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23 条记录 (耗时 0.011 秒)

    Integrated circuit package and compact assemblies thereof
    22.
    发明公开
    Integrated circuit package and compact assemblies thereof 失效
    Integrierte Schaltungspackung und kompakter Zusammenbau dieser Packungen。

    公开(公告)号：EP0478188A2

    公开(公告)日：1992-04-01

    申请号：EP91308391.1

    申请日：1991-09-13

    申请人： AT&T Corp.

    发明人： Tai, King Lien ,  Thomson, John, Jr.

    IPC分类号： H01L25/11 ,  H01L23/498 ,  H01L23/057

    CPC分类号： H01L23/3672 ,  H01L23/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49109 ,  H01L2225/1005 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01066 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/1532 ,  H01L2924/1627 ,  H01L2924/00 ,  H01L2224/05599

    摘要： An integrated circuit package comprises a thermally conductive plate for receiving an integrated circuit and an open rectangular structure of conductor and insulator for surrounding the sides of the circuit and presenting one or more linear arrays of conductive connectors extending laterally through the rectangular structure. Preferably the rectangular structure also includes transverse contacts. Advantageously the plate includes extensions beyond the rectangular structure for acting as cooling fins on opposing sides of the rectangular structure. The linear arrays and cooling fins are preferably on different pairs of parallel sides.
    The integrated circuit package permits the aggregation of packages into assemblies and into clusters of assemblies rich in interconnections. Vertically stacked packages form a rectangular parallelepiped having a plurality of parallel planar cooling fins projecting from two opposing surfaces and another pair of planar surfaces providing rectangular arrays of contacts to the enclosed integrated circuits. In addition, transverse contacts permit electrical interconnection of the stacked packages.
    Linear clusters can be aggregated as a linear array of such assemblies with their contact surfaces interconnected either directly by an anisotropically conducting plane or indirectly by an intervening transformation plane. In a preferred linear cluster, successive assemblies are rotated by 90° with respect to the axis of the array. In such clusters each package in the rotated assembly contacts each package in the neighboring assemblies. In low power equipment, elimination of the cooling fins permits even higher levels of interconnection such as rectangular clusters of assemblies.

    摘要翻译： 集成电路封装（10）包括用于接收集成电路的导热板（11）和用于围绕电路的侧面的导体和绝缘体的开放矩形结构（20），并且呈现一个或多个线性阵列的导电连接器延伸 横向穿过矩形结构。 优选地，矩形结构还包括横向接触。 有利地，板包括超过矩形结构的延伸部，用于在矩形结构的相对侧上用作冷却片（12）。 线性阵列和冷却翅片优选地在不同的平行侧对上。 集成电路封装允许将封装集合到组件中并且集成到具有互连的组件的集群中。 垂直堆叠的包装形成长方体，其具有从两个相对的表面突出的多个平行的平面冷却翅片和另一对平面，其向封闭的集成电路提供矩形的触点阵列。 此外，横向触点允许堆叠封装的电互连。 线性簇可以聚集成这样的组件的线性阵列，其接触表面直接通过各向异性导电平面互相连接，或间接地通过中间转换平面相互连接。 在优选的线性簇中，连续的组件相对于阵列的轴线旋转90°。 在这样的群集中，旋转的组件中的每个包装都接触相邻组件中的每个包装。 在低功率设备中，消除散热片允许甚至更高级别的互连，例如矩形组件组。