摘要:
in a semiconductor memory device having stacked- capacitor memory cells, the capacitor of each memory cell comprises an electrode (E o ), an insulating layer (6), and a counter-electrode (E 1 ). The electrode (E o ) is connected electrically to a source or drain region of the transfer transistor of the memory cell. To provide a memory-cell structure suitable for memory devices with folded bit lines, the electrode (E o ), the insulating layer (6) and the counter-electrode (E,) extend over a part of a word line (WL 2 ) which is adjacent to a word line (WL 1 ) serving as gate electrode of the transfer transistor and at which no memory cell is formed.
摘要:
A semiconductor integrated circuit (IC) I, II device Including therein a test circuit (20). The test circuit operates to distinguish the power source level or ground level occurring at an internal node (N), under testing located inside the semiconductor chip. The test circuit is comprised of a series-connected MIS transistor (24), and MIS diode (25). The gate (22), of the MIS transistor is connected to the internal node (N). The MIS diode is connected to an external input/output (I/O pin (21). The level at the internal node, i.e., the power source level or the ground level, can be distinguished by a first voltage level or a second voltage level applied to the external 1/0 pin, whichever enables a current to be drawn from the external I/O pin.
摘要:
Disclosed is a dynamic-type semiconductor memory device comprising a group of sense amplifiers (SA), a plurality of pairs of bit lines (BL, BL ) extending from the sense amplifiers, and a plurality of dynamic-type memory cells (MC) connected to each bit line. Each pair of bit lines is short circuited and then precharged to a high potential level before a reading operation. A control line ( ) activating the sense amplifiers is commonly used as a control line for bringing about the precharging of each pair of bit lines, thereby assisting in attainment of high degree of integration and a high short-circuiting speed.
摘要:
A semiconductor buffer circuit which is energisable by a power supply (Vcc,Vss) comprises an input stage (Q1-Q4) for receiving an input clock signal (φ 0 ) and an inverted input clock signal ( φ 0 ). A bootstrap circuit (Q5-Q7), which includes a transistor (Q6) for receiving the output of the input stage circuit, maintains the gate voltage of that transistor at a high level during a standby period. An output circuit (Q8-Q12), including a transistor (Q11) which is switched on and off by the output of the bootstrap circuit, generates an output clock signal (φ 1 ). The circuit is characterised by a current leak circuit (X) which maintains, during the standby period, the voltage of a point (N2) in the semiconductor circuit which is charged during the standby period to a level corresponding to the voltage (Vcc) of the power source. A delay in the output clock signal, which is caused by a fluctuation in the voltage of the power supply during the standby period, is thereby reduced, so that the circuit can be used for fast accessing of a dynamic memory. The current leak circuit (X) may comprise two field-effect transistors (Q13,Q14) connected in series, or various arrangements of field-effect transistors and/or resistors.
摘要:
The read/write circuit comprises a data output buffer (DOB) connected through a three-state circuit (Qa, Q b ) to a common data input/output terminal (I/O), and a data write-in buffer (DWB) of a dynamic type having a latching function connected between the common data input/output terminal (I/O) and data buses (DB, DB) for providng latched data to the data buses. By utilizing a rise or a fall of a write enable signal (WE) or a column address strobe signal (CAS) applied to the memory device, the three-state circuit (Qa, Q b ) is set to a high impedance state, and then write data is latched into the data write-in buffer (DWB).
摘要:
A plurality of noise limiters (4X and 4Y) have one end connected to an output of a reference voltage generator (1) and another end of each of which is connected to its corresponding load circuit (2X and 2Y). The value of the impedance of the noise limiters (4X and 4Y) is of the same order or higher than the output impedance of the reference voltage generator circuit (1). Preferably noise cancelling means (7) are also provided coupled between the noise limiters (4X and 4Y) and their load circuits (2X and 2Y). Preferably the noise cancelling means are formed by capacitors (7X and7Y) connected across the loads (2X and 2Y).
摘要:
An input circuit is described for accepting different types of input signals. An instruction means (14,86) selects a first mode when an input reference signal is given, and a second mode when it is not. In the first mode, the input voltage is compared with the input reference signal, whereas in the second mode the threshold is a predetermined threshold.