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    VACUUM INSULATED GLASS WINDOWS WITH GLASS DUMP SPACERS
    21.
    发明公开
    VACUUM INSULATED GLASS WINDOWS WITH GLASS DUMP SPACERS 审中-公开
    VAKUUMISOLIERTE GLASFENSTER MITGLASSTOSSDISTANZSTÜCKEN

    公开(公告)号：EP3088625A1

    公开(公告)日：2016-11-02

    申请号：EP16169071.4

    申请日：2009-11-04

    申请人： Corning Incorporated

    发明人： GRZYBOWSKI, Richard R ,  HARVEY, Daniel R ,  GUNOV, Stephan L ,  RICOULT, Daniel L ,  STRELTSOV, Alexander M

    IPC分类号： E04B2/44 ,  E06B3/663

    CPC分类号： E06B3/66304 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/53 ,  B23K26/57 ,  C03B23/0086 ,  C03B23/02 ,  C03B2215/414 ,  C03C23/0025 ,  E06B3/6612 ,  Y02A30/25 ,  Y02B80/24 ,  Y10T428/24182

    摘要： Vacuum-insulated glass (VIG) windows (10) that employ glass-bump spacers (50) and two or more glass panes (20) are disclosed. The glass-bump spacers are formed in the surface (24) of one of the glass panes (20) and consist of the glass material from the body portion (23) of the glass pane. Thus, the glass-bump spacers are integrally formed in the glass pane, as opposed to being discrete spacer elements that need to be added and fixed to the glass pane. Methods of forming VIG windows are also disclosed. The methods include forming the glass-bump spacers by irradiating a glass pane with a focused beam (112F) from a laser (110). Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. The process is repeated at different locations in the glass pane to form an array of glass-bump spacers. A second glass pane is brought into contact with the glass-bump spacers, and the edges (28F, 28B) sealed. The resulting sealed interior region (40) is then evacuated to a vacuum pressure of less than one atmosphere.

    摘要翻译： 公开了采用玻璃凸块间隔件（50）和两个或多个玻璃板（20）的真空绝热玻璃（VIG）窗（10）。 玻璃凸块间隔件形成在一个玻璃板（20）的表面（24）中并由来自玻璃板的主体部分（23）的玻璃材料组成。 因此，玻璃凸块间隔件一体地形成在玻璃板中，而不是需要添加并固定到玻璃板上的离散间隔元件。 还公开了形成VIG窗的方法。 所述方法包括通过用来自激光器（110）的聚焦光束（112F）照射玻璃板来形成玻璃凸块间隔物。 玻璃中的加热效应导致玻璃局部膨胀，从而形成玻璃凸块间隔物。 在玻璃板中的不同位置处重复该过程以形成玻璃凸起间隔物的阵列。 第二玻璃板与玻璃凸块间隔件接触，边缘（28F，28B）被密封。 然后将得到的密封内部区域（40）抽真空至小于一个大气压的真空压力。

    Processing of material using elongated laser beams
    22.
    发明授权
    Processing of material using elongated laser beams 有权
    使用细长激光束加工材料

    公开(公告)号：EP2965853B1

    公开(公告)日：2016-09-21

    申请号：EP14176292.2

    申请日：2014-07-09

    申请人： High Q Laser GmbH

    发明人： Matylitsky, Victor V. ,  Hendricks, Frank

    IPC分类号： B23K26/073 ,  B23K26/00 ,  B23K26/06 ,  B23K26/40

    CPC分类号： B23K26/53 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/0736 ,  B23K26/38 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/56 ,  C03B33/0222 ,  C03B33/04 ,  Y02P40/57

    摘要： Method for processing of material by use of a pulsed laser, comprising generating a series of ultra-short laser pulses (22),directing each laser pulse (22) to the material with defined reference to a respectively assigned processing point (26) of a processing path (25), and focussing each laser pulse (22) so that respective focal points of the focussed laser pulses (22) comprise pre-defined spatial relations to a first surface (2) of the material, wherein each emitted laser pulse (22) effects a respective crack (24) within the material. According to the invention, each laser pulse is shaped regarding its beam profile so that a cross sectional area, which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of asymmetric shape and defines a main extension axis (A) as to its asymmetric extension. One major crack (24) is effected by each laser pulse (22), the major crack (12,24) having a lateral extension basically oriented according to the main extension axis (A) of the respective pulse in the focal point. Furthermore, each laser pulse (22) is emitted so that the orientation of its main extension axis (A) in the focal point corresponds to a pre-defined orientation relative to an orientation of a respective tangent to the processing path (25) at the assigned processing point (26)

    LASER PROCESSING METHOD AND LASER PROCESSING PROGRAM CREATION DEVICE
    23.
    发明公开
    LASER PROCESSING METHOD AND LASER PROCESSING PROGRAM CREATION DEVICE 审中-公开
    紫外线激光紫外线激光紫外线激光雷达

    公开(公告)号：EP2998809A1

    公开(公告)日：2016-03-23

    申请号：EP14798078.3

    申请日：2014-01-22

    申请人： Amada Holdings Co., Ltd.

