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公开(公告)号：EP1836546B1
公开(公告)日：2018-08-08
申请号：EP05805778.7
申请日：2005-10-24
申请人： PETRUZZI, Vasco
摘要： A pyramidal case for computer, with a square base includes a support on a box, with a rectangular rear section and a trapezoidal front section, which dissipates the heat with greater efficiency and effectiveness, through obliged paths of the air flows which amplify the natural thermodynamics of the warm air masses. The study and the coercion of the air flows, applied to this invention, allow a greater dissipation of the heat with respect to any other existing case, which bases the cooling on directional air flows towards each component, but that inside the case itself, become chaotic and poorly efficient in the management of the whole generated heat.
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公开(公告)号：EP3345078A1
公开(公告)日：2018-07-11
申请号：EP16842594.0
申请日：2016-08-22
申请人： Apple Inc.
发明人： SMITH, Samuel Gilkison , COSTER, Daniel J. , CORBIN, Sean S. , KUNA, Melody L. , HEGDE, Siddhartha , COUSINS, Benjamin A. , MURPHY, Robert Sean
IPC分类号： G06F3/02
CPC分类号： G06F1/1628 , G06F1/1615 , G06F1/1654 , G06F1/1656 , G06F1/1669 , G06F1/1681 , G06F1/20 , G06F2200/1633
摘要： An accessory device for use with an electronic device is disclosed. The accessory device may include a cover configured to overlay an electronic device (or device) or fold to form a support structure for the electronic device. The cover may include an attachment feature that electrically couples with the device, and a keyboard foldable with respect to the cover. Further, the keyboard may include a retention feature designed to receive the attachment feature in a folded configuration of the cover. The accessory device may further include an electrically conductive fabric that folds with the cover. The accessory device may include an array of magnets throughout the attachment feature, the cover, and the keyboard. The magnets may be used to magnetically couple together 1) segments of the cover, 2) the cover and the keyboard assembly, 3) and/or the device with the cover.
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公开(公告)号：EP2485110B1
公开(公告)日：2018-07-11
申请号：EP10819819.3
申请日：2010-05-12
申请人： ZTE Corporation
发明人： MENG, Yanni , RONG, Hui , LIU, Mingming , ZHOU, Baohang , WEI, Shuwang , TENG, Lingqiao
CPC分类号： H05K7/20209 , G05D23/1912 , G06F1/20 , G06F1/206
摘要： A fan type temperature control method and device are provided in the invention. The device includes a fan unit, power supplies (v1,v2) and a fan control unit. The fan unit includes a plurality of fans, and the fan unit cools an apparatus to be cooled. The power supplies (v1,v2) supply power for the fans in the fan unit. The fan control unit controls the fans as follows: when the temperature t of the apparatus to be cooled is lower than the critical temperature t1 of a first temperature detect switch (k01), all the fans stop; when t is higher than the temperature t1 and lower than the critical temperature t2 of a second temperature detect switch (k02), all the fans rotate at half speed; when t is higher than t2 while lower than the critical temperature t3 of a third temperature detect switch (k03), a first fan part (M1) rotates at full speed and a second fan part (M2) stops; when t is higher than t3, all the fans rotate at full speed.
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公开(公告)号：EP3005019B1
公开(公告)日：2018-05-30
申请号：EP14807885.0
申请日：2014-06-05
申请人： Apple Inc.
发明人： DEGNER, Brett W. , KALINOWSKI, Caitlin Elizabeth , KOSOGLOW, Richard D. , BANKO, Joshua D. , NARAJOWSKI, David H. , BERK, Jonathan L. , LECLERC, Michael E. , MCBROOM, Michael D. , IQBAL, Asif , MICHELSEN, Paul S. , SIN, Mark K. , BAKER, Paul A. , SONTAG, Harold L. , YUEN, Wai Ching , CASEBOLT, Matthew P. , FETTERMAN, Kevin S. , CALKINS, Alexander C. , MCBROOM, Daniel L.
摘要： An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：EP3314358A1
公开(公告)日：2018-05-02
申请号：EP16736330.8
申请日：2016-06-23
发明人： PETERSON, Eric C. , CUTLER, Benjamin F. , WHITAKER, Norman Ashton, Jr. , JOHNSON, Peter , FLEMING, Alexander Jacques , TUCKERMAN, David Bazeley
CPC分类号： H05K7/20709 , A01K29/005 , A01K61/10 , A01K67/033 , F24F5/0046 , F25D1/02 , F28D1/022 , F28D15/00 , F28D2021/0028 , G06F1/20 , G06F21/554 , G06F2221/034 , G08B13/2491 , H05K7/1495 , H05K7/1497 , H05K7/20236 , H05K7/20263 , H05K7/20745 , H05K7/2079 , H05K7/20836
摘要： In one example, a portion of a shell includes a shell wall portion that has an interior wall portion and an exterior wall portion located near the interior wall portion. In addition, fluid passageways are disposed between the interior wall portion and the exterior wall portion. One or more of the fluid passageways are defined in part by one or both of the interior wall portion and the exterior wall portion. The fluid passageways form part of heat exchanger that is integrated in the shell.
