公开(公告)号：EP0460389A1

公开(公告)日：1991-12-11

申请号：EP91106638.9

申请日：1991-04-25

申请人： International Business Machines Corporation

发明人： Chu, Richard Chao-Fan ,  Ellsworth, Michael Joseph, Jr. ,  Goth, Gary Franklin ,  Simons, Robert Edward ,  Zumbrunnen, Michael Lynn

IPC分类号： H01L23/433 ,  H01L23/473

CPC分类号： H01L23/473 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermally optimized piston (200) for use in a liquid cooled module. The thermally optimized piston has three distinctive sections, an upper tapered section (202), a central cylindrical section (204), and a lower diverging section (206). In a preferred embodiment, the thermally optimized piston is provided as part of an improved electronic module. The improved electronic module includes enhanced convective cooling channels disposed between the pistons.

摘要翻译： 一种用于在液体中使用的热优化活塞（200）中的冷却模块。 热优化活塞具有三个不同的部分，在上部锥形部（202），中央圆柱形部分（204），和下发散部分（206）。 在优选实施例中，热优化活塞被提供作为一种改进的电子模块的一部分。 该改进的电子模块包括活塞之间设置增强对流冷却通道。

公开(公告)号：EP0454603A2

公开(公告)日：1991-10-30

申请号：EP91480028.9

申请日：1991-02-21

申请人： International Business Machines Corporation

发明人： Horwath, Joseph Louis ,  Biskeborn, Robert Glenn ,  Yakubowski, Carl

IPC分类号： H01L23/433 ,  H01L23/40 ,  H01L23/367

CPC分类号： H01L23/4338 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： An apparatus (10) for removing heat from a heat generating device (12) . The apparatus (10) includes at least one heat conductive finned thermal device insert (16) including a base having at least one first fin (17), and preferably having a plurality of first fins (17), on a first surface and a second surface which is flat and a heat conductive second thermal device (18), preferably a cooling hat, having a plurality of second fins (20). The first fins (17) are interspersed with the second fins (20). At least one of the first and second fins (17,20) is of a thermally conductive, flexible material so that a gap otherwise existing between the interspersed fins (17,20) is substantially eliminated. Finally, at least a portion of the first and second fins (17,20) are biased against one another.

摘要翻译： 一种用于从发热装置（12）去除热量的装置（10）。 装置（10）包括至少一个导热翅片式热装置插入件（16），其包括具有至少一个第一翅片（17）并且优选地具有多个第一翅片（17）的底座，在第一表面上，第二 平坦的表面和具有多个第二散热片（20）的导热的第二热敏装置（18），优选为冷却帽。 第一散热片（17）与第二散热片（20）分散。 第一和第二翅片（17,20）中的至少一个是导热的柔性材料，从而基本上消除了散布的散热片（17,20）之间存在的间隙。 最后，第一和第二翅片（17,20）的至少一部分彼此偏压。

公开(公告)号：EP0402614A1

公开(公告)日：1990-12-19

申请号：EP90108510.0

申请日：1990-05-07

申请人： International Business Machines Corporation

发明人： Chrysler, Gregory Martin ,  Chu, Richard Chao-Fan ,  Simons, Robert Edward

IPC分类号： H01L23/473 ,  H01L23/433

CPC分类号： H01L23/427 ,  H01L23/4336 ,  H01L23/4338 ,  H01L2224/16225 ,  H01L2224/16227

摘要： In an improved circuit module (9) with a flat chip-­carrying substrate (10) and cylindrical pistons (19) that contact the chips (12) for cooling, each piston has an axial bore (38) that carries a dielectric liquid to the chip and the lower face (23) of the piston (fac­ing the chip) is spaced away (22) from the chip to establish radial channels that carry the liquid across the surface (14) of the chip. The face of the piston, as seen in a section through the axis, is shaped to provide a selected flow pattern across the surface of the chip. The piston face reduces the channel height in the direction of flow where the liquid is non-boiling and thereby offsets the tendency for the flow rate to de­crease as the circumferential width of the channel widens. The piston face increases the channel height in the direction of flow where the liquid is boiling to handle the increase in volume caused by the vapor. In one embodiment, the piston carries a shroud (70) around the chip which causes the coolant to flow across the edge (71) of the chip to provide additional chip cool­ing and to impinge on the nearby region of the sub­strate that supports the chips to remove heat that flows from the chip to the substrate.
In one embodiment, the pistons are thermally conductive, and the temperature of the coolant at the inlet to the pistons is lower than the temperature required at the outlet to cool the piston. The pistons have fins that help to condense the vapor. In this embodiment, the lower face of a piston has radial fins that establish pie-shaped channels for the coolant to flow in. The fins (36) also provide heat transfer by conduction from the chip to the piston supporting structure (the "hat") (17).

