公开(公告)号：EP0304645A2

公开(公告)日：1989-03-01

申请号：EP88111999.4

申请日：1988-07-26

申请人： Rodel, Inc.

发明人： Hoffstein, Mark F. ,  Shinagawa, Takehisa

IPC分类号： B24D3/32 ,  B24D11/00 ,  B29C67/20

CPC分类号： B24B37/24 ,  B24D3/32 ,  B29C44/321 ,  B29K2075/00 ,  B29L2031/736 ,  C08J9/0061 ,  C08J9/28 ,  C08J2375/04 ,  C08J2427/00 ,  Y02P20/582

摘要： A polishing pad material is provided with a cellular polymeric layer containing elongated cells normal to the major surfaces of the material, such that the cell openings on the polishing surface of the material comprise a majority of the surface area, and the cells have a mean diameter of about 50 to 200 microns with the diameter of the surface openings being preferably larger than the cell diameters below the surface. The cells are preferably cone-shaped and have a depth at least 1.5 times the diameter of the surface openings. The pad material is formed from a poromeric material, preferably polyurethane elastomer, with microporous cell walls having pore diameters less than 0.1 times the diameter of the cells. The polishing pad material may be made according to conventional poromeric technology, but instead of removing the usual top poromeric skin, the poromeric layer is inverted and the original bottom poromeric skin and any attached substrate are removed to open and expose the cells at a plane corresponding to their largest diameters.

摘要翻译： 抛光垫材料设置有细胞聚合物层，其包含垂直于材料的主表面的细长细胞，使得材料的抛光表面上的电池开口占表面积的大部分，并且电池的平均直径 约50至200微米，其中表面开口的直径优选大于表面下方的孔直径。 细胞优选是锥形的并且具有至少1.5倍表面开口直径的深度。 衬垫材料由孔隙体材料，优选聚氨酯弹性体形成，其孔径小于细胞直径的0.1倍的微孔孔壁。 抛光垫材料可以根据常规的多孔体技术制造，但是代替去除通常的顶部波形体表皮，而不是去除通孔的顶端层，并且移除原始的底部波形皮肤和任何附着的底物以在对应的平面上打开和暴露细胞 达到最大直径。

公开(公告)号：EP1210209A4

公开(公告)日：2004-06-30

申请号：EP00952699

申请日：2000-08-10

申请人： RODEL INC

发明人： ROBERTS JOHN V H ,  PINHEIRO BARRY SCOTT ,  JAMES DAVID B

IPC分类号： B24B37/20 ,  B24D3/28 ,  B24D7/12 ,  B24D13/14 ,  B24B37/04 ,  B24D11/00

CPC分类号： B24B37/205 ,  B24D3/28

摘要： A polishing pad (10) is formed as a one-piece article having a region (12) which is transparent and an adjacent region (14) which is opaque. The article (10) is formed by solidifying a flowable polymeric material which at least initially has a uniform composition. The flowable polymeric material is processed during a molding operation to provide the transparent region (12) and the adjacent opaque region (14). Types of polymeric material suitable for making the polishing pad (10) include a single thermoplastic material, a blend of thermoplastic materials, and a reactive thermosetting polymer.

公开(公告)号：EP1102821A4

公开(公告)日：2004-05-19

申请号：EP99927481

申请日：1999-06-10

申请人： RODEL INC

发明人： SACHAN VIKAS ,  KEGERISE ELIZABETH ,  YE CHRISTINE ,  PIERCE KEITH G ,  LACK CRAIG D ,  THOMAS TERENCE M ,  BURKE PETER A ,  GETTMAN DAVID ,  LANE SARAH

IPC分类号： B24B1/00 ,  C09G1/02 ,  C09G1/04 ,  C09K3/14 ,  H01L21/3105 ,  H01L21/321 ,  H05K3/26

CPC分类号： H01L21/3212 ,  C09G1/02 ,  H01L21/31053

摘要： A composition is provided in the present invention for polishing a composite semiconductor structure containing a metal layer (such as tungsten, aluminum, or copper), a barrier layer (such as tantalum, tantalum nitride, titanium, or titanium nitride), and an insulating layer (such as SiO2). The composition comprises an aqueous medium, an abrasive, an oxidant, an organic polymer that attenuates removal of the oxide film having a degree of polymerization of at least 5 and having a plurality of moieties having affinity to surface groups contained on silicon dioxide surfaces. The composition may optionally comprise a complexing agent and/or a dispersant.

