公开(公告)号：EP1324294A3

公开(公告)日：2006-01-11

申请号：EP02028871.8

申请日：2002-12-23

申请人： CANON KABUSHIKI KAISHA

发明人： Tajima, Hisao, c/oCanon Kabushiki Kaisha

IPC分类号： G09F7/18 ,  G09F9/30 ,  G09F9/00 ,  H01J17/49 ,  H01J17/28

CPC分类号： G09F7/18 ,  Y10T29/49821 ,  Y10T29/53274 ,  Y10T156/1059 ,  Y10T156/11 ,  Y10T156/1132 ,  Y10T156/1184 ,  Y10T156/1189

摘要： The invention provides a disassembling method for an image display apparatus, a producing method for an image display apparatus, a producing method for a support member and an image display unit, and a producing method for a working material. In particular, there is disclosed a configuration in which the disassembling of the image display apparatus is executed by inserting a substance between the image display unit and the support member.

公开(公告)号：EP1424180A4

公开(公告)日：2004-09-15

申请号：EP02705318

申请日：2002-03-19

申请人： NAT INST OF ADVANCED IND SCIEN

发明人： YASUE KAZUO ,  YAMADA YASUO

IPC分类号： H05B6/10 ,  B09B5/00 ,  B26D1/00 ,  B29B17/02 ,  C08J11/12 ,  B29B17/00

CPC分类号： B26D3/005 ,  B29B17/021 ,  B29B17/0412 ,  B29C2035/0811 ,  B29K2021/00 ,  B29K2705/12 ,  B29L2030/00 ,  Y02P70/183 ,  Y02W30/622 ,  Y02W30/625 ,  Y02W30/68 ,  Y10S156/939 ,  Y10T156/1153 ,  Y10T156/1189 ,  Y10T156/1972

摘要： A method for removing metal wires in a tire through induction heating, a method for collecting metal wires and rubber parts, and a method for reusing them. The method for removing metal wires mixed into a tire by utilizing induction heating is characterized in that metal wires in the tire are heated by induction heating, rubber part touching the metal wires is decomposed and gasified and separated from the metal wires which are then removed. A method for collecting metal wires in the tire and the rubber part using that method, and a method for reusing the collected metal wires and the rubber part as metal and rubber resources are also provided. Metal wires and rubber part can be separated from a waste tire, collected at a high collection rate and reused.

公开(公告)号：EP0761416A3

公开(公告)日：1997-06-11

申请号：EP96113587.8

申请日：1996-08-24

申请人： FUJI JUKOGYO KABUSHIKI KAISHA

发明人： Yamamoto, Hiroshi ,  Takahashi, Koji

IPC分类号： B29C63/00 ,  B29B17/02

CPC分类号： B29C63/0013 ,  B29B17/02 ,  B29K2023/12 ,  B29K2075/00 ,  B29L2009/005 ,  B29L2017/005 ,  B29L2031/3055 ,  Y02W30/622 ,  Y10T29/49819 ,  Y10T29/53683 ,  Y10T156/1189 ,  Y10T156/1972

摘要： A film peeling and removing apparatus is provided for peeling or removing a film from a resin material of a coated resin member of a coated resin product. The film peeling apparatus includes a resin-material-side roll, a film-side roll and a third roll. The film-side roll rotates at a higher peripheral speed than that of the resin-material-side roll. The film-side roll is associated with the resin-material-side roll for rolling the coated resin member therebetween while applying a shearing stress between the film and the resin material so as to peel the film from the resin material. Then, the resin material is fed between the resin-material-side roll and the third roll while being curved along the roll surface of the resin-material-roll. The third roll is associated with the resin-material-side roll for rolling the fed resin material therebetween while applying a shearing stress between a residual film and the resin material so as to peel the residual film from the resin material.

