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21.发明公开ELECTRONIC COMPONENT HAVING TIN RICH DEPOSIT LAYER AND THE PROCESS FOR DEPOSITING THE SAME 审中-公开与斯恩·里奇分离层和分离及其方法电子器材
公开(公告)号：EP1774065A1
公开(公告)日：2007-04-18
申请号：EP05758835.2
申请日：2005-07-04
发明人： YU, Chengfu, Philips Electronics Industries Ltd. , CHEN, Chia-Chun, Philips Electronics Ind. Ltd. , OBERNDORFF, Pascal , HSIEH, Ker-Chang, Philips Electronics Ind. Ltd.
IPC分类号： C25D3/32
CPC分类号： C25D3/32 , H01L2924/0002 , H05K3/244 , Y10T428/12014 , Y10T428/12708 , Y10T428/12715 , H01L2924/00
摘要： The invention relates to an electronic component with Sn rich deposit layer on the part for electric connection, wherein the Sn rich deposit layer is a fine grained Sn rich deposit layer composed of grains with smaller size in the direction perpendicular to the deposit surface than in the direction parallel to the deposit surface. It also relates to a process for plating an electronic component, so as to form a Sn rich deposit layer on the part for electric connection, comprising the steps of: adjusting the composition of tin plating solution in which starter additive and brighter additive are included; moving the electronic component through the tin plating solution, so as to form a fine grained Sn rich deposit layer on the part for electric connection. As compared with the prior art, the invention can validly inhibit the whisker growth with low cost and reliable property.
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公开(公告)号：EP1591563A4
公开(公告)日：2006-04-05
申请号：EP04704363
申请日：2004-01-22
发明人： MASUDA AKIHIRO , KOHINATA MASAYOSHI , OBATA KEIGO , YOSHIMOTO MASAKAZU , TSUJI KIYOTAKA , UCHIDA EI , ORI KEIJI , EIKAWA MASAHIRO
摘要： The present invention provides a tin-containing plating bath comprising: (a) a soluble stannous salt, or a mixture of a soluble stannous salt and at least one soluble salt selected from the group consisting of copper salts, bismuth salts, silver salts, indium salts, zinc salts, nickel salts, cobalt salts and antimony salts; and (b) at least one aliphatic sulfonic acid selected from the group consisting of alkanesulfonic acids and alkanolsulfonic acids, the aliphatic sulfonic acid being a purified aliphatic sulfonic acid in which the total amount of sulfur-containing compounds as impurities consisting of compound(s) containing one or more sulfur atoms with an oxidation number of +4 or less in the molecule and compound(s) containing one or more sulfur atoms and one or more chlorine atoms in the molecule is a minute amount or less. A tin or tin alloy plating film with excellent reflowability, film appearance, etc. can be formed by the use of this plating bath.
摘要翻译： 本发明涉及一种含锡电镀液，其含有（a）可溶性亚锡盐或至少一种选自铜盐，铋盐，银盐，铟盐，锌盐，镍盐，钴 盐和锑盐和可溶亚锡盐，和（b）至少一种选自链烷磺酸和链烷醇磺酸的脂族磺酸，其特征在于所述脂族磺酸是纯化的，其中杂质硫化合物的量由 在其分子中具有氧化数+ IV或更小的硫原子的化合物和其分子中具有硫原子和氯原子的化合物是微量或更少的。 通过使用该镀浴，可以形成回流性，膜外观等优异的镀锡膜或锡合金镀膜。
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23.发明公开Tin or Tin alloy electroplating on composite substrates 有权Zinnlegierung Elektroplattierung auf Verbundwerkstoffe
公开(公告)号：EP1514956A1
公开(公告)日：2005-03-16
申请号：EP04254463.5
申请日：2004-07-27
CPC分类号： H05K3/244 , C25D3/32 , C25D3/60 , H05K1/0306
摘要： An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.
摘要翻译： 用于在复合基板上选择性地沉积锡或锡合金膜的电解质。 还描述了在复合衬底上沉积锡或锡合金的方法。
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公开(公告)号：EP1432848A1
公开(公告)日：2004-06-30
申请号：EP02759235.1
申请日：2002-08-01
发明人： CROTTY, David
摘要： A composition and process for electroplating tin or tin alloys onto a substrate at relatively high current densities. The electrolyte comprises toluene sulfonic acid and a source of ammonium ions and/or magnesium ions. The process is particularly suited to high speed reel to reel or strip steel plating.
