公开(公告)号：EP0858866A1

公开(公告)日：1998-08-19

申请号：EP98300763.4

申请日：1998-02-03

申请人： Applied Materials, Inc.

发明人： Kroeker, Tony ,  Hudgens, Jeffrey C.

IPC分类号： B25J9/10 ,  H01L21/00

CPC分类号： H01L21/68707 ,  B25J9/107 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/141

摘要： The disclosure relates to a robot that can transfer a workpiece, such as a silicon wafer, at increased speeds and accelerations/decelerations. A robot wrist (100) mechanically clamps a workpiece (35) to a workpiece handling member (86) of an extendable robot arm. The wafer clamp selectively applies sufficient force to center the workpiece and prevent slippage and damage to the workpiece during rapid rotation and radial movement of the handling member. In one embodiment, a clamp for securing silicon wafers uses two independent clamp fingers (102, 104) to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that wafers are normally clamped except during full extension of the wafer handling member to deliver or pickup a wafer.

摘要翻译： 本公开涉及一种能够以增加的速度和加速度/减速度传送诸如硅晶片的工件的机器人。 机器人手腕（100）将工件（35）机械地夹紧到可伸缩的机器人手臂的工件处理构件（86）上。 晶片夹具选择性地施加足够的力以使工件居中，并且在处理构件的快速旋转和径向移动期间防止滑动和损坏工件。 在一个实施例中，用于固定硅晶片的夹具使用两个独立的钳指（102,104）来以最小的颗粒产生和晶片损坏来定位和保持晶片。 夹具被设计成使得晶片通常被夹紧，除非在晶片处理构件的完全延伸期间提供或拾取晶片。

公开(公告)号：EP0827194A4

公开(公告)日：1998-07-29

申请号：EP96912243

申请日：1996-04-25

申请人： TOKYO ELECTRON LTD

发明人： KUMASAKA IWAO ,  KUBO KOJI ,  SUZUKI MAKOTO ,  TSUNODA YUJI

IPC分类号： B25J19/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/02 ,  H01L21/677 ,  H01L21/68 ,  B01J19/00 ,  H01L21/22 ,  H01L21/66

CPC分类号： H01L21/67276 ,  H01L21/67242 ,  H01L21/67778 ,  Y10S414/137 ,  Y10S414/139

摘要： An exclusively used carrier (EQMC) containing wafers (EQMW) for monitoring heat-treatment equipment is housed on a carrier storing shelf (32). An equipment monitoring parameter setting section (62) sets the frequency at which wafers (EQMW) are transferred into a heat-treating furnace (21), the number of wafers on a wafer boat (23) and the positions where the wafers are placed on the wafer boat (23). For every period determined by the set frequency, the wafers (EQMW) are placed in dummy wafer holding areas (D) at both the upper and lower end sections of the board (23) and subjected to heat-treatment. After the heat-treatment the wafers (EQMW) are transferred to an inspecting device. The state of the heat-treatment equipment is recognized from the treated states of the wafers (EQMW). In such a way, during the treatment of semiconductor wafers with a batch type heat-treatment equipment, the state of the heat-treatment equipment is monitored using the monitoring wafers and, the operation of the heat-treatment equipment is facilitated.

公开(公告)号：EP0834907A2

公开(公告)日：1998-04-08

申请号：EP97307707.6

申请日：1997-09-30

申请人： Applied Materials, Inc.

发明人： Wytman, Joe

IPC分类号： H01L21/00

CPC分类号： H01L21/67748 ,  H01L21/67757 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A dual stage load lock (10) is provided for transfer of semiconductor wafers (W) between an environment at atmospheric pressure and a high vacuum environment, such as a wafer processing system. The dual stage load lock includes a first load lock chamber (12) and a second load lock chamber (14) separated by a dividing ledge (20) which extends a distance inwardly from the inner wall of the load lock assembly. The lower load lock chamber selectively communicates with a transfer chamber (100) of the processing system, and is maintained at high vacuum. The upper load lock chamber selectively communicates with the external environment at atmospheric pressure. Therefore, the environment of the upper load lock chamber may vary between atmospheric pressure, when wafers are transferred between the load lock and the outside environment, and high vacuum, when the wafers are transferred between the first and second chambers of the load lock. The load lock may include modular chamber segments that can be arranged in a variety of configurations. A method for transferring wafers through the load lock is also provided.

摘要翻译： 提供了一种双级负载锁（10），用于在大气压的环境和诸如晶片处理系统的高真空环境之间传送半导体晶片（W）。 双级负载锁包括第一负载锁定室（12）和第二负载锁定室（14），所述第一负载锁定室（12）由分隔凸缘（20）分开，所述分隔凸缘从所述负载锁定组件的内壁向内延伸一定距离。 下部加载锁定室选择性地与处理系统的传送室（100）连通，并保持在高真空度。 上部负载锁定室在大气压下选择性地与外部环境连通。 因此，当晶片在负载锁的第一和第二室之间转移时，上部负载锁定室的环境可以在大气压力之间，当晶片在负载锁定和外部环境之间传递时产生高真空。 负载锁定可以包括可以以各种配置布置的模块化室段。 还提供了通过负载锁转移晶片的方法。

公开(公告)号：EP0833374A2

公开(公告)日：1998-04-01

申请号：EP97115096.6

申请日：1997-09-01

申请人： KOKUSAI ELECTRIC CO., LTD.