公开(公告)号：EP0478774A4

公开(公告)日：1992-09-09

申请号：EP90905742

申请日：1990-03-22

申请人： ODESSKY GOSUDARSTVENNY UNIVERSITET

发明人： GITELMAN, ALEXANDR ISAAKOVICH

IPC分类号： B29B17/02 ,  B29C35/08 ,  B29K21/00 ,  B29K105/22

CPC分类号： B29B17/021 ,  B29B17/02 ,  B29B2017/0496 ,  B29C35/0805 ,  B29K2021/00 ,  B29K2705/00 ,  B29L2030/00 ,  Y02W30/622 ,  Y02W30/625 ,  Y02W30/68 ,  Y10S156/928 ,  Y10S264/912 ,  Y10T29/49757 ,  Y10T156/1189

摘要： A method for extraction of metal reinforcement from rubber tyres provides for placing the tyre with a metal reinforcement into a high-frequency electromagnetic field, heating it and separating the metal reinforcement from the rubber. A reduction of power consumption and enlarging of technological possibilities of the method are achieved due to squeezing between rollers a local section of the tyre, subsequently heating it up to the temperature of pyrolysis of the rubber layers neighbouring the reinforcement so as to provide for a pyrolytic swelling and then pulling the tyre between said rollers.

公开(公告)号：EP0214514A2

公开(公告)日：1987-03-18

申请号：EP86111466.8

申请日：1986-08-19

申请人： International Business Machines Corporation

发明人： Burns, Richard W.

IPC分类号： G03B41/00 ,  G03F1/00

CPC分类号： G03F7/707 ,  Y10S156/93 ,  Y10S438/942 ,  Y10S438/945 ,  Y10T29/49821 ,  Y10T29/53274 ,  Y10T156/1179 ,  Y10T156/1189 ,  Y10T156/19

摘要： An apparatus 10 for removing a mask 11 which extends beyond the outer edges of a semiconductor wafer 12 bonded thereto. The apparatus includes a base 22 having a vacuum chamber 26 opening onto the upper surface of the base, a vacuum valve 20 separating the vacuum chamber 26 from a vacuum source 21, an actuating lever 16 and a mask discharge facilitator 27. The discharge facilitator 27 comprises a horizontal plate 19 having a plurality of vertical pins 18 around the periphery thereof. When the lever 16 is actuated, it opens the vacuum valve and lifts the discharge facilitator forcing the vertical pins 18 into contact with the mask 11. The simultaneous application of the vacuum holding force, and vertical force applied by the pins causes the separation of the mask from the upper surface of the wafer.

公开(公告)号：EP1899766B1

公开(公告)日：2012-04-11

申请号：EP06734610.6

申请日：2006-02-09

申请人： MacDermid Printing Solutions, LLC

发明人： MARKHART, Gary T. ,  ROSHELLI, Albert, Jr.

IPC分类号： G03C1/00 ,  G03F7/00

CPC分类号： G03F7/36 ,  Y10T156/1189 ,  Y10T156/1705 ,  Y10T156/1734

摘要： An improved apparatus and a method of using the apparatus to remove non- crosslinked photopolymer from an imaged and exposed surface of a relief image printing element. Included are means for supporting and rotating the printing element, means for softening and/or melting non-crosslinked photopolymer on the imaged and exposed surface of the printing element, and at least one thermal developing assembly. The thermal developing assembly includes means for supplying an absorbent material that is contactable with the printing element, and that is capable of removing at least a portion of the softened and/or melted non-crosslinked photopolymer, and means for causing the absorbent material to contact at least a portion of the printing element. The absorbent material is backed with an endless impression belt that is supported by a plurality of rollers. When the absorbent material contacts the surface of the printing element, softened and/or melted non-crosslinked photopolymer on the surface of the printing element is removed.

公开(公告)号：EP2422357A1

公开(公告)日：2012-02-29

申请号：EP10712355.6

申请日：2010-03-31

申请人： EV Group GmbH

发明人： WIMPLINGER, Markus ,  LINDNER, Paul

IPC分类号： H01L21/00

CPC分类号： B32B38/10 ,  B32B43/006 ,  H01L21/67092 ,  H01L21/67132 ,  Y10T156/1105 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/19 ,  Y10T156/1906 ,  Y10T156/1972

