摘要:
A lighting device including one or more solid state light sources providing air cooling of the electronic driver is disclosed. The driver receives power and provides it to the light source(s). The device also includes a first and a second housing. The first housing contains, at least in part, the driver, and includes a support having an exterior and an interior, that provides mechanical support to the second housing connected thereto. The interior includes a first opening. The second housing is a heat sink for the device. The second housing has an interior portion, with a second opening corresponding to the first opening, and an exterior portion, having a plurality of external openings. Air entering an external opening is able to mix with air in the first housing by flowing through the first opening and the corresponding second opening, which cools the electronic driver.
摘要:
Ce dispositif comporte une carte électronique (1) comportant une surface avant (11), des moyens d'émission (2) de lumière montés sur la surface avant (11), un capot de protection agencé pour protéger la carte électronique (1) et les moyens d'émission (2), des moyens de transfert thermique agencés pour transférer la chaleur produite par les moyens d'émission (2) vers le milieu aquatique, le dispositif étant remarquable en ce que les moyens de transfert thermique comportent une couche de résine (3) thermiquement conductrice présentant une surface d'échange thermique (30) à contact direct avec le milieu aquatique, la couche de résine (3) étant agencée pour transférer la chaleur vers la surface d'échange thermique (30), et en ce que la couche de résine (3) est conformée pour assurer l'étanchéité du capot de protection avec la surface d'échange thermique (30).
摘要:
An LED lighting device comprising: a case unit 10 forming a light emitting space 11, wherein a plurality of resting surfaces 12 and 13 are formed at predetermined areas on the inner side of the case unit 10; a plurality of substrates 21 and 22 respectively rested on the plurality of resting surfaces 12 and 13, wherein a plurality of LEDs are mounted on each of the plurality of substrates 21 and 22; and a plurality of heat-dissipating units 30, 40, and 80 30 and 40 formed in the outer side of the case unit 10 for heat dissipation.
摘要:
A light assembly includes a light source circuit board, a plurality of light sources disposed on the light source circuit board, a housing thermally coupled to the light source circuit board and a lens cap assembly comprising a lens cap and a heat dissipation layer. The heat dissipated layer distributes heat from the light source circuit board through the lens cap and external to the light assembly.
摘要:
Luminaire which incorporates as source or light sources LEDs or other lights whose heat is dissipated towards their rear part and is structurally designed to favour the dissipation of the said heat avoiding any negative effect on the various elements that comprise the lighting fixture. The housing comprises two areas, one lower area (4a) and one upper area (4b) separated by, at least one point of juncture (4c, 4d), that determines the existence of at least one intermediate space (5) between the upper area (4b) comprising a housing (7) for several components and the lower area (4a) comprising the lamps (2) and the lamp-holding support (3).
摘要:
Underwater LED lights with enhanced cooling to allow the use of substantial numbers of high power LEDs. In all embodiments, the majority of the heat given off by the LEDs is transferred to the housing of the underwater light by heat transfer techniques other than by convection of the air or other gases within the enclosure, providing direct heat conveyance from the LEDs to or through the light enclosure walls, by conduction through a thermal conductor or by or as augmented by heat pipes to the inside wall of the enclosure or through the wall of the enclosure to the water. Various embodiments are disclosed.
摘要:
A light-emitting device (LED) engine (100) includes: a body (110) having a through-hole; a light-emitting module (130) that is disposed under the body, includes at least one light emitting device (C), and is disposed to expose a light-emitting surface via the through-hole; and a printed circuit board (120)(PCB) which is disposed under the body, to which the light-emitting module (130) is coupled, and includes a terminal unit for supplying power to the light-emitting module (130).
摘要:
A light-emitting device includes: a board (18); light-emitting elements (60a and 60b) interconnected in parallel and provided above a top face (65) of the board (18); light-emitting elements (60e and 60f), one of which is connected in series with the light-emitting element (60a) and the other of which is connected in series with the light-emitting element (60b), the light-emitting elements (60e and 60f) being interconnected in parallel; a metal pattern (67a) provided continuously under the light-emitting elements (60a and 60b), on an undersurface (28) of the board (18); and a metal pattern (67b) provided continuously under the light-emitting elements (60e and 60f), and isolated from the first metal pattern (67a).
摘要:
According to one embodiment, a luminaire includes: a light-emitting portion (20) having a light-emitting element; a circuit board (30) having a notch (31) or a through hole (32); an electronic component (40) mounted on a side of a second main surface (30b) opposite to a first main surface (30a) of the circuit board (30); a thermal radiator (10) provided on a side of the first main surface (30a) and including the light-emitting portion (20) disposed on the thermal radiator (10); a thermally-conductive medium (50) disposed on the side of the first main surface (30a) of the circuit board (30) and being in contact with the electronic component (40) through the notch (31) or the through hole (32), and capable of transferring heat generated by the electronic component (40) to the side of the first main surface (30a) of the circuit board (30); and an outer frame member (60) accommodating the light-emitting portion (20), the circuit board (30), the electronic component (40), and the thermally-conductive medium (50).