发明人： Suda, Atsuhiko, c/o Kokusai Electric co., Ltd. ,  Toyoda, Kazuyuki, c/o Kokusai Electric co., Ltd. ,  Makiguchi, Issei, c/o Kokusai Electric co., Ltd. ,  Ozawa, Makoto, c/o Kokusai Electric co., Ltd.

IPC分类号： H01L21/00 ,  B25J9/10

CPC分类号： H01L21/68707 ,  H01L21/67745 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/141

摘要： A substrate processing apparatus (1) comprises a substrate transfer section (10), connection modules (300) attached to the substrate transfer section (10), and a first substrate transfer robot (20) in the substrate transfer section (10) capable of transferring substrates (5) to the connection modules (300). The connection module (300) comprises a substrate processing chamber (56), first and second intermediate chambers (54, 52) between the substrate processing chamber (56) and the substrate transfer section (10). The second intermediate chamber (52) is provided with a first substrate holder (70), the substrate processing chamber (56) is provided with a second substrate holder (90), and the first intermediate chamber (54) is provided with a substrate transfer device (80) capable of mounting a plurality of the substrates (5) held being stacked in the vertical direction by the first substrate holder (70), onto the second substrate holder (90) such that the substrates (5) are arranged side by side in the horizontal direction. The invention provides a substrate processing apparatus having a high substrate processing efficiency and a high throughput.

摘要翻译： 基板处理装置（1）包括基板传送部（10），连接到基板传送部（10）的连接模块（300），以及在基板传送部（10）中的第一基板传送机械手（20） 将基板（5）传送到连接模块（300）。 连接模块（300）包括衬底处理室（56），衬底处理室（56）和衬底传送部分（10）之间的第一和第二中间室（54,52）。 第二中间室（52）设置有第一衬底保持器（70），衬底处理室（56）设置有第二衬底保持器（90），并且第一中间室（54）设置有衬底传送 能够将通过第一基板保持件（70）在垂直方向上保持堆叠的多个基板（5）安装在第二基板保持架（90）上的装置（80），使得基板（5）以 侧在水平方向。 本发明提供了具有高的基板处理效率和高产量的基板处理装置。

公开(公告)号：EP0530973B1

公开(公告)日：1998-03-04

申请号：EP92307052.8

申请日：1992-08-03

申请人： HITACHI, LTD.

发明人： Nishihata, Kouji ,  Tamura, Naoyuki ,  Kato, Shigekazu ,  Itou, Atsushi ,  Tsubone, Tsunehiko

IPC分类号： G05B19/04 ,  G05B19/418

CPC分类号： G05B19/4184 ,  G05B19/41845 ,  G05B2219/31361 ,  G05B2219/31362 ,  G05B2219/35291 ,  G05B2219/45026 ,  Y02P90/14 ,  Y02P90/16 ,  Y10S414/135 ,  Y10S414/139 ,  Y10S414/14

公开(公告)号：EP0772229A2

公开(公告)日：1997-05-07

申请号：EP96202731.4

申请日：1996-09-30

申请人： DELCO ELECTRONICS CORPORATION

发明人： Combs, Christopher David ,  Baker, Andrew Russell ,  Davidson, Steven Lee ,  Rezsonya, Thomas Carl

IPC分类号： H01L21/00

CPC分类号： H01L21/67144 ,  Y10S414/138 ,  Y10S414/139 ,  Y10T29/49133 ,  Y10T29/49819 ,  Y10T29/49821 ,  Y10T29/49822 ,  Y10T29/53013 ,  Y10T29/53187 ,  Y10T29/53191

摘要： A vertical wafer compact flip chip feeder device includes a loading station for providing a loading location where a flip chip wafer having first and second planar surfaces is received such that the first and second planar surfaces are substantially perpendicular to a first plane. The flip chip feeder device further includes a pick-up station for providing a pick-up location where individual flip chips are retrieved from the flip chip wafer. A wafer translating assembly translates the flip chip wafer between the loading and pick-up stations with the first and second planar surfaces of the flip chip wafer remaining substantially perpendicular to the first plane. A chip pick-up assembly retrieves the individual flip chips from the flip chip wafer at the pick-up station and flips the individual flip chips to a flipped position such that first and second planar surfaces of the individual flip chips are substantially parallel with the first plane.

公开(公告)号：EP0692815A3

公开(公告)日：1996-03-20

申请号：EP95304790.9

申请日：1995-07-10

申请人： APPLIED MATERIALS, INC.

发明人： Wong, Jerry ,  Toshima, Masatom M ,  Law, Kam S. ,  Maydn, Dan ,  Turner,Norman L.

