公开(公告)号：EP1781076A3

公开(公告)日：2009-03-04

申请号：EP06076881.9

申请日：2006-10-13

Applicant: Delphi Technologies, Inc.

Inventor： Taylor, Ralph S. ,  Jeter, Michael A. ,  Gerbsch, Erich W. ,  Ronning, Jeffrey J.

IPC: H05K1/02 ,  H05K7/20 ,  H05K5/00

CPC classification number: H05K7/20872 ,  H05K1/182 ,  H05K7/20927

Abstract: An electronics assembly (10) is provided having a substrate (12) and at least one electronics package (20) supported on the substrate (12). The electronics package (20) also has electrical circuitry and first and second side surfaces. The assembly (10) further includes a first heat sink device (30) positioned in thermal communication with the first side surface of the electronics package (20), and a second heat sink device (40) positioned in thermal communication with the second side surface of the electronics package (20).

公开(公告)号：EP1329951A3

公开(公告)日：2006-03-29

申请号：EP02080604.8

申请日：2002-12-30

Applicant: Delphi Technologies, Inc.

Inventor： Gerbsch, Erich W. ,  Taylor, Ralph S.

IPC: H01L23/057 ,  H01L23/492 ,  H01L23/498

CPC classification number: H01L23/49833 ,  H01L23/492 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electrically isolated and thermally conductive double-sided pre-packaged IC component (20), Stamped lead members (26), drain pads (30), source pads (28), gate runner (35) and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members (22, 24). Layers of solderable copper material (23, 25) are directly bonded to the inner and outer surfaces of the substrate members.

公开(公告)号：EP1622199A3

公开(公告)日：2006-03-15

申请号：EP05076556.9

申请日：2005-07-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Wilkinson, Lester ,  Gerbsch, Erich W.

IPC: H01L23/46 ,  H01L23/473

CPC classification number: H05K1/0272 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels (14), one or more inlet ports (38) for supplying liquid coolant to the micro-channels (14), and one or more outlet ports (40) for exhausting coolant that has passed through the micro-channels (14). The semiconductor device (10) is mounted on a single or multi-layer circuit board (44) having electrical and fluid interconnect features that mate with the electrical terminals (12a, 12b) and inlet and outlet ports (38, 40) of the device (10) to define a self-contained and self-sealed micro-channel heat exchanger.

公开(公告)号：EP1377148A3

公开(公告)日：2004-08-25

申请号：EP03076656.2

申请日：2003-05-28

Applicant: Delphi Technologies, Inc.

Inventor： Jeter, Michael A. ,  Mock, Roger A. ,  Gerbsch, Erich W. ,  Ronning, Jeffrey J.

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  F28D2021/0029 ,  F28F3/027 ,  F28F3/12

Abstract: An electronics assembly 10 is provided, including a housing 12 and at least one electronic power device 18 positioned within. A heat sink device 34 is positioned within the housing 12 and is in thermal communication with the electronic power device 18. The heat sink device 34 includes a fluid vessel 44, a fluid input port 50, a fluid output port 52, and at least one fin insert 60 brazed into the fluid vessel 44. The heat sink device 34 is in fluid communication with an automotive radiator 46 such that coolant 48 flows from the automotive radiator 46 through the fluid vessel 44 thereby cooling the electronic power device 18.

公开(公告)号：EP1329951A2

公开(公告)日：2003-07-23

申请号：EP02080604.8

申请日：2002-12-30

Applicant: Delphi Technologies, Inc.

Inventor： Gerbsch, Erich W. ,  Taylor, Ralph S.

IPC: H01L23/057

CPC classification number: H01L23/49833 ,  H01L23/492 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electrically isolated and thermally conductive double-sided pre-packaged IC component (20), Stamped lead members (26), drain pads (30), source pads (28), gate runner (35) and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members (22, 24). Layers of solderable copper material (23, 25) are directly bonded to the inner and outer surfaces of the substrate members.

Abstract translation: 电隔离和导热的双面预封装IC部件（20），冲压引线部件（26），漏极焊盘（30），源焊盘（28），栅极流道（35）和MOSFET，IGBT等 位于一对陶瓷基板构件（22,24）之间。 可焊接铜材料层（23,25）直接结合到基板构件的内表面和外表面。