中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

25 records (took 0.012 seconds)

    Ultra-thick thick film on ceramic substrate
    1.
    发明公开
    Ultra-thick thick film on ceramic substrate 审中-公开
    Ultradicke Dickfolie auf Keramiksubstrat

    公开(公告)号：EP2017889A2

    公开(公告)日：2009-01-21

    申请号：EP08157492.3

    申请日：2008-06-03

    Applicant: Delphi Technologies, Inc.

    Inventor： Flederbach, Lynda G. ,  Weed, Rick A. ,  Carter, Bradley H. ,  Gerbsch, Erich W. ,  Isenberg, John, K. ,  Berlin, Carl W.

    IPC: H01L23/498

    CPC classification number: H01L23/49861 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An electrically isolated and thermally conductive double-sided prepackaged integrated circuit component exhibiting excellent heat dissipative properties, durability and strength, and which can be manufactured at a low cost includes electrically insulated and thermally conductive substrate members having outer surfaces, ultra-thick thick film materials secured to the outer surfaces of the substrate members and a lead member and a transistor member positioned between the substrate members.

    Abstract translation: 显示出优异的散热特性，耐久性和强度的电绝缘导热双面预包装集成电路部件，并且可以以低成本制造，包括具有外表面的电绝缘导热基板部件，超厚厚膜材料 固定到基板构件的外表面和引导构件以及定位在基板构件之间的晶体管构件。

    EDGE SEAL FOR ELECTRONICS ASSEMBLY SUITABLE FOR EXPOSURE TO ELECTRICALLY CONDUCTIVE COOLANT
    2.
    发明公开
    EDGE SEAL FOR ELECTRONICS ASSEMBLY SUITABLE FOR EXPOSURE TO ELECTRICALLY CONDUCTIVE COOLANT 审中-公开
    用于电子器件组件的边缘密封，其适合用于暴露于导电的冷却剂

    公开(公告)号：EP2814310A2

    公开(公告)日：2014-12-17

    申请号：EP14171564.9

    申请日：2014-06-06

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

    IPC: H05K7/20

    CPC classification number: H05K7/20927 ,  H05K7/20236 ,  H05K7/20872

    Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly (10). The configuration allows for more direct contact between the electronic device and the coolant (16), while protecting the electronic device from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

    Abstract translation: 一种液体冷却配置为使用导电的冷却剂（16）以冷却功率电子器件做功率电子组件（10）用来与周围的电介质板的外周的金属套筒密封，以形成一个装置组件（10），电介质板。 构造允许所述电子装置和冷却剂（16）之间的更直接的接触，而具有潜在的导电的冷却剂（16）保护所述电子设备从接触。 材料用于形成电介质板与所述壳体（18）被选择为具有象在密封件的可靠性最大化热膨胀（CTE）的系数相似。

    Semiconductor power module with flexible circuit leadframe
    4.
    发明公开
    Semiconductor power module with flexible circuit leadframe 有权
    Halbleiterleistungsmodul，mit flexiblemSchaltungsträgerrahmen

    公开(公告)号：EP2068362A1

    公开(公告)日：2009-06-10

    申请号：EP08163295.2

    申请日：2008-08-29

    Applicant: Delphi Technologies, Inc.

    Inventor： Gerbsch, Erich W. ,  Maple, Robert D. ,  Hayes, Monty B. ,  Campbell, Robert J.

    IPC: H01L25/07 ,  H01L23/538

    CPC classification number: H01L23/36 ,  H01L23/49861 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/072 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

    Abstract: A semiconductor power module (10) includes a semiconductor chip (16) thermally interfaced to a ceramic substrate (20) and a leadframe defined by a flexible circuit (28) disposed intermediate the chip (16) and the ceramic substrate (20). The flexible circuit (28) includes a conductor layer (28a) that is selectively encased in an insulated jacket (28a, 28b) to ensure adequate electrical insulation between the conductor layer (28a) and adjacent conductive surfaces. Preferably, the module (10) is constructed for double side cooling by sandwiching the chip (16) between a pair of ceramic substrates (20, 24) and providing intermediate flexible circuit leadframes (28, 30) on both sides of the chip (16) for electrically accessing the chip terminals (32, 34, 35).

    Abstract translation: 半导体功率模块（10）包括与陶瓷衬底（20）热接口的半导体芯片（16）和由布置在芯片（16）和陶瓷衬底（20）之间的柔性电路（28）限定的引线框架。 柔性电路（28）包括导体层（28a），其被选择性地封装在绝缘护套（28a，28b）中，以确保导体层（28a）与相邻导电表面之间的充分的电绝缘。 优选地，模块（10）通过将芯片（16）夹在一对陶瓷基板（20,24）之间并在芯片（16）的两侧提供中间柔性电路引线框架（28,30）而构造成用于双面冷却 ），用于电接入芯片端子（32,34,35）。

    Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
    5.
    发明公开
    Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness 有权
    一种包装用于集成电路，每个具有在两侧上，并与电路的引线框架具有增加的厚度的基板

    公开(公告)号：EP1564811A2

    公开(公告)日：2005-08-17

    申请号：EP05075241.9

    申请日：2005-01-31

    Applicant: Delphi Technologies, Inc.

