公开(公告)号：EP3109701A1

公开(公告)日：2016-12-28

申请号：EP15867418.4

申请日：2015-08-17

Applicant: Goo Chemical Co., Ltd.

Inventor： SAKAI, Yoshio

IPC: G03F7/004 ,  G03F7/029 ,  G03F7/031

CPC classification number: G03F7/031 ,  G03F7/0042 ,  G03F7/0043 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/20 ,  G03F7/2006 ,  G03F7/26 ,  G03F7/322 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/068

Abstract: This photosensitive resin composition includes: (A) a photopolymerizable compound including at least one of a photopolymerizable monomer and a photopolymerizable oligomer; (B) titanium dioxide; and (C) a photopolymerization initiator. The component (C) includes (C1) an acylphosphine oxide-containing photopolymerization initiator and (C2) a phenylglyoxylic acid-containing photopolymerization initiator.

Abstract translation: 该感光性树脂组合物包含：（A）包含光聚合性单体和光聚合性低聚物中的至少一种的光聚合性化合物， （B）二氧化钛; 和（C）光聚合引发剂。 组分（C）包括（C1）含酰基氧化膦的光聚合引发剂和（C2）含苯基乙醛酸的光聚合引发剂。

公开(公告)号：EP3054350A1

公开(公告)日：2016-08-10

申请号：EP14866816.3

申请日：2014-12-10

Applicant: Goo Chemical Co., Ltd.

Inventor： SAKAI, Yoshio ,  HAMADA, Nobuhito ,  HIGUCHI, Michiya ,  MIYAKE, Tokuzan

IPC: G03F7/031 ,  G03F7/004 ,  G03F7/038

CPC classification number: G03F7/031 ,  G03F7/0042 ,  G03F7/0043 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/20 ,  G03F7/2006 ,  G03F7/26 ,  G03F7/322 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/068

Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first α-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25°C, and a second α-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25°C.

公开(公告)号：EP2012350A2

公开(公告)日：2009-01-07

申请号：EP08154375.3

申请日：2008-04-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Song, Ki Yong ,  Cho, Sung Hen ,  Moon, Jun Hyuk ,  Jeong, Chang Oh ,  Ning, Hong Long

IPC: H01L21/3205 ,  G02F1/1362

CPC classification number: H01L27/1288 ,  G02F1/136286 ,  G02F2001/136295 ,  G02F2202/42 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/124 ,  H05K3/002 ,  H05K3/0041 ,  H05K3/048 ,  H05K3/107 ,  H05K3/184 ,  H05K3/388 ,  H05K2201/0166 ,  H05K2203/0565

Abstract: Disclosed is a method of forming a metal pattern, the method comprising depositing a dielectric substrate on a supporting substrate; forming a latent mask pattern of a metal pattern on the dielectric substrate; etching the dielectric substrate exposed by the latent mask pattern; forming a seed layer on the supporting substrate by activating the supporting substrate; removing the latent mask pattern and the portion of the seed layer disposed on the latent mask pattern through a lift-off process; and plating a metal layer on the patterned seed layer.

Abstract translation: 公开了一种形成金属图案的方法，所述方法包括在支撑衬底上沉积电介质衬底; 在电介质基板上形成金属图案的潜掩模图案; 蚀刻由潜像图案曝光的电介质基片; 通过激活支撑衬底在支撑衬底上形成种子层; 通过剥离过程去除潜在掩模图案和设置在潜像图案上的种子层的部分; 并在图案化的种子层上镀覆金属层。

公开(公告)号：EP1622433A1

公开(公告)日：2006-02-01

申请号：EP05254523.3

申请日：2005-07-20

Applicant: Endicott Interconnect Technologies, Inc.

Inventor： Desai, Subahu D. ,  Lin, How T. ,  Lauffer, John M. ,  Markovich, Voya R. ,  Thomas, David L.

IPC: H05K1/16

CPC classification number: G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

Abstract: A circuitized substrate (11) comprised of at least one dielectric material (13) having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device (35) which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate (11) is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly (71) capable of using the substrate is also provided, as is an information handling system (101) adapted for using one or more such electrical assemblies as part thereof.