摘要翻译： 在一个改进的电路模块（9）具有平坦芯片承载（10）和圆筒形的活塞（19），其接触所述芯片（12）进行冷却，每个活塞具有在轴向孔（38）做了携带电介质液体于基板 芯片和所述活塞的下表面（23）（面向芯片）间隔开（22）从芯片到建立径向通道并在芯片的表面（14）携带的液体。 活塞的面，如在通过轴线的截面，被成形为提供在芯片的表面上的选定的流动模式。 活塞面减少在流动的方向，其中所述液体是不沸腾，从而抵消了减小的流率作为信道的周向宽度变宽的倾向通道高度。 活塞面增加在流动，其中液体是沸腾处理在由蒸气引起体积增加的方向上的信道的高度。 在一个，实施例的活塞携带这使得冷却剂在芯片的边缘（71）中流动，以提供额外的芯片的冷却，并在基片上的那样的附近区域撞击芯片周围的护罩（70）支撑所述芯片 从芯片到基片移除热量那样流动。 在一个实施例中，活塞是导热的，并且在所述入口到所述活塞的冷却剂的温度比在出口处冷却活塞所需的温度低。 活塞有鳍的确有助于冷凝蒸汽。 在此，实施例的活塞的下表面具有径向翅片那样建立馅饼形通道的冷却剂通过传导从芯片中流动。翅片（36），以便提供热传递到活塞支撑结构（“帽子” ）（17）。

公开(公告)号：EP0344084A3

公开(公告)日：1990-11-28

申请号：EP89480064.8

申请日：1989-04-25

申请人： International Business Machines Corporation

发明人： Horvath, Joseph Louis ,  Biskeborn, Robert Glenn ,  Harvilchuck, Joseph Matthew

IPC分类号： H01L23/40 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2224/16

摘要： The present invention dissipates the heat generated by high powered VLSI chips to a heat sink in a very efficient manner, providing a thermal resistance heretofore not possible in heat conduction module cold plate type systems. A finned internal thermal device (14) having a flat bottom contacts the chips (11), while corresponding fins in a finned cooling hat mounted to a cold plate form gaps into which the fins of the finned internal thermal devices are slidably mounted. A preferred double cantilever spring (22) between the finned internal thermal devices and fins of the finned cooling hat and a compliant thermally conductive interface such as synthetic oil between the chips and flat base of the finned internal devices provide efficient, non-rigid interfaces throughout the system, while assuring good thermal contact between the system components. The present high conduction cooling module allows for the simple incorporation of side biasing means and a grooved chip interface on the finned internal thermal devices to provide enhanced thermal performance if required.

公开(公告)号：EP0169270B1

公开(公告)日：1990-03-28

申请号：EP84115184.8

申请日：1984-12-11

申请人： HITACHI, LTD.

发明人： Daikoku, Takahiro ,  Nakajima, Tadakatsu ,  Ashiwake, Noriyuki ,  Kawamura, Keizo ,  Sato, Motohiro ,  Kobayashi, Fumiyuki ,  Nakayama, Wataru

IPC分类号： H01L23/42 ,  H01L23/36

CPC分类号： H01L23/4338 ,  H01L2224/16

公开(公告)号：EP0344084A2

公开(公告)日：1989-11-29

申请号：EP89480064.8

申请日：1989-04-25

申请人： International Business Machines Corporation

发明人： Horvath, Joseph Louis ,  Biskeborn, Robert Glenn ,  Harvilchuck, Joseph Matthew

IPC分类号： H01L23/40 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2224/16

摘要： The present invention dissipates the heat generated by high powered VLSI chips to a heat sink in a very efficient manner, providing a thermal resistance heretofore not possible in heat conduction module cold plate type systems. A finned internal thermal device (14) having a flat bottom contacts the chips (11), while corresponding fins in a finned cooling hat mounted to a cold plate form gaps into which the fins of the finned internal thermal devices are slidably mounted. A preferred double cantilever spring (22) between the finned internal thermal devices and fins of the finned cooling hat and a compliant thermally conductive interface such as synthetic oil between the chips and flat base of the finned internal devices provide efficient, non-rigid interfaces throughout the system, while assuring good thermal contact between the system components. The present high conduction cooling module allows for the simple incorporation of side biasing means and a grooved chip interface on the finned internal thermal devices to provide enhanced thermal performance if required.

摘要翻译： 本发明以非常有效的方式将由大功率VLSI芯片产生的热量散发到散热器，提供迄今为止在导热模块冷板型系统中不可能的热阻。 具有扁平底部的翅片式内部热装置（14）接触芯片（11），而安装在冷板上的翅片式冷却帽中的相应翅片形成间隙，翅片式内部热装置的翅片可滑动地安装在该间隙中。 翅片式内部热装置之间的优选的双悬臂弹簧（22）和翅片式冷却帽的散热片以及翅片式内部装置的芯片和扁平底座之间的诸如合成油之间的柔性导热接口提供了有效的非刚性界面 同时确保系统组件之间良好的热接触。 当前的高传导冷却模块允许在翅片式内部热装置上简单地结合侧偏置装置和沟槽芯片接口，以便在需要时提供增强的热性能。

公开(公告)号：EP0316129A1

公开(公告)日：1989-05-17

申请号：EP88310468.9

申请日：1988-11-08

申请人： NEC CORPORATION

发明人： Mine, Shinji c/o NEC Corporation

IPC分类号： H01L23/46 ,  H05K7/20

CPC分类号： H05K7/20645 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling system for a three-dimensional IC package in which a plurality of substrates (1) each mounting ICs (2) on its one or both surfaces are laminated with a predetermined interval therebetween, includes a cold plate (4) in which holes are formed at positions corresponding to the ICs and a cooling fluid path are formed around the holes, a heat conductive piston, inserted in each hole of the cold plate while keeping a small gap with respect to the inner wall of the hole, and biased by a spring to be moved in the hole, for conducting, when one end thereof is brought into ccntact with a heat radiating surface of the IC, the heat to the cold plate, and a device for interrupting a contact between the heat conductive piston and the IC so that the substrate can be easily inserted/removed.

