/10 ,  H05K3/42

    摘要： An in-mold electronic structure according to the present invention comprises a film with a design; a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, wherein an electronic circuit is formed on a top side or both sides of the second plastic resin, wherein an electronic device is mounted on the top side or the both sides of the second plastic resin, wherein the film, the first plastic resin, and the second resin with the electronic circuit and the electronic device, are integrated.

    METHOD FOR MANUFACTURING CIRCUIT WIRING BY THREE-DIMENSIONAL ADDITIVE MANUFACTURING
    13.
    发明公开
    METHOD FOR MANUFACTURING CIRCUIT WIRING BY THREE-DIMENSIONAL ADDITIVE MANUFACTURING 审中-公开

    公开(公告)号：EP4007458A1

    公开(公告)日：2022-06-01

    申请号：EP19939422.2

    申请日：2019-07-31

    申请人： Fuji Corporation

    发明人： TOMINAGA, Ryojiro ,  SAKAKIBARA, Ryo ,  TAKEUCHI, Tasuku ,  HASHIMOTO, Yoshitaka ,  TSUKADA, Kenji

    IPC分类号： H05K3/10 ,  H05K1/03 ,  H05K3/12 ,  H05K3/46

    摘要： In a case where a circuit wiring is formed on a resin member by three-dimensional additive manufacturing, a method for manufacturing the circuit wiring by three-dimensional additive manufacturing capable of suppressing swelling or cracking of the circuit wiring is provided. A method for manufacturing a circuit wiring by three-dimensional additive manufacturing includes a discharging step of discharging a fluid containing a metal particle onto a resin member formed of a resin material; and a circuit wiring forming step of forming a circuit wiring by heating the fluid containing the metal particle discharged onto the resin member at a heating temperature to be cured, and the heating being performed at the heating temperature based on a glass transition point of the resin material, a linear expansion coefficient of the resin material, and a room temperature.

    LIQUID WIRE
    16.
    发明公开
    LIQUID WIRE 审中-公开

    公开(公告)号：EP3975204A1

    公开(公告)日：2022-03-30

    申请号：EP21196700.5

    申请日：2017-02-27

    申请人： Liquid Wire Inc.

    发明人： RONAY, Mark

    IPC分类号： H01B1/02 ,  H01B1/16 ,  H01B13/00 ,  H05K1/09 ,  H05K3/10

    摘要： A conducting shear thinning gel composition and methods of making such a composition are disclosed. The conducting shear thinning gel composition includes a mixture of a eutectic gallium alloy and gallium oxide, wherein the mixture of eutectic gallium alloy and gallium oxide has a weight percentage (wt%) of between about 59.9% and about 99.9% eutectic gallium alloy, and a wt% of between about 0.1% and about 2.0% gallium oxide. Also disclosed are articles of manufacture, comprising the shear thinning gel composition, and methods of making article of manufacture having a shear thinning gel composition.