公开(公告)号：EP0829328B1

公开(公告)日：2002-11-13

申请号：EP97120317.9

申请日：1993-08-02

申请人： Rodel, Inc.

发明人： Reinhardt, Heinz F. ,  McClain, Harry George ,  Budinger, William D. ,  Roberts, John V.H. ,  Jensen, Elmer William

IPC分类号： B24D3/34 ,  B24D11/02 ,  C09K3/14

CPC分类号： B29C70/66 ,  B24B37/26 ,  B24B53/00 ,  B24B53/017 ,  B24D3/28 ,  B24D3/32 ,  B29C70/58 ,  B29L2031/736 ,  Y10S438/959 ,  Y10T428/24355 ,  Y10T428/24372 ,  Y10T428/24405 ,  Y10T428/24446 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24579 ,  Y10T428/249924 ,  Y10T428/249954 ,  Y10T428/249972 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/2982 ,  Y10T428/31551 ,  Y10T428/31591

公开(公告)号：EP0717762B1

公开(公告)日：2001-06-20

申请号：EP94927305.6

申请日：1994-09-02

申请人： RODEL, INC.

发明人： COOK, Lee, Melbourne ,  LONCKI, Scott, B. ,  BRANCALEONI, Gregory

IPC分类号： C09G1/02

CPC分类号： C09K3/1454

摘要： Disclosed is a process for preparing activated compositions and the compositions derived therefrom which are suitable for polishing surfaces, particularly integrated circuits, wherein a base abrasive is activated by addition of a second cation whose oxide exhibits a higher polishing rate than the base abrasive alone. The activation is effected by chemical adsorption of the activating cation onto the base abrasive during cyclic impact in an aqueous medium whose pH is at a level which is favorable for adsorption of the activating cation onto the base abrasive surface.

公开(公告)号：EP0840664B1

公开(公告)日：2001-03-07

申请号：EP96916757.6

申请日：1996-05-30

申请人： Rodel, Inc.

发明人： LONCKI, Scott, B. ,  COOK, Lee, Melbourne ,  SHEN, James ,  PIERCE, Keith, G.

IPC分类号： B24B1/00 ,  B24C1/00 ,  C09G1/02 ,  H01L21/306 ,  C09K3/14

摘要： An improved slurry composition and methods of using it are provided for final polishing of silicon wafers. The composition comprises water, submicron silica particles between 0.2 and 0.5 percent by weight of this composition, a salt at a concentration of about 100 to about 1000 ppm, an amine compound at a concentration sufficient to effect a composition pH of about 8 to about 11, and a polyelectrolyte dispersion agent at a concentration of about 20 to about 500 ppm, wherein the composition has a total sodium and potassium content below about 1 ppm, and an iron, nickel, and copper content each below about 0.1 ppm, all ppm being parts per million by weight of the composition.

公开(公告)号：EP0840664A4

公开(公告)日：1999-03-24

申请号：EP96916757

申请日：1996-05-30

申请人： RODEL INC

发明人： LONCKI SCOTT B ,  COOK LEE MELBOURNE ,  SHEN JAMES ,  PIERCE KEITH G

IPC分类号： B24B1/00 ,  B24C1/00 ,  C09G1/02 ,  C09K3/14 ,  H01L21/306

摘要： An improved slurry composition and methods of using it are provided for final polishing of silicon wafers. The composition comprises water, submicron silica particles between 0.2 and 0.5 percent by weight of this composition, a salt at a concentration of about 100 to about 1000 ppm, an amine compound at a concentration sufficient to effect a composition pH of about 8 to about 11, and a polyelectrolyte dispersion agent at a concentration of about 20 to about 500 ppm, wherein the composition has a total sodium and potassium content below about 1 ppm, and an iron, nickel, and copper content each below about 0.1 ppm, all ppm being parts per million by weight of the composition.

公开(公告)号：EP0829328A3

公开(公告)日：1998-12-09

申请号：EP97120317.9

申请日：1993-08-02

申请人： Rodel, Inc.

