公开(公告)号：EP3626751B1

公开(公告)日：2023-05-17

申请号：EP18803230.4

申请日：2018-05-18

发明人： ARAI, Fuminori ,  IWAYA, Kazuki

IPC分类号： H01L23/10 ,  H05K1/03 ,  C08F222/14 ,  C09D4/00 ,  C09J4/00 ,  H01L21/56 ,  H01B3/44 ,  H01L23/29 ,  C09J7/10 ,  C08J5/24 ,  C08J5/18 ,  H01L23/00

公开(公告)号：EP4130157A1

公开(公告)日：2023-02-08

申请号：EP21781180.1

申请日：2021-03-26

申请人： Dow Toray Co., Ltd.

发明人： YAMAZAKI, Ryosuke ,  YAMAMOTO, Shinichi ,  OZAKI, Kouichi ,  IMAIZUMI, Toru

IPC分类号： C08L83/07 ,  B32B27/00 ,  B32B27/16 ,  B32B27/18 ,  B32B27/26 ,  C08L83/05 ,  C09J183/05 ,  C09J183/07 ,  H01L23/29 ,  H01L23/31

摘要： PROBLEM
To provide a hot-melt curable silicone composition that forms a cured product that can be cured at a low temperature of 100°C or lower, has excellent storage stability, is relatively hard from curing, and has low surface tack, and a sheet or film containing same.
RESOLUTION MEANS
A curable hot-melt silicone composition of the present invention having hot-melt properties as a whole, containing: (A) a solid organopolysiloxane resin that contains at a mass ratio of 0:100 to 90:10 (A1) an organopolysiloxane resin having a curing reactive functional group and containing 20 mol% or more of a Q unit, and (A2) an organopolysiloxane resin not having a curing reactive functional group and containing 20 mol% or more of a Q unit; (B) 10 to 100 parts by mass of a straight-chain or branched-chain organopolysiloxane having a curing reactive functional group and is liquid or has plasticity; (C) an organohydrogenpolysiloxane; and (D) a photoactivated hydrosilylation reaction catalyst.

公开(公告)号：EP4082776A1

公开(公告)日：2022-11-02

申请号：EP20905096.2

申请日：2020-12-28

申请人： Dow Toray Co., Ltd.

发明人： YAMAMOTO, Shinichi ,  YAMAZAKI, Ryosuke ,  YOSHIDA, Shin

IPC分类号： B32B27/00 ,  H01L23/29 ,  H01L23/31 ,  C08L83/04 ,  C08L83/05 ,  C08L83/07

摘要： PROBLEM
An object of the present invention is to provide a laminate body including a base material, for example, a substrate such as a semiconductor precursor substrate and a flat silicone sealing layer adhered thereto without any voids as well as a laminate body with a structure of two of the same or different base materials adhered with a silicone layer interposed therebetween without any voids. A further object of the present invention is through use of a curable hot melt silicone composition layer with a particular composition, providing a laminate body that does not readily cause stress on the substrate after the curable hot melt silicone composition is cured as well as an electronic device with low stress that is made from the laminate body.
RESOLUTION MEANS
A laminate body including a base material, an organopolysiloxane resin in contact with said base material having siloxane units selected from a group containing T units or Q units making up at least 20 mol% or more of all siloxane units and a curable hot melt silicone composition layer with a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100°C of 5,000 Pa·s or less.

公开(公告)号：EP4068352A1

公开(公告)日：2022-10-05

申请号：EP20896504.6

申请日：2020-12-04

申请人： Doosan Corporation

发明人： CHOI, Taejin ,  PARK, Sooin

IPC分类号： H01L23/482 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L21/56 ,  H01L21/324

摘要： The present invention relates to an underfill film for a semiconductor package and a method for manufacturing a semiconductor package using same, and relates to: an underfill film for a semiconductor package, which, by comprising an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging; and a method for manufacturing a semiconductor package using same.

公开(公告)号：EP4055203A1

公开(公告)日：2022-09-14

申请号：EP20803452.0

申请日：2020-11-02

申请人： Robert Bosch GmbH ,  Wieland Wicoatec GmbH

发明人： MERKEL, Till ,  SZABO, Jan ,  EGLE, Philipp-Morris ,  KLETT, Gustav ,  SCHUERER, Martin ,  AICHELE, Wilfried

IPC分类号： C23C16/30 ,  B05D1/00 ,  H01L23/29 ,  B32B7/12 ,  B05D3/10

公开(公告)号：EP3696848B1

公开(公告)日：2022-08-24

申请号：EP18900388.2

申请日：2018-12-20

发明人： JEONG, Minsu ,  KYUNG, You Jin ,  CHOI, Byung Ju ,  JEONG, Woo Jae ,  LEE, Kwang Joo ,  CHO, Eunbyurl

IPC分类号： H01L23/29 ,  H01L23/482 ,  H01L23/485 ,  H01L21/02 ,  H01L21/48 ,  H01L23/498

公开(公告)号：EP4030474A1

公开(公告)日：2022-07-20

申请号：EP20862814.9

申请日：2020-09-11

申请人： Showa Denko Materials Co., Ltd.

发明人： KANG, Dongchul ,  OKUBO, Seigo

IPC分类号： H01L23/29 ,  H01L23/31 ,  C08K9/06 ,  C08L63/00 ,  B29C43/18

摘要： This encapsulating material for compression molding contains an epoxy resin, a curing agent, and an inorganic filler, wherein, in the image that is obtained when this encapsulating material for compression molding is compression-molded on a substrate via a silicon chip and the resultant compression-molded body is observed using an ultrasonic flaw detector, it is found that the surface area of the portion other than dark spots of the region corresponding to the compression-molded body on the chip is at least 86% of the surface area of the entire region corresponding to the compression-molded body on the chip.

公开(公告)号：EP3428962B1

公开(公告)日：2022-03-30

申请号：EP16893404.0

申请日：2016-03-07

发明人： KAJIHARA, Takanobu ,  OMAE, Katsuhiko ,  FUSHIE, Shunsuke ,  KANETO, Yoshinori ,  SUZUKI, Junya ,  OKABE, Yuki

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L25/07 ,  H01L25/18 ,  H01L21/56

公开(公告)号：EP3031841B1

公开(公告)日：2022-03-16

申请号：EP14849140.0

申请日：2014-09-19

发明人： KAMEI, Nobuto

IPC分类号： H01L23/29 ,  C08G61/08

公开(公告)号：EP3147329B1

公开(公告)日：2022-02-23

申请号：EP16189328.4

申请日：2016-09-16

发明人： Tsutsumi, Yoshihiro ,  Shimoda, Taro ,  Kaneta, Masahiro ,  Tomita, Tadashi

IPC分类号： C08L83/04 ,  H01L23/29