EMBEDDED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
    37.
    发明公开
    EMBEDDED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 审中-公开
    EEREBETTETE LEITERPLATTE UND VERFAHREN ZU IHRER HERSTELLUNG

    公开(公告)号:EP2894953A1

    公开(公告)日:2015-07-15

    申请号:EP12884029.5

    申请日:2012-09-10

    IPC分类号: H05K3/46 H05K3/00

    摘要: The present invention provides a component-embedded substrate (1) formed by dividing a laminate which is formed by bonding a component (12) onto a conductive material (10) placed on a support (8); sequentially laminating an insulation material (18, 28) and a core substrate (20) each having a component avoiding hole (32) which avoids the component; and hot-pressing the laminate to allow the melted insulation material to flow into the component avoiding hole to thereby form an integrated laminate (2, 36), wherein the component-embedded substrate includes regulation means (16, 34, 32, 38) which limits the displacement of the core substrate slipping on the insulation material melted during the hot pressing.

    摘要翻译: 本发明提供了一种通过将通过将部件(12)粘合到放置在支撑件(8)上的导电材料(10)而形成的层压体的方式形成的部件嵌入式基板(1)。 依次层叠绝缘材料(18,28)和芯基板(20),所述绝缘材料和芯基板(20)具有避免所述部件的部件避开孔(32); 并且对所述层压体进行热压以使所述熔融绝缘材料流入所述部件避开孔,从而形成一体的层叠体(2,36),其中所述部件嵌入基板包括调节装置(16,34,32,38),所述调节装置 限制了在热压期间熔化的绝缘材料上的芯基板滑动的位移。