发明人： Reinhardt, Heinz F. ,  McClain, Harry George ,  Budinger, William D. ,  Roberts, John V.H. ,  Jensen, Elmer William

IPC分类号： B24D3/34 ,  B24D11/02 ,  C09K3/14

CPC分类号： B29C70/66 ,  B24B37/26 ,  B24B53/00 ,  B24B53/017 ,  B24D3/28 ,  B24D3/32 ,  B29C70/58 ,  B29L2031/736 ,  Y10S438/959 ,  Y10T428/24355 ,  Y10T428/24372 ,  Y10T428/24405 ,  Y10T428/24446 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24579 ,  Y10T428/249924 ,  Y10T428/249954 ,  Y10T428/249972 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/2982 ,  Y10T428/31551 ,  Y10T428/31591

摘要： The present invention relates to a method of making or using an article of manufacture in the form of a polishing pad (10) for polishing or planarizing a surface of an electronic substrate, as well as a planarized semiconductor device made thereby. The pad comprises an elastomeric, polymeric matrix (14) impregnated with a plurality of hollow (22), flexible, polymeric microelements (16, 16'). The pad has a work surface (18) and a subsurface (24) proximate to the work surface. One portion (16') of the polymeric microelements is at the work surface and another portion (16) of the polymeric microelements is embedded within the subsurface of the pad that is not exposed to the working environment. The work surface of the pad is relatively softer than the subsurface as a result of mechanically opening or chemically altering the shells of at least some of the hollow, flexible, polymeric microelements located proximate the work surface such that the open polymeric microelements are less rigid than the polymeric microelements embedded in the subsurface, or by texturizing the work surface, thereby causing the work surface to be softer than the subsurface.

摘要翻译： 本发明涉及一种制造或使用抛光垫（10）形式的制品的方法，用于抛光或平面化电子基板的表面，以及由此制成的平坦化的半导体器件。 垫包括浸渍有多个中空（22）挠性聚合物微元件（16,16'）的弹性体聚合物基体（14）。 垫具有工作表面（18）和靠近工作表面的表面（24）。 聚合物微元件的一部分（16'）位于工作表面处，并且聚合物微元件的另一部分（16）嵌入未暴露于工作环境的垫的表面内。 由于机械打开或化学改变位于工作表面附近的至少一些中空柔性聚合物微元件的壳体，所以垫的工作表面相对于表面相对较软，使得开放的聚合物微元件比 嵌入在地下的聚合物微元件，或者通过使工作表面变形，从而使工作表面比地下软。

公开(公告)号：EP0851798A1

公开(公告)日：1998-07-08

申请号：EP97945165.0

申请日：1997-02-26

申请人： RODEL, INC.

发明人： COSSABOON, David ,  WANG, Jiun-Fang ,  COOK, Lee, Melbourne

IPC分类号： C09G1

CPC分类号： C09G1/02

摘要： A composition is provided, which is suitable for polishing SiO2, silicates, and silicon nitride, comprising an aqueous slurry of submicron SiO2 particles and a soluble inorganic salt or combination of soluble inorganic salts of total solution concentration below the critical coagulation concentration for the slurry, wherein the slurry pH is adjusted to within the range of about 9 to 10 by addition of a soluble amine or mixture of soluble amines. Optionally, the compositions of this invention may also comprise a polyhydric alcohol.

公开(公告)号：EP0846040A1

公开(公告)日：1998-06-10

申请号：EP96928246.0

申请日：1996-08-20

申请人： RODEL, INC.

发明人： ROBERTS, John, V., H.

IPC分类号： B24B37 ,  B24D7 ,  B24D13 ,  H01L21

CPC分类号： B24B37/205 ,  B24B37/26 ,  Y10T428/31

摘要： A pad is provided for use on a machine for the polishing of silicon wafers which allows the use of optical detection of the wafer surface condition as the wafer is being polished. This is accomplished by constructing the entire pad or a portion thereof out of a solid uniform polymer sheet with no intrinsic ability to absorb or transport slurry particles and which is transparent to the light beam being used to detect the wafer surface condition by optical methods. Polymers which are transparent to light having a wavelength within the range of 190 to 3500 nanometers are suitable for the construction of these pads.

摘要翻译： 提供用于抛光硅晶片的机器上的垫，其允许在晶片被抛光时使用光学检测晶片表面状态。 这是通过用固体均匀聚合物片材构造整个垫片或其一部分来实现的，其没有固有的吸收或传输浆料颗粒的能力，并且对用于通过光学方法检测晶片表面状况的光束是透明的。 对于波长在190至3500纳米范围内的光是透明的聚合物适用于这些垫的构造。