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    STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF
    43.
    发明公开
    STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF 审中-公开
    结构性粘接材料及其用于绑定用途

    公开(公告)号：EP2776487A1

    公开(公告)日：2014-09-17

    申请号：EP12784801.8

    申请日：2012-10-19

    申请人： Cytec Technology Corp.

    发明人： SANG, Junjie, Jeffrey ,  KOHLI, Dalip, Kumar ,  SHAH, Kunal, Gaurang

    IPC分类号： C08G59/42 ,  C08G59/50 ,  C09J163/00

    CPC分类号： C09J163/00 ,  B32B7/12 ,  B32B27/18 ,  B32B27/38 ,  B32B2250/03 ,  B32B2264/0207 ,  B32B2270/00 ,  B32B2405/00 ,  C08G59/4253 ,  C08G59/50 ,  C08G59/5026 ,  C08G59/5073 ,  C08K3/36 ,  C08L63/00 ,  C08L81/06 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/254 ,  Y10T428/31515 ,  Y10T428/31522 ,  C08L51/04 ,  C08L101/00

    摘要： A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200°F (93 °C). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler as a rheology/thixotropy modifying component. The weight ratio of part (A) to part (B) is within the range of 3:2 to 10:2. In another embodiment, the structural adhesive composition is based on a one-part system which includes the components of the resinous part (A) in the two-part system mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine. The one-part system is curable within the temperature range of 140-300°F (60-150°C). The paste adhesive disclosed herein has film-like properties and is particularly useful in rapid-assembly aerospace structure bonding applications.

    SPACER PARTICLE FOR RESIN COMPOSITION LAYER AND USE THEREOF
    46.
    发明公开
    SPACER PARTICLE FOR RESIN COMPOSITION LAYER AND USE THEREOF 有权
    维多利亚州立大学

    公开(公告)号：EP2762500A1

    公开(公告)日：2014-08-06

    申请号：EP12836070.8

    申请日：2012-09-27

    申请人： Sekisui Plastics Co., Ltd.

    发明人： HARADA, Ryosuke ,  TAKAHASHI Tomoyuki ,  ISHIMORI Fumitaka

    IPC分类号： C08F2/18 ,  B32B27/18 ,  B32B27/30

    CPC分类号： C08F20/12 ,  C08F2/18 ,  C08F2500/24 ,  C08L33/08 ,  G02F1/1339 ,  Y10T428/254 ,  Y10T428/2982

    摘要： Spacer particles for a resin composition layer have a compressive strength at 10% compressive deformation at room temperature of 0.05 to 10 MPa or a compressive strength at room temperature of 0.01 to 2 N determined as a compressive load at 10% compressive deformation when the spacer particles are added into the resin composition layer so that a resin composition layer contains 48% by mass of the spacer particles, have a rate of change in compressive strength at 10% compressive deformation by a temperature change from room temperature to 50°C of 5% or less, a rate of change in compressive strength at 10% compressive deformation by a temperature change from -20°C to room temperature of 30% or less, or a rate of change in compressive strength by a temperature change from -50°C to 50°C of 15% or less determined as a compressive load at 10% compressive deformation, when the spacer particles are added into the resin composition layer so that a resin composition layer contains 48% by mass of the spacer particles, and have a volume average particle diameter of 2 to 200 µm and a coefficient of variation in particle diameter of 15% or less.

    摘要翻译： 用于树脂组合物层的间隔颗粒在室温为0.05至10MPa时具有10％压缩变形的压缩强度或在室温下的压缩强度为0.01至2N，作为10％压缩变形时的压缩载荷，当间隔颗粒 加入到树脂组合物层中，使得树脂组合物层含有48质量％的间隔颗粒，通过从室温至50℃的温度变化为10％时的压缩强度变化率为5％ 以下，由-20℃至室温的温度变化为30％以下的10％压缩变形时的压缩强度的变化率，或压缩强度的变化率由-50℃的温度变化 至50℃，15％以下，作为10％压缩变形时的压缩载荷，当间隔剂颗粒加入到树脂组合物层中，使得树脂组合物层含有48％ 间隔颗粒的体积平均粒径为2〜200μm，粒径的变异系数为15％以下。