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1330 条记录 (耗时 0.033 秒)

    Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
    52.
    发明授权
    Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine 有权
    用于在浸没式光刻机中在晶片交换期间将浸没流体保持在投影透镜下方的间隙中的设备和方法

    公开(公告)号：EP2613194B1

    公开(公告)日：2015-09-16

    申请号：EP13154186.4

    申请日：2004-03-17

    申请人： Nikon Corporation

    发明人： Binnard, Michael

    IPC分类号： G03B27/32 ,  G03B27/42 ,  G03B27/58 ,  G03F7/20 ,  G03B27/52

    CPC分类号： G03F7/70341 ,  G03B27/52 ,  G03F7/70716 ,  G03F7/70725 ,  G03F7/70733

    摘要： An apparatus and method for maintaining immersion fluid (212) in the gap adjacent the projection lens (16) during the exchange of a work piece (208) in a lithography machine (10) is disclosed. The apparatus and method includes an optical assembly (16) configured to project an image onto a work piece (208) and a stage assembly (202) including a work piece table (204) configured to support the work piece (208) adjacent the optical assembly (16). An environmental system (26) is provided to supply and remove an immersion fluid (212) from a gap between the optical assembly (16) and the work piece (208) on the stage assembly (202). After exposure of the work piece (208) is complete, an exchange system (216) removes the work piece (208) and replaces it with a second work piece. An immersion fluid containment system (214) is provided to maintain the immersion liquid (212) in the gap during removal of the first work piece (208) and replacement with the second work piece.

    Projection optical system, exposure apparatus and exposure method
    53.
    发明授权
    Projection optical system, exposure apparatus and exposure method 有权
    一种投影光学系统，曝光装置及曝光方法

    公开(公告)号：EP2660852B1

    公开(公告)日：2015-09-02

    申请号：EP13174484.9

    申请日：2006-05-08

    申请人： Nikon Corporation

    发明人： Omura, Yasuhiro ,  Okada, Takaya ,  Nagasaka, Hiroyuki

    IPC分类号： H01L21/027 ,  G02B13/24 ,  G02B17/08 ,  G03F7/20 ,  G02B1/06 ,  G02B21/33

    CPC分类号： G03F7/70725 ,  G02B1/06 ,  G02B17/08 ,  G02B17/0892 ,  G02B21/33 ,  G03F7/702 ,  G03F7/70225 ,  G03F7/70341

    摘要： An immersion projection optical system having, for example, a catadioptric and off-axis structure, reduces the portion of an image space filled with liquid (immersion liquid). The projection optical system, which projects a reduced image of a first plane onto a second plane through the liquid, includes a refractive optical element (Lp) arranged nearest to the second plane. The refractive optical element includes a light emitting surface (Lpb) shaped to be substantially symmetric with respect to two axial directions (XY-axes) perpendicular to each other on the second plane. The light emitting surface has a central axis (Lpba) that substantially coincides with a central axis (40a) of a circle (40) corresponding to a circumference of a light entering surface (Lpa) of the refractive optical element. The central axis of the light emitting surface is decentered in one of the two axial directions (Y-axis) from an optical axis (AX).

    Wafer table for immersion lithography
    55.
    发明公开
    Wafer table for immersion lithography 有权
    用于浸没式光刻的晶圆台

    公开(公告)号：EP2853943A3

    公开(公告)日：2015-05-27

    申请号：EP14189351.1

    申请日：2004-06-02

    申请人： Nikon Corporation

    发明人： Hazelton, Andrew J. ,  Takaiwa, Hiroaki

    IPC分类号： G03F7/20

    CPC分类号： G03F7/70975 ,  G03F7/70341 ,  G03F7/707 ,  G03F7/70716 ,  Y10T29/49826

    摘要： Methods and apparatus for allowing a liquid to be substantially contained between a lens (46) and a wafer table (51) assembly of an immersion lithography system are disclosed. According to one aspect of the present invention, an exposure apparatus includes a lens (46) and a wafer table (51) assembly. The wafer table (51) assembly has a top surface, and is arranged to support a wafer (64) to be moved with respect to the lens (46) as well as at least one component (350). The top surface of the wafer (64) and the top surface of the component (350) are each at substantially a same height as the top of the wafer table (51) assembly. An overall top surface of the wafer table (51) assembly which includes the top surface of the wafer (64), the top surface of the wafer table (51) assembly, and the top surface of the at least one component (350) is substantially planar.

