AIR COOLING OF ELECTRONIC DRIVER IN A LIGHTING DEVICE
    61.
    发明公开
    AIR COOLING OF ELECTRONIC DRIVER IN A LIGHTING DEVICE 有权
    爱尔兰BELEUCHTUNGSVORRICHTUNG的LUFTKÜHLUNGEINES ELEKTRONISCHEN TREIBERS

    公开(公告)号:EP2997296A1

    公开(公告)日:2016-03-23

    申请号:EP14725340.5

    申请日:2014-04-18

    摘要: A lighting device including one or more solid state light sources providing air cooling of the electronic driver is disclosed. The driver receives power and provides it to the light source(s). The device also includes a first and a second housing. The first housing contains, at least in part, the driver, and includes a support having an exterior and an interior, that provides mechanical support to the second housing connected thereto. The interior includes a first opening. The second housing is a heat sink for the device. The second housing has an interior portion, with a second opening corresponding to the first opening, and an exterior portion, having a plurality of external openings. Air entering an external opening is able to mix with air in the first housing by flowing through the first opening and the corresponding second opening, which cools the electronic driver.

    摘要翻译: 公开了一种包括提供电子驱动器的空气冷却的一个或多个固态光源的照明装置。 驾驶员接收电力并将其提供给光源。 该装置还包括第一和第二壳体。 第一壳体至少部分地包括驱动器,并且包括具有外部和内部的支撑件,其向与其连接的第二壳体提供机械支撑。 内部包括第一开口。 第二个外壳是设备的散热器。 第二壳体具有内部部分,具有对应于第一开口的第二开口和具有多个外部开口的外部部分。 进入外部开口的空气能够通过流过第一开口和冷却电子驱动器的对应的第二开口而与第一壳体中的空气混合。

    Luminaire
    66.
    发明公开
    Luminaire 有权
    泛光灯

    公开(公告)号:EP2865940A2

    公开(公告)日:2015-04-29

    申请号:EP14382413.4

    申请日:2014-10-22

    申请人: Simon, S.A.U.

    摘要: Luminaire which incorporates as source or light sources LEDs or other lights whose heat is dissipated towards their rear part and is structurally designed to favour the dissipation of the said heat avoiding any negative effect on the various elements that comprise the lighting fixture. The housing comprises two areas, one lower area (4a) and one upper area (4b) separated by, at least one point of juncture (4c, 4d), that determines the existence of at least one intermediate space (5) between the upper area (4b) comprising a housing (7) for several components and the lower area (4a) comprising the lamps (2) and the lamp-holding support (3).

    摘要翻译: 将源或光源作为LED或其他光源向其后部散发热量并且在结构上设计成有利于散热的所述灯具避免了对构成照明器材的各种元件的任何负面影响。 壳体包括两个区域,一个下区域(4a)和一个上区域(4b),所述两个区域由至少一个连接点(4c,4d)分隔开,所述连接点确定至少一个中间空间(5) 区域4b包括用于多个组件的壳体7和包括灯2和灯支撑支撑件3的下部区域4a。

    Luminaire and method of thermal radiation of the luminaire
    70.
    发明公开
    Luminaire and method of thermal radiation of the luminaire 审中-公开
    Leuchte und VerfahrenfürdieWärmestrahlungder Leuchte

    公开(公告)号:EP2642196A1

    公开(公告)日:2013-09-25

    申请号:EP12173788.6

    申请日:2012-06-27

    摘要: According to one embodiment, a luminaire includes: a light-emitting portion (20) having a light-emitting element; a circuit board (30) having a notch (31) or a through hole (32); an electronic component (40) mounted on a side of a second main surface (30b) opposite to a first main surface (30a) of the circuit board (30); a thermal radiator (10) provided on a side of the first main surface (30a) and including the light-emitting portion (20) disposed on the thermal radiator (10); a thermally-conductive medium (50) disposed on the side of the first main surface (30a) of the circuit board (30) and being in contact with the electronic component (40) through the notch (31) or the through hole (32), and capable of transferring heat generated by the electronic component (40) to the side of the first main surface (30a) of the circuit board (30); and an outer frame member (60) accommodating the light-emitting portion (20), the circuit board (30), the electronic component (40), and the thermally-conductive medium (50).

    摘要翻译: 根据一个实施例,一种照明器包括:具有发光元件的发光部分(20); 具有凹口(31)或通孔(32)的电路板(30); 安装在与所述电路板(30)的第一主表面(30a)相对的第二主表面(30b)侧的电子部件(40); 设置在所述第一主表面(30a)的一侧并且包括设置在所述散热器(10)上的所述发光部分(20)的散热器(10); 设置在所述电路板(30)的所述第一主表面(30a)侧并且通过所述凹口(31)或所述通孔(32)与所述电子部件(40)接触的导热介质(50) ),能够将由电子部件(40)产生的热量传递到电路基板(30)的第一主面(30a)侧。 以及容纳发光部(20)的外框构件(60),电路基板(30),电子部件(40)和导热介质(50)。