    发明人： OOTSU, Takaaki

    IPC分类号： G05B19/4093 ,  B23K26/00 ,  B23K26/38

    CPC分类号： B23K26/38 ,  B23K26/08 ,  B23K26/53 ,  B23K26/702 ,  B23K2101/28 ,  B23K2103/04 ,  G05B19/4093 ,  G05B19/4097 ,  G05B2219/40416 ,  G05B2219/45041 ,  Y02P90/265

    摘要： CAM (20) sets an evaluation region in an adjacent plane to a target plane; calculates the position of the extremity of the product profile in the axial direction within the evaluation region; sets a first line segment passing through the position of the extremity and extending orthogonally to the axis in the target plane; locates a processing area in the range surrounded by the first line segment, a second line segment, and the product profile, the second line segment extending in the axial direction from an end of the first line segment to the product profile; allocates a trajectory for laser beam cutting to form a notch or a hole in the processing area; and allocates a trajectory for laser beam cutting to cut the material along the product profile. This can normally perform even cut-off processing of the material.

    摘要翻译： CAM（20）将相邻平面中的评估区域设置为目标平面; 在评估区域内计算产品型材在轴向方向上的位置; 设置通过所述末端位置并与所述目标平面中的轴正交延伸的第一线段; 定位在由第一线段，第二线段和产品型材包围的范围内的处理区域，第二线段沿轴向从第一线段的端部延伸到产品型材; 分配用于激光束切割的轨迹，以在处理区域中形成凹口或孔; 并分配激光束切割的轨迹，以沿着产品型材切割材料。 这通常可以进行材料的均匀切断处理。

    Processing of material using asymmetric laser beams
    24.
    发明公开
    Processing of material using asymmetric laser beams 有权
    Bearbeitung von Material unter Verwendung gestreckter Laserstrahlen

    公开(公告)号：EP2965853A1

    公开(公告)日：2016-01-13

    申请号：EP14176292.2

    申请日：2014-07-09

    申请人： High Q Laser GmbH

    发明人： Matylitsky, Victor V. ,  Hendricks, Frank

    IPC分类号： B23K26/073 ,  B23K26/00 ,  B23K26/06 ,  B23K26/40

    CPC分类号： B23K26/53 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/0736 ,  B23K26/38 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/56 ,  C03B33/0222 ,  C03B33/04 ,  Y02P40/57

    摘要： Method for processing of material by use of a pulsed laser, comprising generating a series of ultra-short laser pulses (22),directing each laser pulse (22) to the material with defined reference to a respectively assigned processing point (26) of a processing path (25), and focussing each laser pulse (22) so that respective focal points of the focussed laser pulses (22) comprise pre-defined spatial relations to a first surface (2) of the material, wherein each emitted laser pulse (22) effects a respective crack (24) within the material. According to the invention, each laser pulse is shaped regarding its beam profile so that a cross sectional area, which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of asymmetric shape and defines a main extension axis (A) as to its asymmetric extension. One major crack (24) is effected by each laser pulse (22), the major crack (12,24) having a lateral extension basically oriented according to the main extension axis (A) of the respective pulse in the focal point. Furthermore, each laser pulse (22) is emitted so that the orientation of its main extension axis (A) in the focal point corresponds to a pre-defined orientation relative to an orientation of a respective tangent to the processing path (25) at the assigned processing point (26)

    摘要翻译： 一种通过使用脉冲激光来处理材料的方法，包括产生一系列超短激光脉冲（22），将每个激光脉冲（22）引导到所述材料上，所述激光脉冲定义参考分配的处理点（26） 处理路径（25），并且聚焦每个激光脉冲（22），使得聚焦的激光脉冲（22）的各个焦点包括与材料的第一表面（2）的预定的空间关系，其中每个发射的激光脉冲 22）在材料内产生相应的裂纹（24）。 根据本发明，每个激光脉冲关于其光束轮廓成形，使得由其激光脉冲在其焦点上与其传播方向垂直的横截面限定的横截面面积是不对称形状并且限定主体 延伸轴（A）对其不对称延伸。 一个主要裂纹（24）由每个激光脉冲（22）实现，主裂纹（12,24）具有根据焦点中相应脉冲的主延伸轴（A）基本取向的横向延伸。 此外，发射每个激光脉冲（22），使得其焦点中其主延伸轴线（A）的取向对应于相对于处理路径（25）的相应切线的取向的预定义取向 指定处理点（26）