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公开(公告)号：EP3896114A1
公开(公告)日：2021-10-20
申请号：EP21156605.4
申请日：2021-02-11
发明人： Zubarev, Dmitry , Urano, Hiroyuki , Takemura, Katsuya , Iio, Masashi , Honda, Kazuya , Kawai, Yoshio
摘要： Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1):
wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms ; X 1 to X 3 represent any of -CO 2 -, -CONR X1 -, -O-, -NR X1 -, -S-, -SO 2 -, -SO 3 - and -SO 2 NR X1 - and may be the same as or different from each other, provided that R X1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L 1 and L 2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.-
2.发明公开POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE 有权正感光树脂组合物，光固化干膜及其制备方法体，分层结构产品的方法及基板
公开(公告)号：EP2957955A1
公开(公告)日：2015-12-23
申请号：EP15001757.2
申请日：2015-06-15
CPC分类号： G03F7/039 , G03F7/022 , G03F7/0226 , G03F7/0236 , G03F7/0757 , G03F7/09 , G03F7/11 , G03F7/16 , G03F7/20 , G03F7/30 , G03F7/32 , G03F7/40
摘要： The present invention provides a positive photosensitive resin composition containing (A) a polymer compound obtained in the presence of an acid catalyst by condensation of at least a siloxane compound shown by formula (1), a phenol compound(s) shown by formula (2) and/or formula (3), and aldehydes and ketones shown by formula (4), (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinker, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination generated on a metal wiring, an electrode, and a substrate such as Cu and Al, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when the widely used 2.38% TMAH aqueous solution is used as a developer.
摘要翻译： 本发明提供一种含有一个正型感光性树脂组合物（A）中由式所示的存在下用酸催化剂的至少一个硅氧烷化合物的缩合得到的（1），酚化合物（S）由式表示（2高分子化合物 ）和/或式（3），和由式所示的醛和酮（4），（B）能够通过光在酸产生和在碱性水溶液中增加的溶解速率的感光材料，（C）交联剂， 和（D）溶剂。 还有可以提供一种正型感光性树脂组合物做了可以弥补上的金属布线向电极产生剥离的麻烦，以及底物：诸如Cu和Al，爱尤其是在底物：例如SiN，并且可以形成具有精细图案 正锥形状，但不产生浮渣和在图案底部和衬底当广泛应用于2底脚轮廓：38％TMAHwässrige溶液用作显影剂。
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公开(公告)号：EP4063954A2
公开(公告)日：2022-09-28
申请号：EP22159695.0
申请日：2022-03-02
摘要： The present invention is a positive photosensitive resin composition including : (A) an alkali-soluble resin containing at least one structure selected from a polyimide structure, a polyamide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a polymer compound having a structural unit formed by cyclopolymerization; and (C) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution. An object of the present invention is to provide a positive photosensitive resin composition and a positive photosensitive dry film that are soluble in an alkaline aqueous solution, that can achieve high resolution without damaging excellent features such as the mechanical characteristics of a protective film, adhesiveness, etc., and that have excellent mechanical characteristics and adhesiveness to a substrate even when cured at low temperatures.
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公开(公告)号：EP3951498A1
公开(公告)日：2022-02-09
申请号：EP21188845.8
申请日：2021-07-30
摘要： The present invention is a positive photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); and (C) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution. An object of the present invention is to provide a positive photosensitive resin composition and a positive photosensitive dry film that enable formation of a fine pattern and high resolution, have excellent mechanical characteristics even when cured at low temperatures, and have no degradation in adhesive force between before and after a high temperature and high humidity test.
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5.发明公开TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM 审中-公开四羧酸二酯化合物，聚酰亚胺前体聚合物及其制备方法，负型光敏树脂组合物，图案化方法和形成固化膜的方法
公开(公告)号：EP3275857A1
公开(公告)日：2018-01-31
申请号：EP17001064.9
申请日：2017-06-22
CPC分类号： G03F7/0387 , C07C69/76 , C07C69/80 , C08G73/1007 , C08G73/1042 , C08G73/121 , C08G73/123 , C08G73/127 , G03F7/0045 , G03F7/0046 , G03F7/031 , G03F7/037 , G03F7/038 , G03F7/0385 , G03F7/0388 , G03F7/162 , G03F7/168 , G03F7/2004 , G03F7/325 , G03F7/38 , G03F7/40
摘要： The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1),
wherein X 1 represents a tetravalent organic group; and R 1 represents a group shown by the following general formula (2),
wherein the dotted line represents a bond; Y 1 represents an organic group with a valency of k+1; Rf represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms or an aromatic group in which a part or all of hydrogen atoms is/are substituted with a fluorine atom(s); "k" represents 1, 2, or 3; and "n" represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition, and usable as a base resin of a negative photosensitive resin composition.摘要翻译： 本发明提供下述通式（1）所示的四羧酸二酯化合物，式中，X 1表示4价有机基团。 R1表示下述通式（2）所示的基团，虚线表示键。 Y1表示化合价为k + 1的有机基团; Rf表示碳原子数1〜20的直链状，支链状或环状的烷基或氢原子的一部分或全部被氟原子取代而成的芳香族基团。 “k”表示1,2或3; “n”表示0或1.可以提供一种四羧酸二酯化合物，其可以提供可溶于广泛用作组合物的溶剂的安全有机溶剂中的聚酰亚胺前体聚合物，并且可用作负性光敏基础树脂 树脂组合物。
