摘要:
A timing subsystem 10 including several test period generators for supplying a variety of timing signals to a device under test. Major, minor, and free-run period generators each supply various timing signals to a multiplexer 18, which selectively connects the timing signals to timing generators 20. A central processing unit 28 supplies data to the period generators and timing generators to define their respective timing signals. Timing signals generated by the major period generator 12 define the overall testing rate. The minor period generator 14 generates multiple timing signals within the periods of the major clock signals to permit higher clock rates. Timing signals that are independent of the major clock periods are generated by the free-run period generator 16. An external synchronizer circuit 26 provides a feedback loop from the device under test 22 to the major period generator. A reference driver trigger delay circuit 27 provides means for calibrating the timing generators. Each of the three period generators includes two interconnected timing interval generators 30 and 40 that alternately generate overlapping timing signals. Each timing interval generator includes a stop-restart oscillator 32, a counter 34, and a delay-line vernier 36. Upon the receipt of a start signal, the oscillator stops and restarts to align its clock pulses to the start signal. The oscillator output clocks the counter, which supplies a signal to the vernier when a preselected number is reached. The vernier delays the counter signal by a preselected delay and issus a signal that designates the end of the period.
摘要:
A plurality of signal applying and monitoring circuits are coupled to pins of an electronic device being testes to force test stimuli signals representing logic states or other parameters onto input pins of the device under test. The responses to the stimuli signals are monitored while the device is being tested. Each signal applying and monitoring circuit includes a node to be coupled to a pin of the device under test, a device power supply connected to the node for supplying a test bias signal, a comparison circuit connected to the node for indicating the relative magnitude of the test bias signal with respect to the bias level at the node, and a latch circuit responsive to the output signal produced by the comparison circuit. The device power supply is included for providing test bias signals to test power drain during functional testing. The transitions of the device power supply are monitored and latched for providing a record of the power drain of the device being tested. Other features are also disclosed.
摘要:
A system is disclosed which enables signals to be supplied at precisely desired times in an automatic test system. The apparatus includes a base delay memory which stores information related to a base time delay, while a vernier memory stores information relating to timing corrections to be made to the base time delay. The base delay memory controls a counter while the correction memory controls a vernier deskew apparatus for further delaying the output signal from the counter. To prevent carries from the vernier memory from influencing the base delay memory, the most significant bit of the vernier memory is of the same significance as the least significant bit of the base delay memory. The most significant bit of the vernier memory is also connected to drive the counter, in effect providing the counter with two least significant bits, and enabling a single base delay memory to control more than one signal timing paths.
摘要:
An apparatus for testing a thyristor valve includes: a current source circuit that provides an electric current when a thyristor valve as a test target is turned on; a voltage source circuit that provides a reverse voltage or a forward voltage when the thyristor valve is turned off; and a first auxiliary valve provided between a connection point between the thyristor valve and the voltage source circuit and the current source circuit, and that insulates the current source circuit from the voltage source circuit to protect the current source circuit from a high voltage of the voltage source circuit.
摘要:
The present invention discloses a method of testing a partially assembled multi-die device (1) by providing a carrier (300) comprising a device-level test data input (12) and a device-level test data output (18); placing a first die on the carrier, the first die having a test access port (100c) comprising a primary test data input (142), a secondary test data input (144) and a test data output (152), the test access port being controlled by a test access port controller (110); communicatively coupling the secondary test data input (144) of the first die to the device-level test data input (12), and the test data output (152) of the first die to the device-level test data output (18); providing the first die with configuration information to bring the first die in a state in which the first die accepts test instructions from its secondary test data input (144); testing the first die, said testing including providing the secondary test data input (144) of the first die with test instructions through the device-level test data input (12); and collecting a test result for the first die on the device-level test data output (18). Consequently, a die of a partially assembled multi-die device such as a System-in-Package may be tested using its integrated boundary scan test architecture.
摘要:
An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.
摘要:
A CMOS driver test configuration, which allows both leakage current and load current testing, using a single monitor, or current meter, located in a power lead of a tester connected to a power pad servicing the driver circuits. Both leakage testing and load current testing for CMOS drivers is described. The test configuration allows a plurality of driver circuits connected in parallel between power pads to be tested simultaneously. An ESD device, internal to the chip, is used as a load during load current testing in chip testing, and an external load is used during package testing in order to include the bonding means between the chip output pad of the driver and the package I/O pin in the current path during load current testing.
摘要:
A signal processing device (102) comprising a plurality of processing stages (106 to 108), each of the plurality of processing stages (106 to 108) being adapted for applying an input signal to each of at least one item under examination (109) to be coupled to a respective one of the plurality of processing stages (106 to 108), and at least one signal reconditioning unit (116), each of the at least one signal reconditioning unit (116) being adapted for reconditioning the input signal in a signal path between a preceding one of the plurality of processing stages (106) and a subsequent one of the plurality of processing stages (107).