公开(公告)号：EP0408272A2

公开(公告)日：1991-01-16

申请号：EP90307447.4

申请日：1990-07-09

申请人： THE WELDING INSTITUTE

发明人： Stockham, Norman Roy

IPC分类号： H01L21/60 ,  H01L21/607

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/20759 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20754 ,  H01L2924/013 ,  H01L2924/00013

摘要： A method of bonding an electrical conductor (22,23) to a contact (25) of an integrated circuit (IC) device comprises bonding the conductor (22,23) to a support member (20) and to a contact (25) of the IC device. The conductor (22,23) is then severed to release the IC device and conductor (22,23) from the support (20). This allows the IC device to be tested while connected to the support member (20) and provides it with a conductor lead (22,23) for connection to a carrier for use.

摘要翻译： 将电导体（22,23）接合到集成电路（IC）装置的触点（25）的方法包括将导体（22,23）粘合到支撑构件（20）和将导体（22,23）连接到 IC器件。 然后断开导体（22,23）以从支撑件（20）释放IC器件和导体（22,23）。 这允许在连接到支撑构件（20）的同时对IC器件进行测试，并为其提供用于连接到使用的载体的导体引线（22,23）。

公开(公告)号：EP0190220B1

公开(公告)日：1989-02-08

申请号：EP85903757.4

申请日：1985-07-15

申请人： Hughes Aircraft Company

发明人： HILL, William, H.

IPC分类号： H05K13/06 ,  H01R43/02

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/20752 ,  H01R43/0207 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A bonding tool and clamp assembly including an upper wire guide (23, 51) and a bonding tool (17, 75) having a short guide hole (45) adjacent the heel of the bonding tool foot (41). The bonding tool tip (17a) includes a clamping surface (47) adjacent the guide hole (45); and a clamp (21b, 49b) is selectively forced toward the clamping surface (47) to clamp the bonding wire (39, 77). The clamp (21b, 49b) is biased toward the clamping surface by a spring (37, 73), and is released from the clamping surface by an electromagnet (29, 57).