摘要翻译： 以相对高的电流密度将锡或锡合金电镀到基材上的组合物和方法。 电解质包含甲苯磺酸和铵离子和/或镁离子的来源。 该工艺特别适用于高速卷轴或带钢镀层。
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公开(公告)号：EP1116804A3
公开(公告)日：2004-01-28
申请号：EP00309300.2
申请日：2000-10-23
发明人： Tamura, Takaaki , Tsunoda, Kyoko
摘要： A tin/indium alloy plating solution not containing any cyanide and serving as a substitute for tin/lead alloy plating is provided. The tin/indium alloy plating solution is a weakly alkaline aqueous solution for tin/indium alloy electroplating, prepared by adding, as metal salts, a tetravalent tin salt of metastannic acid and a trivalent indium salt of an organosulfonic acid, further adding a chelating agent, and adjusting the pH of the aqueous solution to a value of 7 to 11 with a caustic alkali.
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26.发明公开Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions 审中-公开通过氧化在锡或锡合金电镀锡限制的损失
公开(公告)号：EP1342817A2
公开(公告)日：2003-09-10
申请号：EP03251352.5
申请日：2003-03-04
申请人： Shipley Co. L.L.C.
IPC分类号： C25D3/32
CPC分类号： C25D3/32
摘要： Provided for is a solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid; an organic sulfonic acid, a mineral acid, or a combination thereof; divalent tin ions; and an antioxidant comprising a hydroxy benzene sulfonic acid or salt thereof, in an amount effective to prevent the oxidation of divalent tin ions. Also provided for is a method for electroplating comprising electroplating a substrate using an electroplating solution comprising a hydroxy benzene sulfonic acid or salt thereof in an amount effective to decrease the oxidation of tin ions.
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公开(公告)号：EP1086262A4
公开(公告)日：2002-01-02
申请号：EP00915016
申请日：2000-03-17
IPC分类号： C25D3/02 , C25D3/32 , C25D3/04 , C25D3/12 , C25D3/20 , C25D3/22 , C25D3/26 , C25D3/30 , C25D3/34 , C25D3/38 , C25D3/50 , C25D3/56
摘要： The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in various types of electroplating baths (e.g., sulfate, sulfonic acid, fluoroborate, and halide baths) has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability.
摘要翻译： 使用烷基和链烷醇磺酸的碱金属，碱土金属，铵和取代的铵盐作为各种类型的电镀浴（例如硫酸盐，磺酸，氟硼酸盐和卤化物浴）中的添加剂具有许多意想不到的好处，包括 更广泛的有用电流密度范围，改进的外观和锡改善氧化稳定性的情况。
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公开(公告)号：EP0787834B1
公开(公告)日：1999-04-21
申请号：EP97101345.3
申请日：1997-01-29
发明人： Ichiba, Mikiyuki, c/o Intel. Prop. Dept. NKK Corp. , Kubo, Hiroshi, c/o Intel. Prop. Dept., NKK Corp. , Yomura, Toshinori, Intel. Prop. Dept., NKK Corp. , Miura, Takeshi , Suda, Kazuyuki
IPC分类号： C25D3/32
CPC分类号： C25D3/32
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30.发明公开Tin, lead or tin/lead alloy electrolytes for high-speed electroplating 失效Zinn，Blei oder Zinn-Blei-LegierungselektrolytenfürElektroplattieren bei hoher Geschwindigkeit。
公开(公告)号：EP0652306A2
公开(公告)日：1995-05-10
申请号：EP95100863.0
申请日：1988-12-09
申请人： LeaRonal, Inc.
摘要： An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of an organic compound having no more than twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moiety of eight carbon atoms or less.
摘要翻译： 一种用于通过高速电镀将锡，铅或锡/铅合金沉积在基底上的电解质，系统和方法，其包括烷基或烷基磺酸的基础溶液; 和溶液可溶性锡化合物或溶液可溶性铅化合物中的至少一种; 和在一个或两个独立或连接的环中具有不超过二十个碳原子的有机化合物的环氧烷缩合化合物，任选被八个或更少碳原子的烷基部分取代。
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