摘要： A device for separating a substrate from a carrier substrate bonded to the substrate by a bonding layer, with a carrier substrate receptacle with a receiving surface for receiving the carrier substrate, a substrate receptacle, arranged opposite the carrier substrate receptacle, with a substrate receiving surface that can be arranged parallel to the first-mentioned receiving surface and is intended for receiving the substrate, wherein separating means are provided for the parallel displacement of the substrate with respect to the carrier substrate in a bonded state of the substrate and the carrier substrate. Furthermore, the invention relates to a method for separating a substrate from a carrier substrate bonded to the substrate by a bonding layer with the following steps: receiving a bonded substrate/carrier-substrate assembly comprising the carrier substrate, the bonding layer and the substrate, between a substrate receiving surface of a substrate receptacle and a receiving surface of a carrier substrate receptacle that can be arranged parallel to the substrate receiving surface and separation of the substrate from the carrier substrate by parallel displacement of the substrate with respect to the carrier substrate in a bonded state of the substrate and the carrier substrate.

摘要翻译： 用于通过互连层与衬底分离衬底与装置衬底的装置。 该装置包括具有用于保持载体衬底的保持表面的载体衬底保持器和与载体衬底保持器相对定位的衬底保持器，衬底保持表面可平行于容纳衬底的保持表面定位。 在衬底和载体衬底的互连状态下，存在用于平行移动衬底相对于载体衬底的分离装置。

公开(公告)号：EP1899766A4

公开(公告)日：2010-09-29

申请号：EP06734610

申请日：2006-02-09

申请人： MACDERMID PRINTING SOLUTIONS

发明人： MARKHART GARY T ,  ROSHELLI ALBERT JR

IPC分类号： G03C1/00 ,  G03F7/00

CPC分类号： G03F7/36 ,  Y10T156/1189 ,  Y10T156/1705 ,  Y10T156/1734

公开(公告)号：EP2109576A1

公开(公告)日：2009-10-21

申请号：EP08713140.5

申请日：2008-01-15

申请人： Eastman Kodak Company

发明人： GROMADZKI, Jo Anna Laraine ,  WIGHT, Martin Clifford

IPC分类号： B65H3/44 ,  B65H3/40 ,  B65H31/00

CPC分类号： B65H3/44 ,  B65H3/06 ,  B65H3/0816 ,  B65H3/38 ,  B65H3/40 ,  B65H2405/33 ,  B65H2405/35 ,  B65H2405/361 ,  B65H2405/52 ,  B65H2701/18264 ,  B65H2701/1928 ,  Y10T156/11 ,  Y10T156/1189

摘要： The present invention provides a method and apparatus for storing a slip-sheet (40) removed from a stack of interleaved slip-sheets and printing plates (17). A materials handling system (70) seperates a slip-sheet from a media stack that includes image recordable materials. A slip-sheet seperates each of the image recordable materials from one another in the media stack. The slip-sheets removed from the stack are stored in a moveable slip-sheet holder (26).

公开(公告)号：EP1469981B1

公开(公告)日：2009-03-18

申请号：EP03712201.7

申请日：2003-01-02

申请人： S.O.I.Tec Silicon on Insulator Technologies

发明人： RAYSSAC, Olivier ,  LETERTRE, Fabrice

IPC分类号： B28D5/00

CPC分类号： H01L21/76254 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0052 ,  B28D5/0064 ,  H01L21/2007 ,  Y10T29/53274 ,  Y10T83/0267 ,  Y10T83/04 ,  Y10T83/364 ,  Y10T156/1059 ,  Y10T156/1184 ,  Y10T156/1189 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1972 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/30 ,  Y10T225/307 ,  Y10T225/35 ,  Y10T225/386

摘要： The invention concerns a device for automatic high-precision cutting of a material layer (20a) which is integral with a source substrate (20b) via a weakened zone (200c), the source substrate and the layer to be cut forming together an assembly to be cut (20), the device comprising cutting means (101, 102) as well as means for retaining (100a, 100b) the assembly to be cut. The invention is characterized in that the retaining means are designed for controlled displacement so as to accompany actively the divergence and/or the deformation of each part of the assembly to be cut, and to rectify said divergence and/or said deformation. The invention also concerns a corresponding automatic cutting method.