IPC分类号： H01L21/00

CPC分类号： H01L21/68742 ,  H01L21/68778 ,  Y10S414/136 ,  Y10S414/139 ,  Y10S414/141

摘要： A chamber (10) for processing substrates (12) includes a support member (14) therein which is suspended from a sidewall of the chamber. The support member includes multiple planar faces (30) for receiving substrates thereon, and is rotatable by a drive member (16) through a coupling (34) about a horizontal axis to position the multiple planar faces in a horizontal position (Fig 2) to place the substrates on the planar faces or remove the substrates from the planar faces, and a second position to place the substrates in a non-horizontal position (Fig 3) for processing. A clamping and lifting apparatus (32) is provided on the support member. The clamping and lifting apparatus is positionable, with respect to the support member, in an extended position to permit a substrate to be positioned between the clamping and lifting assembly and the support member, and in a retracted position to clamp the substrate to the support member. A clamp actuator (200) is disposed on the chamber wall to move the clamping and lifting assembly (32) between the extended and retracted positions.

公开(公告)号：EP0634787A1

公开(公告)日：1995-01-18

申请号：EP94305115.1

申请日：1994-07-13

申请人： APPLIED MATERIALS, INC.

发明人： Somekh, Sasson ,  Fairbairn, Kevin ,  Kolstoe, Gary M. ,  White, Gregory W. ,  Faraco Jr.,W.George

IPC分类号： H01L21/00

CPC分类号： H01L21/6838 ,  H01L21/67742 ,  H01L21/67748 ,  Y10S294/907 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/141

摘要： A semiconductor wafer processing system for processing wafers (22) from a wafer storage cassette (24) includes a wafer transfer chamber (14); a wafer storage elevator (20) within the transfer chamber; one or more wafer processing chambers (12); and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The environment of the storage chamber varies in pressure between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm (16); a thin flat wafer carrying blade (18) at the leading end of the robot arm and configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray (40) which is configured for removable engagement with the blade and for engaging and positively positioning a wafer (22) from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated environment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper (18') and lower (18'') halves together with defining vacuum channels and capacitive position sensors.

摘要翻译： 一种用于从晶片存储盒（24）处理晶片（22）的半导体晶片处理系统包括晶片传送室（14）; 传送室内的晶片存储电梯（20）; 一个或多个晶片处理室（12）; 以及晶片传送装置，用于在与传送室和电梯之间以及电梯和处理室之间的标准存储盒之间传送晶片。 当从外部接收晶片时，储存室的环境在大气压之间变化，并且在将晶片转移到处理室或从处理室转移时的低于大气压。 传送装置包括机器人臂（16）; 在所述机器人臂的前端处的薄平坦晶片承载叶片（18），并且构造成用于从所述存储盒或电梯接合晶片; 以及晶片支撑盘（40），其被配置为可移除地与所述刀片接合并且用于接合并且将晶片（22）从所述电梯或处理室内的支撑座接合并且正确定位。 当传送装置在抽空环境中在电梯和处理室之间移动晶片时，托盘与刀片接合并且有助于在运输过程中保持晶片。 当晶片在大气压力下在盒和电梯之间转移时，托盘从叶片脱离并放置在电梯上的静止位置，并且通过单独的刀片执行晶片转移，其中与叶片成一体的真空拾取器 。 叶片包括上部（18'）和下部（18“）半部以及限定的真空通道和电容式位置传感器。

公开(公告)号：EP0504053B1

公开(公告)日：1995-01-11

申请号：EP92400648.9

申请日：1992-03-12

申请人： FRANCE TELECOM

发明人： Houzay, Françoise ,  Moison, Jean-Marie ,  Nissim, Yves

IPC分类号： H01L21/00

CPC分类号： H01L21/67161 ,  H01L21/67356 ,  H01L21/67363 ,  H01L21/67386 ,  H01L21/67393 ,  Y10S414/139

公开(公告)号：EP0593367A1

公开(公告)日：1994-04-20

申请号：EP93402534.7

申请日：1993-10-14

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE

发明人： Doche, Claude

IPC分类号： H01L21/00 ,  B65G65/00

CPC分类号： H01L21/67769 ,  H01L21/67353 ,  H01L21/67748 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S414/137 ,  Y10S414/139

摘要： Le système permet le stockage et la distribution d'objets plats un par un vers des postes de travail différents (6).
Il est constitué de modules de stockage (2), de modules de transport (4, 4A) et de modules de distribution (5). Tous ces modules sont placés les uns à côté des autres pour constituer une chaîne continue. Chaque module possède des rouleaux (7) fixés ou mobiles constituant deux pistes de déplacements superposées destinées à fonctionner dans deux sens opposés. Il se complète de râteliers portatifs (20).
Application au stockage et au transport de boîtes (1) contenant des plaques de silicium.

摘要翻译： 该系统允许存储和逐一不同的工作站（6）平面物体的分布。 它besteht的传输模块（4，4A）和分配的模块（5）的存储模块（2），。 所有合成模块被置于一个在另一个的旁边，以构成连续的链。 每个模块具有（7）构成预期在两个相反方向操作的两个叠加的移动轨迹的两个固定的或移动的滚子。 它是由便携式机架（20）完成。 应用的存储和（1）含有硅片盒运输。