    Inventor： Mock, Roger A. ,  Gerbsch, Erich W.

    IPC: H01L23/498

    CPC classification number: H01L23/49833 ,  H01L23/49861 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49222 ,  H01L2924/00

    Abstract: An integrated circuit package (10) includes a first non-conductive substrate (20) having a first inner surface (32) and a second non-conductive substrate (22) having a second inner surface (46). A die (18) having a first thickness (52) is disposed between the first and second inner surfaces. A leadframe (12) includes a member (58) having a proximal end and a distal end. The proximal end has a second thickness (54) less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

    Abstract translation: 一种集成电路封装（10）包括具有第一内表面（32）和具有第二内表面（46）的第二非导电基底（22）的第一非导电基底（20）。 A，（18），具有第一厚度（52）在第一和第二内表面之间设置。 的引线框架（12）包括：具有近端和远端的构件（58）。 该近端具有一个第二厚度（54）小于所述第一厚度。 远端被所述第一和第二内表面之间设置。 被形成波浪形检查没有所述远端具有远端在有效厚度比所述第二厚度大。

    Liquid cooled electronics assembly suitable to use electrically conductive coolant
    6.
    发明公开
    Liquid cooled electronics assembly suitable to use electrically conductive coolant 审中-公开
    液冷式电子组件适合使用导电冷却液

    公开(公告)号：EP2645839A3

    公开(公告)日：2017-04-26

    申请号：EP13160107.2

    申请日：2013-03-20

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

    IPC: H05K7/20

    CPC classification number: H05K7/20927

    Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

    Abstract translation: 一种液冷功率电子组件（10），其被配置为使用导电冷却剂（16）来冷却功率电子设备，该功率电子设备使用围绕介电板的周边用金属密封件密封的介电板以形成设备组件（10），然后 在装置组件（10）和壳体（18）之间形成另一金属密封。 该配置允许电子设备（12）和冷却剂（16）之间更直接的接触，同时保护电子设备（12）不与潜在导电的冷却剂（16）接触。 选择用于形成电介质板和壳体（18）的材料以具有相似的热膨胀系数（CTE），使得密封件的可靠性最大化。

    Fluid cooled semiconductor power module having double-sided cooling
    9.
    发明公开
    Fluid cooled semiconductor power module having double-sided cooling 有权
    FlüssigkeitsgekühltesLeistungshalbleitermodul mit doppelseitigerKühlung

    公开(公告)号：EP2034521A2

    公开(公告)日：2009-03-11

    申请号：EP08163192.1

    申请日：2008-08-28

    Applicant: Delphi Technologies, Inc.

    Inventor： Gerbsch, Erich W.

    IPC: H01L25/07 ,  H01L23/473

    CPC classification number: H01L25/072 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/13055 ,  H01L2924/014 ,  H01L2924/00

    Abstract: A semiconductor power module (10,10') includes one or more semiconductor power devices (70,72) sandwiched between a fluid conducting base (12) and a fluid conducting cover (14a) joined to the base (12). Fluid coolant entering the base (12) diverges into a first flow path through the base (12) and a second parallel flow path through the cover (14a), and then converges and discharges through an outlet (24). The semiconductor devices (70,72) have upper and lower active areas that are thermally coupled to inboard faces of the cover (14a) and base (12) for low double-sided thermal resistance, and the devices (70,72) are electrically accessed through a set of terminals (28,30) formed on the base (12). Multiple sets of semiconductor power devices (70,72) are double-side cooled by joining multiple fluid conducting covers (14a-14f) to the base (12) such that the coolant successively diverges and then re-converges at the locations where each cover (14a-14f) is joined to the base (12). Preferably, the flow paths in both the base (12) and cover (14a) include integral features (50,60) for enhancing the surface area in contact with the coolant.

    Abstract translation: 半导体功率模块（10,10'）包括一个或多个半导体功率器件（70,72），该半导体功率器件（70,72）夹在流体导电基座（12）和连接到基座（12）的流体导电罩（14a）之间。 进入基座（12）的流体冷却剂通过底座（12）和穿过盖子（14a）的第二平行流动路径分叉进入第一流动路径，然后通过出口（24）收敛和排出。 半导体器件（70,72）具有热耦合到盖（14a）和底座（12）的内表面的上和下有源区域，用于低双面热阻，并且器件（70,72）是电 通过形成在基座（12）上的一组端子（28,30）来访问。 多组半导体功率器件（70,72）通过将多个流体导电盖（14a-14f）接合到基座（12）而被双面冷却，使得冷却剂依次发散并随后在每个盖 （14a-14f）连接到基座（12）。 优选地，基部（12）和盖（14a）中的流动路径包括用于增强与冷却剂接触的表面积的整体特征（50,60）。

Patent Agency Ranking