公开(公告)号：EP1162569B1

公开(公告)日：2005-12-14

申请号：EP01120744.6

申请日：1998-02-02

Applicant: Giesecke & Devrient GmbH

Inventor： Tarantino, Thomas ,  HaghiriTehrani, Yahya

IPC: G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H05K1/0268 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/305 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/09836 ,  H05K2203/0207 ,  H05K2203/0228

公开(公告)号：EP1108348A1

公开(公告)日：2001-06-20

申请号：EP99902306.2

申请日：1999-01-15

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： WINDSCHITL, David J.

IPC: H05K3/40 ,  H01L23/538

CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/388 ,  H05K3/4076 ,  H05K2201/0166 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H01L2924/00

Abstract: A flexible circuit includes a flexible non-conductive substrate (12) having a first surface and a second surface. A first electrically conductive trace (18) is provided on the first surface and a second electrically conductive trace (20) is provided on the second surface. A passage (22) extends through the substrate from an end of the first trace to an end of the second trace. The passage includes a beveled opening (26) of a first size formed in the first side and axially aligned with a second beveled opening (28) of the first size formed in the second side. The first and second openings are interconnected by an aperture axially aligned therewith and being of a second size less than the first size. An electrically conductive surface is provided on the passage for electrically interconnecting the first trace and the second trace.

公开(公告)号：EP0956538A1

公开(公告)日：1999-11-17

申请号：EP98908041.0

申请日：1998-02-02

Applicant: Giesecke & Devrient GmbH

Inventor： TARANTINO, Thomas ,  HAGHIRI-TEHRANI, Yahya

IPC: G06K19 ,  H05K3 ,  H05K1

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H05K1/0268 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/305 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/09836 ,  H05K2203/0207 ,  H05K2203/0228

Abstract: The present invention pertains to a data medium in the form of a chipcard comprising the card body (1) fitted with an antenna (3), a chip module (2) containing an integrated circuit (10) and located in a recess (5) provided in the card body (1). The electric connection between the antenna (3) and the chip module (2) passes through lows (11) in the antenna (3) connections (4). When manufacturing the inventive data medium, a cavity (5) is engineered inside the body card (1) in which the antenna is at least partially embedded. The chip module (2) is placed into said cavity (5) and glued to the card body, for example with a thermoactivable glue (6), thereby establishing an electric connection between the chip module (2) and the antenna (3) inasmuch, for instance, as a conductive glue is used for anticipated application to the free antenna (3) connections (4). In the preferred embodiment the chip removal is carried out so as to form an oblique cutout.