Abstract translation: 由至少一个其上具有导电图案的介电材料（13）组成的电路化基板（11）。 图案的至少一部分被用作有机存储器件（35）的第一层，该有机存储器件（35）还包括至少第二电介质层，并且相对于下部部分对准第二电介质层，以实现几个接触点 从而形成设备。 衬底（11）优选地与其它介质电路分层组件组合以形成多层衬底，其上可以将耦合到内部存储器件的分立电子部件（例如，逻辑芯片）放置在其中以与之组合工作。 还提供能够使用基板的电气组件（71），以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统（101）。

公开(公告)号：EP1523869A1

公开(公告)日：2005-04-20

申请号：EP03762159.6

申请日：2003-06-27

Applicant: PPG Industries Ohio, Inc.

Inventor： WANG, Alan E. ,  OLSON, Kevin C.

IPC: H05K3/44 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K3/44 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2203/135 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T428/12361 ,  Y10T428/24322

Abstract: Provided is a process for creating vias for a circuit assembly including the steps of (a) applying a curable coating composition to a substrate, some or all of which is electrically conductive, to form an uncured coating thereon; (b) applying a resist over the uncured coating; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the uncured coating; (e) removing the exposed areas of the uncured coating; and (f) heating the coated substrate of step (e) to a temperature and for a time sufficient to cure the coating. Also disclosed is a process of fabricating a circuit assembly.

公开(公告)号：EP1322145A3

公开(公告)日：2003-07-02

申请号：EP03005092.6

申请日：1999-02-22

Applicant: Saint-Gobain Glass France

Inventor： Rouberol, Marc

IPC: H05K3/06 ,  C03C17/23 ,  C03C17/245 ,  H01L31/18

CPC classification number: H05K3/067 ,  C03C17/23 ,  C03C17/245 ,  C03C17/2453 ,  C03C2217/211 ,  C03C2217/231 ,  C03C2217/24 ,  C03C2217/241 ,  C03C2218/152 ,  C03C2218/33 ,  H01L31/1884 ,  H05K3/061 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0326 ,  Y02E10/50 ,  Y10S134/902

Abstract: Procédé de gravure chimique d'une couche (2) à propriétés de conduction électrique, de type oxyde métallique dopé, sur un substrat transparent (1) de type verrier, comportant au moins une étape de dépôt d'un masque (3) sur la couche à graver, et une étape d'attaque de la couche (2) dans les zones (2') dépourvues du masque qui consiste à mettre en contact les zones de la couche (2') dans une solution à pH acide puis à projeter du zinc, ou bien dans une solution à pH alcalin puis à projeter de l'aluminium, le zinc ou l'aluminium étant pulvérulent.

公开(公告)号：EP1204698A1

公开(公告)日：2002-05-15

申请号：EP00950817.7

申请日：2000-07-28

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce, E. ,  LAMMON-HILINSKI, Kami ,  ROBERTSON, Walter, J. ,  WU, Xiang ,  VELPARI, Vedagiri ,  LAWTON, Ernest, L. ,  RICE, William, B.

IPC: C08J5/08 ,  H05K1/03 ,  C03C25/10

CPC classification number: C08J5/08 ,  C03C25/00 ,  C03C25/10 ,  C03C25/47 ,  C03C25/48 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and lamellar particles having a thermal conductivity of at least 1 Watt per meter K at a temperature of 300K. The present invention also provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and non-hydratable, lamellar particles. The present invention further provides an at least partially coated fiber strand comprising a plurality of fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said fibers, the resin compatible coating composition comprising: (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention also provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles having a Mohs' hardness value which does not exceed the Mohs' hardness value of said glass fibers; and (b) at least one polymeric material. The present invention further provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of hollow, non-heat expandable organic particles; and (b) at least one lubricious material different from the at least one hollow organic particle.

Abstract translation: 本发明提供包含多根纤维的至少部分涂覆的纤维束，所述涂层包含有机组分和在300K的温度下具有至少1瓦/米K的热导率的层状颗粒。 本发明还提供包含多根纤维的至少部分涂覆的纤维束，所述涂层包含有机组分和不可水合的层状颗粒。 本发明还提供至少部分涂覆的纤维束，其包含多种纤维，所述纤维束在至少一种所述纤维的至少一部分表面上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含：（a） 由选自非热膨胀性有机材料，无机聚合物材料，非热膨胀性复合材料及其混合物的材料形成的多个离散颗粒，所述颗粒具有足以使纤维束湿润的平均粒度; （b）不同于所述多个离散颗粒的至少一种润滑材料; 和（c）至少一种成膜材料。 本发明还提供至少部分涂覆的纤维束，其包含多种玻璃纤维，所述纤维束在至少一种所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含： ）具有不超过所述玻璃纤维的莫氏硬度值的莫氏硬度值的多个层状无机颗粒; 和（b）至少一种聚合物材料。 本发明进一步提供一种至少部分涂覆的纤维束，其包含多种玻璃纤维，所述玻璃纤维在至少一种所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含： ）多个中空非热膨胀性有机颗粒; 和（b）至少一种不同于至少一种中空有机颗粒的润滑材料。

