PIEZOELECTRIC MEMS MICROPHONE
    44.
    发明公开
    PIEZOELECTRIC MEMS MICROPHONE 审中-公开
    压电MEMS麦克风

    公开(公告)号:EP2297976A4

    公开(公告)日:2014-03-05

    申请号:EP09774338

    申请日:2009-06-30

    Applicant: UNIV MICHIGAN

    Abstract: A piezoelectric MEMS microphone comprising a multi-layer sensor that includes at least one piezoelectric layer between two electrode layers, with the sensor being dimensioned such that it provides a near maximized ratio of output energy to sensor area, as determined by an optimization parameter that accounts for input pressure, bandwidth, and characteristics of the piezoelectric and electrode materials. The sensor can be formed from single or stacked cantilevered beams separated from each other by a small gap, or can be a stress-relieved diaphragm that is formed by deposition onto a silicon substrate, with the diaphragm then being stress relieved by substantial detachment of the diaphragm from the substrate, and then followed by reattachment of the now stress relieved diaphragm.

    Microphone unit
    45.
    发明公开
    Microphone unit 审中-公开
    Mikrofoneinheit

    公开(公告)号:EP2611212A2

    公开(公告)日:2013-07-03

    申请号:EP12196375.5

    申请日:2012-12-10

    Abstract: In this microphone unit (110), a first sound hole (31) and a second sound hole (32) are provided to extend toward a surface of an electronic apparatus (100) internally mounted with a differential vibrating portion (14), intersecting with a main surface (21) of the electronic apparatus, and an end portion of the first sound hole closer to the surface intersecting with the main surface of the electronic apparatus and an end portion of the second sound hole closer to the surface intersecting with the main surface of the electronic apparatus are so arranged that the vertical distances of the end portions from the main surface of the electronic apparatus are different from each other.

    Abstract translation: 在该麦克风单元(110)中,设置有第一声孔(31)和第二声孔(32),朝向内部安装有差动振动部(14)的电子设备(100)的表面延伸,与差动振动部 电子设备的主表面(21)和靠近与电子设备的主表面交叉的表面的第一音孔的端部和靠近与主电路相交的表面的第二音孔的端部 电子设备的表面被布置成使得端部离电子设备的主表面的垂直距离彼此不同。

    Sound reproduction device
    47.
    发明公开
    Sound reproduction device 审中-公开
    声音再现设备

    公开(公告)号:EP2566185A2

    公开(公告)日:2013-03-06

    申请号:EP12177259.4

    申请日:2012-07-20

    Abstract: There is provided a sound reproduction device including a left channel housing unit that accommodates at least a left channel driver unit outputting a left channel sound, a left channel microphone recording an external sound, and a left channel micro-computer controlling a setting for a noise cancelling processing based on a recording signal of the left channel microphone; and a right channel housing unit that accommodates at least a right channel driver unit outputting a right channel sound, a right channel microphone recording an external sound, and a right channel micro-computer controlling a setting for a noise cancelling processing based on a recording signal of the right channel microphone. The left channel micro-computer and the right channel micro-computer are configured to communicate data with each other.

    Abstract translation: 提供了一种声音再现装置,该声音再现装置包括左声道容纳单元,该左声道容纳单元至少容纳输出左声道声音的左声道驱动器单元,记录外部声音的左声道麦克风和控制噪声设置的左声道微型计算机 基于左声道麦克风的记录信号的取消处理; 以及右声道容纳单元,其至少容纳输出右声道声音的右声道驱动器单元,记录外部声音的右声道麦克风以及基于记录信号来控制用于噪声消除处理的设置的右声道微型计算机 的右声道麦克风。 左声道微型计算机和右声道微型计算机被配置为彼此传输数据。

    A MEMS STRESS CONCENTRATING STRUCTURE FOR MEMS SENSORS
    48.
    发明公开
    A MEMS STRESS CONCENTRATING STRUCTURE FOR MEMS SENSORS 审中-公开
    MEMS应力集中结构FOR MEMS传感器

    公开(公告)号:EP2473830A1

    公开(公告)日:2012-07-11

    申请号:EP10813349.7

    申请日:2010-09-01

    Inventor: LI, Ping Wai

    Abstract: A stress concentrating apparatus and a method for a MicroElectroMechanical System (MEMS) sensors is provided. The apparatus includes a plate having an inner region and outer region, the inner region being separated from the outer region by slits defined in the plate. A stress concentrator bridge connects the inner region to the outer region, and to mechanically amplify stress applied on the inner region of the plate. At least one stress sensor is operatively connected to the stress concentrator bridge, whereby the at least one stress sensor converts the mechanically amplified stress applied on the inner region into an electrical signal.

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