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6.发明授权
公开(公告)号：EP3002308B1
公开(公告)日：2017-02-08
申请号：EP15002687.0
申请日：2015-09-16
发明人： Urano, Hiroyuki , Iio, Masashi , Takemura, Katsuya , Hasegawa, Koji , Fukushima, Masahiro , Fujiwara, Takayuki
IPC分类号： C08G77/52 , C08G77/38 , G03F7/075 , H01L21/3213
CPC分类号： G03F7/0757 , C07C39/21 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/38 , C08G77/52 , C08K5/09 , C08L83/14 , C09D183/14 , G03F7/038 , G03F7/0382 , G03F7/11 , G03F7/168 , G03F7/2002 , G03F7/2014 , G03F7/2037 , G03F7/32 , G03F7/38 , G03F7/40 , H01L21/0274
摘要： The present invention provides a silicone skeleton-containing polymer compound containing a repeating unit shown by the general formula (1) and having a weight average molecular weight of 3,000 to 500,000. There can be provided a silicone skeleton-containing polymer compound suitable used as a base resin of a chemically amplified negative resist composition that can remedy the problem of delamination generated on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern without generating a scum and a footing profile in the pattern bottom and on the substrate when the widely used 2.38% TMAH aqueous solution is used as a developer.
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7.发明授权SILICONE SKELETON-CONTAINING POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, SUBSTRATE, AND SEMICONDUCTOR APPARATUS 有权硅脚手架含高分子化合物，化学EXTENDED负抗蚀剂组合物，光固化干膜及其制备方法THEREOF MARKS教育的过程，分层制品基板和半导体元件
公开(公告)号：EP3043206B1
公开(公告)日：2017-01-11
申请号：EP15003511.1
申请日：2015-12-09
IPC分类号： G03F7/075 , C09D183/14 , C08G77/48 , C08L83/14
CPC分类号： C08G77/14 , B32B3/266 , B32B3/30 , B32B2255/26 , B32B2307/206 , B32B2457/14 , C08G77/48 , C08G77/52 , C08L83/14 , C09D183/14 , G03F7/004 , G03F7/038 , G03F7/0382 , G03F7/0757 , G03F7/20 , H01L21/0274 , H01L21/0277
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公开(公告)号：EP4067999A1
公开(公告)日：2022-10-05
申请号：EP22159629.9
申请日：2022-03-02
IPC分类号： G03F7/038
摘要： A negative photosensitive resin composition including: (A) an alkali-soluble resin containing at least one structure selected from a polyimide structure, a polyamide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a polymer compound having a structural unit formed by cyclopolymerization; (C) a compound that generates an acid by light; and (D) a heat crosslinking agent. An object of the present invention is to provide a negative photosensitive resin composition that is soluble in an alkaline aqueous solution, enables formation of a fine pattern, can achieve high resolution, and has excellent mechanical characteristics such as rupture elongation and tensile strength even when cured at low temperatures.
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公开(公告)号：EP3974904A1
公开(公告)日：2022-03-30
申请号：EP21197201.3
申请日：2021-09-16
发明人： Urano, Hiroyuki , Iio, Masashi , Takemura, Katsuya
摘要： The present invention is a photosensitive resin composition containing: (A) a resin; (B) a photosensitizer; (C) a surfactant containing a structural unit represented by the following average composition formula (1); and (D) a solvent, where Y 1 and Y 2 each independently represent a hydrogen atom, a methyl group, a phenyl group, or a group represented by the following general formula (2), at least one of Y 1 and Y 2 is a group represented by the following general formula (2), R 1 to R 6 are monovalent hydrocarbon groups that may be the same or different and optionally contain a heteroatom, having 1 to 20 carbon atoms, "l" and "n" are each independently integers of 1 to 100, and "m" is an integer of 0 to 100. This provides: a photosensitive resin composition that is excellent in film thickness uniformity at the time of application and that has reduced coating defects when forming a thick film; a patterning process performed using the photosensitive resin composition; a cured film formed by curing the pattern; and an electronic component having the cured film.
(R 1 R 2 Y 2 SiO 1/2 ) 2 (R 3 Y 1 SiO 2/2 ) I (R 5 R 6 SiO 2/2 ) n (R 4 SiO 3/2 )m (1)-
公开(公告)号：EP3896521A1
公开(公告)日：2021-10-20
申请号：EP21156645.0
申请日：2021-02-11
发明人： Zubarev, Dmitry , Urano, Hiroyuki , Takemura, Katsuya , Iio, Masashi , Honda, Kazuya , Kawai, Yoshio
摘要： Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2):
wherein T 1 and T 2 may be the same as, or different from, each other and represent any of -CO- and -SO 2 -; X 1 is a tetravalent organic group; and 1 is 0 or 1; and X 2 is a divalent organic group.
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