    摘要翻译： 公开了允许液体基本容纳在浸没式光刻系统的透镜（46）和晶片台（51）组件之间的方法和设备。 根据本发明的一个方面，一种曝光设备包括透镜（46）和晶片台（51）组件。 晶片台（51）组件具有顶表面，并被布置成支撑相对于透镜（46）以及至少一个部件（350）移动的晶片（64）。 晶片（64）的顶表面和部件（350）的顶表面各自处于与晶片台（51）组件的顶部基本相同的高度。 包括晶片（64）的顶部表面，晶片台（51）组件的顶部表面和至少一个部件（350）的顶部表面的晶片台（51）组件的整个顶部表面是 大致平面。

    APPARATUS AND METHOD FOR PROVIDING FLUID FOR IMMERSION LITHOGRAPHY
    57.
    发明授权
    APPARATUS AND METHOD FOR PROVIDING FLUID FOR IMMERSION LITHOGRAPHY 有权
    装置和方法用于提供流体的浸液光刻

    公开(公告)号：EP1660925B1

    公开(公告)日：2015-04-29

    申请号：EP04778426.9

    申请日：2004-07-16

    申请人： NIKON CORPORATION

    发明人： POON, Alex Ka Tim ,  KHO, Leonard Wai Fung

    IPC分类号： G03F7/20

    CPC分类号： G03F7/70341 ,  G03F7/70358 ,  G03F7/708 ,  G03F7/70858

    摘要： Embodiments of the present invention are directed to a system and a method of controlling the flow and pressure of immersion fluid to provide stable conditions for immersion lithography. An immersion fluid is provided in a space (34) between a last optical element of an optical projection system and a workpiece during the immersion lithography process. For this purpose,a nozzle (20) is provided configured to supply immersion fluid in the gap between the last optical element and the workpiece, wherein the nozzle includes an inner cavity (34) to retain the immersion fluid in the gap and an outer cavity (53) to recover immersion fluid that exits the inner cavity.

    Exposure apparatus, exposure method, and method for producing device
    58.
    发明授权
    Exposure apparatus, exposure method, and method for producing device 有权

    公开(公告)号：EP2466624B1

    公开(公告)日：2015-04-22

    申请号：EP12159208.3

    申请日：2004-02-26

    申请人： Nikon Corporation

    发明人： Nagasaka, Hiroyuki

    IPC分类号： H01L21/027 ,  G03F7/20

    CPC分类号： G03F7/70733 ,  G03F7/70341 ,  G03F7/708 ,  G03F7/7095

    摘要： An exposure apparatus EX exposes a substrate P by projecting an image of a predetermined pattern through a liquid 1 onto the substrate. The exposure apparatus includes a projection optical system which performs the projection, and a liquid supply mechanism 10 which supplies the liquid onto the substrate to form a liquid immersion area AR2 on a part of the substrate. The liquid supply mechanism supplies the liquid 1 onto the substrate P simultaneously from a plurality of positions which are apart, in a plurality of different directions, from the projection area AR1. The exposure apparatus is capable of forming the liquid immersion area stably and recovering the liquid satisfactorily. It is possible to perform the exposure process accurately while avoiding, for example, the outflow of the liquid to the surroundings.

    WAFER TABLE FOR IMMERSION LITHOGRAPHY
    60.
    发明授权
    WAFER TABLE FOR IMMERSION LITHOGRAPHY 有权
    晶片平台的浸液光刻

    公开(公告)号：EP1652003B1

    公开(公告)日：2015-01-07

    申请号：EP04754129.7

    申请日：2004-06-02

    申请人： NIKON CORPORATION

    发明人： HAZELTON, Andrew, J. ,  TAKAIWA, Hiroaki

    IPC分类号： G03F7/20

    CPC分类号： G03F7/70975 ,  G03F7/70341 ,  G03F7/707 ,  G03F7/70716 ,  Y10T29/49826

    摘要： Methods and apparatus for allowing a liquid to be substantially contained between a lens (46) and a wafer table (51) assembly of an immersion lithography system are disclosed. According to one aspect of the present invention, an exposure apparatus includes a lens (46) and a wafer table (51) assembly. The wafer table (51) assembly has a top surface, and is arranged to support a wafer (64) to be moved with respect to the lens (46) as well as at least one component (350). The top surface of the wafer (64) and the top surface of the component (350) are each at substantially a same height as the top of the wafer table (51) assembly. An overall top surface of the wafer table (51) assembly which includes the top surface of the wafer (64), the top surface of the wafer table (51) assembly, and the top surface of the at least one component (350) is substantially planar.