摘要翻译： 一种用于三维IC封装的冷却系统，其中在其一个或两个表面上安装IC（2）的多个基板（1）以预定间隔层压在其间，包括冷板（4），其中孔 形成在对应于IC的位置和冷却流体路径周围的孔，导热活塞，插入冷板的每个孔中，同时保持相对于孔的内壁的小间隙，并被一个 弹簧在孔中移动，当其一端与IC的散热面接触时，导致冷却板的热量，以及用于中断导热活塞与IC之间的接触的装置 使得基底可以容易地插入/移除。

公开(公告)号：EP0302641A1

公开(公告)日：1989-02-08

申请号：EP88306812.4

申请日：1988-07-25

申请人： NEC CORPORATION

发明人： Mine, Shinji c/o NEC Corporation ,  Shimonishi, Terumi c/o NEC Corporation

IPC分类号： H01L23/42 ,  H01L23/46

CPC分类号： H01L23/4338 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： The cooling structure for heat-generating electronic com­ponents (2) mounted on a substrate (1) comprises a cold plate (7) fixed on the substrate and provided with through holes (5) opposed to the respective upper surfaces of the heat-generating electronic components.
Flow paths (6) are formed within the cold plate (7) for circulating a coolant from an inlet (10) provided on a side of the cold plate to an outlet (11) provided on a side of the cold plate.
Pistons or plugs (4) are inserted through and held within the through holes (5) so that the lower surfaces of these pistons or plugs come into contact with the upper surfaces of the heat-generating electronic components (2). An intermediate member (3) made of a heat-conductive material is interposed between the lower surfaces of the pistons (4) and the upper surfaces of the electronic components (2).

摘要翻译： 安装在基板（1）上的发热电子部件（2）的冷却结构包括固定在基板上的冷板（7），并且设置有与发热电子体的各个上表面相对的通孔（5） 组件。 在冷板（7）内形成流路（6），用于将设置在冷板侧的入口（10）的冷却剂循环到设置在冷板侧的出口（11）。 活塞或塞子（4）插入并保持在通孔（5）内，使得这些活塞或塞子的下表面与发热电子部件（2）的上表面接触。 在活塞（4）的下表面和电子部件（2）的上表面之间插入由导热材料制成的中间构件（3）。

公开(公告)号：EP0286876A2

公开(公告)日：1988-10-19

申请号：EP88104639.5

申请日：1988-03-23

申请人： International Business Machines Corporation

发明人： Chu, Richard Chao-Fan ,  Eid, Jeffrey Charles ,  Zumbrunnen, Michael Lynn

IPC分类号： H01L23/42 ,  H01L23/46 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/09701

摘要： An improved TCM-like circuit module for cooling an array of chips (14) mounted on a substrate (12). The substrate and the chips are enclosed by components that include a barrier plate (30) that separates the chip space (24) from a coolant (in 26) such as air or chilled water. A floating plate (37) contacts a heat transfer surface of each chip and forms a local heat sink. Pins (42, 43) conduct heat from the floating plate. In one embodiment, one end of each pin is rigidly attached to the floating plate and the other end is located in a cavity (40) in the barrier plate. In a second embodiment, the cavities are formed in the floating plate and the barrier plate rigidly supports the pins. In the second embodiment, the pins can be extended through the barrier plate to contact the coolant directly.

摘要翻译： 一种用于冷却安装在基板（12）上的芯片阵列（14）的改进的类似TCM的电路模块。 衬底和芯片由包括将芯片空间（24）与诸如空气或冷却水的冷却剂（26）分隔开的阻挡板（30）的部件封闭。 浮板（37）接触每个芯片的传热表面并形成局部散热器。 引脚（42,43）从浮板传导热量。 在一个实施例中，每个销的一端刚性地附接到浮动板，另一端位于阻挡板中的空腔（40）中。 在第二实施例中，空腔形成在浮动板中，阻挡板刚性地支撑销。 在第二实施例中，销可以延伸通过阻挡板直接与冷却剂接触。

公开(公告)号：EP0140119B1

公开(公告)日：1987-12-02

申请号：EP84111046.3

申请日：1984-09-17

申请人： International Business Machines Corporation

发明人： Kok, Paul

IPC分类号： H01L23/42 ,  H01L21/48

CPC分类号： H01L21/4882 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4981 ,  H01L2924/00