公开(公告)号：EP1204696A1

公开(公告)日：2002-05-15

申请号：EP00950780.7

申请日：2000-07-28

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce, E. ,  LAMMON-HILINSKI, Kami ,  ROBERTSON, Walter, J. ,  WU, Xiang ,  VELPARI, Vedagiri ,  LAWTON, Ernest, L. ,  RICE, William, B.

IPC: C08J5/08 ,  H05K1/03 ,  C03C25/10

CPC classification number: C03C25/10 ,  C03C25/00 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles and (b) at least one polymeric material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of hollow, non-heat expandable organicparticles; and (b) at least one lubricious material different from the at least one hollow organic particle.

Abstract translation: 本发明提供至少部分涂覆的纤维束，其包含多个玻璃纤维，所述玻璃纤维在至少一个所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含：（a） 具有不超过所述玻璃纤维的莫氏硬度值的莫氏硬度值的多个层状无机颗粒; 和（b）至少一种聚合物材料。 本发明进一步提供了树脂相容涂料组合物的用途，该组合物包含：（a）由选自非热膨胀性有机材料，无机聚合材料，非热膨胀性复合材料及其混合物的材料形成的多个离散颗粒， 平均粒度足以使纤维束湿润的颗粒; （b）不同于所述多个离散颗粒的至少一种润滑材料; 和（c）至少一种成膜材料。 该树脂相容性涂料组合物还可以包含：（a）多个中空的非热膨胀性有机颗粒; 和（b）至少一种不同于至少一种中空有机颗粒的润滑材料。

公开(公告)号：EP1204613A1

公开(公告)日：2002-05-15

申请号：EP00948977.4

申请日：2000-07-28

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce, E. ,  LAMMON-HILINSKI, Kami ,  ROBERTSON, Walter, J. ,  WU, Xiang ,  VELPARI, Vedagiri ,  LAWTON, Ernest, L. ,  RICE, William, B.

IPC: C03C25/10 ,  C08J5/08 ,  H05K1/03

CPC classification number: C03C25/00 ,  C03C25/10 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and lamellar particles having a thermal conductivity of at least 1 Watt per meter K at a temperature of 300K. The present invention also provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and non-hydratable, lamellar particles. The present invention further provides an at least partially coated fiber strand comprising a plurality of fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said fibers, the resin compatible coating composition comprising: (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention also provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles having a Mohs' hardness value which does not exceed the Mohs' hardness value of said glass fibers; and (b) at least one polymeric material. The present invention further provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of hollow, non-heat expandable organic particles; and (b) at least one lubricious material different from the at least one hollow organic particle.

公开(公告)号：EP0805722A4

公开(公告)日：1998-04-22

申请号：EP95943952

申请日：1995-12-21

Applicant: CHROMALLOY GAS TURBINE CORP

Inventor： HINSON DAVID

IPC: C23F1/02 ,  C23F1/26 ,  H05K3/38 ,  B05D5/02

CPC classification number: H05K3/383 ,  C23F1/02 ,  C23F1/26 ,  H05K2201/0116 ,  H05K2201/0166 ,  H05K2201/0373 ,  H05K2203/0769

Abstract: A process for roughening a metal surface is provided comprising applying a coating to the metal surface wherein the coating is a temporary barrier to an etchant attacking the metal surface and the coating is susceptible to the etchant gradually removing the coating, and then etching the coated metal surface with an aqueous bath containing the etchant effective to produce a roughened metal surface.

Abstract translation: 提供了一种使金属表面粗糙化的方法，其包括向金属表面施加涂层，其中涂层是临时阻挡侵蚀金属表面的蚀刻剂，并且涂层易于蚀刻剂逐渐去除涂层，然后蚀刻涂覆的金属 具有含有蚀刻剂的水浴的表面有效地产生粗糙的金属表面。