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公开(公告)号：EP3005020B1
公开(公告)日：2018-05-02
申请号：EP14808192.0
申请日：2014-06-05
申请人： Apple Inc.
发明人： DEGNER, Brett W. , PRATHER, Eric R. , NARAJOWSKI, David H. , LIANG, Frank F. , NIGEN, Jay S. , DYBENKO, Jesse T. , DUKE, Connor R. , WHANG, Eugene A. , STRINGER, Christopher J. , BANKO, Joshua D. , KALINOWSKI, Caitlin Elizabeth , BERK, Jonathan L. , CASEBOLT, Matthew P. , FETTERMAN, Kevin S. , WEIRSHAUSER, Eric J.
摘要： The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
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公开(公告)号：EP3295275A4
公开(公告)日：2018-04-18
申请号：EP16793222
申请日：2016-05-05
发明人： GOH ENG LIM , DONLIN PATRICK , WARNER ANDREW
CPC分类号： G06F1/20 , G06F1/206 , G06F1/324 , G06F2200/201 , H05K7/20836 , Y02D10/126 , Y02D10/16
摘要： An apparatus and method thermally manage a high performance computing system having a plurality of nodes with microprocessors. To that end, the apparatus and method monitor the temperature of at least one of a) the environment of the high performance computing system and b) at least a portion of the high performance computing system. In response, the apparatus and method control the processing speed of at least one of the microprocessors on at least one of the plurality of nodes as a function of at least one of the monitored temperatures.
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28.发明公开LIQUID-COOLED COOLER, AND MANUFACTURING METHOD FOR RADIATING FIN IN LIQUID-COOLED COOLER 审中-公开液冷式冷却器及液冷式冷却器散热片的制造方法
公开(公告)号：EP3306659A1
公开(公告)日：2018-04-11
申请号：EP15894191.4
申请日：2015-06-03
发明人： SAKATA Kazuki , SAKAI Masasi , TAMURA Masayosi , HAGA Seiji
IPC分类号： H01L23/473 , H01L23/36 , H01L23/373 , H01L25/07 , H01L25/18 , H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/15 , H01L23/3731 , H01L23/3736 , H01L23/473 , H01L25/072 , H05K7/20254 , H05K7/2039
摘要： There is provided a heat sink in which the thermal resistance from a portion where the heat sink directly or indirectly makes contact with a heat-generating device to a portion where the heat sink makes contact with a coolant is set to be a value that is different from the thermal resistance at a different position in the flowing direction of the coolant, so that it is made possible to suppress the temperature difference between the upstream end and the downstream end of the heat-generating device.
摘要翻译： 提供了一种散热器，其中从散热器直接或间接与发热器件接触的部分到散热器与冷却剂接触的部分之间的热阻设定为不同的值 从在冷却剂的流动方向上的不同位置处的热阻，从而可以抑制发热装置的上游端和下游端之间的温度差。
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公开(公告)号：EP3299928A1
公开(公告)日：2018-03-28
申请号：EP17194131.3
申请日：2012-08-27
申请人： OVH
发明人： KLABA, Miroslaw
CPC分类号： G06F1/20 , G06F1/16 , H05K7/1497 , H05K7/20745
摘要： Conteneur aménagé ( 1 ) en une infrastructure technique comprenant
- sur une face latérale longitudinale, au moins une ouverture ( 2 ) agencée pour permettre l'entrée d'air vers l'intérieur du conteneur ( 1 );
- sur la face latérale longitudinale opposée, au moins un ventilateur ( 3 ) agencé pour ressortir l'air de l'intérieur vers l'extérieur du conteneur ( 1 );
- des baies informatiques ( 5 ) disposées au milieu du conteneur ( 1 ) le long de son axe longitudinal.摘要翻译： （1）设置在技术基础设施中，该技术基础设施包括： - 在纵向侧面上，设置有至少一个开口（2），该开口用于允许空气进入容器（1）; - 在相对的纵向侧面上，设置有至少一个风扇（3），用于将空气从容器（1）的内部排出到外部; 计算机机架（5）沿着其纵向轴线布置在容器（1）的中间。
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公开(公告)号：EP3295275A2
公开(公告)日：2018-03-21
申请号：EP16793222
申请日：2016-05-05
发明人： GOH ENG LIM , DONLIN PATRICK , WARNER ANDREW
CPC分类号： G06F1/20 , G06F1/206 , G06F1/324 , G06F2200/201 , H05K7/20836 , Y02D10/126 , Y02D10/16
摘要： An apparatus and method thermally manage a high performance computing system having a plurality of nodes with microprocessors. To that end, the apparatus and method monitor the temperature of at least one of a) the environment of the high performance computing system and b) at least a portion of the high performance computing system. In response, the apparatus and method control the processing speed of at least one of the microprocessors on at least one of the plurality of nodes as a function of at least one of the monitored temperatures.
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