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    LIQUID COOLING WITH A COOLING CHAMBER
    61.
    发明公开
    LIQUID COOLING WITH A COOLING CHAMBER 审中-公开

    公开(公告)号：EP3237992A4

    公开(公告)日：2018-01-03

    申请号：EP15886646

    申请日：2015-03-24

    Applicant: HEWLETT PACKARD ENTPR DEVELOPMENT LP

    Inventor： FRANZ JOHN P ,  CADER TAHIR ,  NORTON WILLIAM K

    IPC: G06F1/20 ,  H05K7/20

    CPC classification number: H05K7/20254 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20272 ,  H05K7/20772 ,  H05K7/20781

    Abstract: Example implementations relate to liquid cooling with a cooling chamber. For example, a system for liquid cooling with a cooling chamber can include a liquid cooling chamber in contact with a heat generating device within a computing device, the liquid cooling chamber to contain a liquid coolant and transfer heat from the heat generating device into a liquid circulation loop extending around a perimeter of the liquid cooling chamber. The system for liquid cooling with a cooling chamber can further include a comb structure adjacent to the liquid cooling chamber to transfer heat into the liquid circulation loop, and a liquid exit pipe coupled to the liquid circulation loop to direct a flow of the liquid coolant.

    LIQUID COOLING WITH A COOLING CHAMBER
    62.
    发明公开
    LIQUID COOLING WITH A COOLING CHAMBER 审中-公开
    用冷却室液体冷却

    公开(公告)号：EP3237992A1

    公开(公告)日：2017-11-01

    申请号：EP15886646.7

    申请日：2015-03-24

    Applicant: Hewlett Packard Enterprise Development LP

    Inventor： FRANZ, John P. ,  CADER, Tahir ,  NORTON, William K.

    IPC: G06F1/20

    CPC classification number: H05K7/20254 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20272 ,  H05K7/20772 ,  H05K7/20781

    Abstract: Example implementations relate to liquid cooling with a cooling chamber. For example, a system for liquid cooling with a cooling chamber can include a liquid cooling chamber in contact with a heat generating device within a computing device, the liquid cooling chamber to contain a liquid coolant and transfer heat from the heat generating device into a liquid circulation loop extending around a perimeter of the liquid cooling chamber. The system for liquid cooling with a cooling chamber can further include a comb structure adjacent to the liquid cooling chamber to transfer heat into the liquid circulation loop, and a liquid exit pipe coupled to the liquid circulation loop to direct a flow of the liquid coolant.

    Abstract translation: 示例性实现涉及用冷却室进行液体冷却。 例如，具有冷却室的液体冷却系统可包括与计算装置内的发热装置接触的液体冷却室，液体冷却室包含液体冷却剂并将热量从发热装置传递到液体中 循环回路围绕液体冷却室的周边延伸。 具有冷却室的液体冷却系统还可以包括与液体冷却室相邻的梳状结构以将热量传递到液体循环回路中，以及液体排出管，其耦合到液体循环回路以引导液体冷却剂的流动。

    TERMINAL HEAT DISSIPATION APPARATUS AND MOBILE TERMINAL
    63.
    发明公开
    TERMINAL HEAT DISSIPATION APPARATUS AND MOBILE TERMINAL 审中-公开
    ENDGERÄTEWÄRMEABLEITUNGSVORRICHTUNGUND MOBILESENDGERÄT

    公开(公告)号：EP3193570A4

    公开(公告)日：2017-08-02

    申请号：EP14881852

    申请日：2014-11-10

    Applicant: ZTE CORP

    Inventor： ZHANG YONGLIANG

    IPC: H05K7/20 ,  G06F1/16 ,  G06F1/20

    CPC classification number: H05K7/20336 ,  G06F1/1637 ,  G06F1/1656 ,  G06F1/1675 ,  G06F1/203 ,  G06F1/206 ,  G06F2200/201 ,  H04W88/02 ,  H05K7/2099 ,  H05K9/006

    Abstract: The disclosure discloses a device for terminal heat dissipation and a mobile terminal, including: a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected with the heat source chip and with the heat pipe via the same type of flexible thermal conductive solid; and a microporous array is arranged at a connection position between the flexible thermal conductive solids, which are in contact with the shield. By means of the disclosure, the problem in the related art that heat cannot be quickly conducted to the heat pipe due to the back-and-forth conversion of the conductive medium in the thermal conductive path is solved, and heat can therefore be quickly conducted to the heat pipe, speeding up an effect of heat dissipation.

    Abstract translation: 本发明公开了一种终端散热装置和移动终端，包括：热源芯片，热管和屏蔽罩，所述屏蔽罩位于热源芯片和热管之间，并与热源 源芯片和热管通过相同类型的柔性导热固体; 并且在与屏蔽层接触的柔性导热固体之间的连接位置处设置微孔阵列。 借助于本发明，解决了现有技术中由于导热介质在导热路径中发生往返变换而无法将热量快速传导至热管的问题，因此可以快速进行热量 加热管，加快散热效果。

    RACK FOR ELECTRONIC EQUIPMENT, AND INFORMATION PROCESSING DEVICE
    64.
    发明授权
    RACK FOR ELECTRONIC EQUIPMENT, AND INFORMATION PROCESSING DEVICE 有权
    GESTELLFÜRELEKTRONISCHE VORRICHTUNG UND INFORMATIONSVERARBEITUNGSVORRICHTUNG

    公开(公告)号：EP2787801B1

    公开(公告)日：2017-04-12

    申请号：EP11876495.0

    申请日：2011-12-01

    Applicant: Fujitsu Limited

    Inventor： KONDO, Masao ,  FUKUDA, Hiroyuki ,  UMEMIYA, Shigeyoshi ,  ENDO, Hiroshi

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: H05K7/20736 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20818 ,  H05K7/20836 ,  Y02D10/16

    Abstract: [Problem] To provide an electronic device rack and an information processing apparatus capable of efficiently cooling electronic devices even when the amount of heat generated per rack reaches 30 kW or larger. [Solving Means] An electronic device rack 10 includes a plurality of panels 10a, 10b, 10c, ... surrounding a first space. Moreover, the electronic device rack 10 includes: an electronic-device housing unit 11 disposed in the first space and configured to house electronic devices 15; a heat exchanger 12 disposed in the first space at a position away from the electronic-device housing unit 11; a second space 21 provided between the electronic-device housing unit 11 and the heat exchanger 12 and isolated from the rest of the first space; and an air blower 13 configured to circulate air inside the first space through the electronic-device housing unit 11, the second space 21, and the heat exchanger 12 in the described order.

    Abstract translation: [问题]即使当每个机架产生的热量达到30kW或更大时，提供一种能够有效地冷却电子设备的电子设备机架和信息处理设备。 电子装置架10包括围绕第一空间的多个面板10a，10b，10c，...。 此外，电子设备机架10包括：电子设备容纳单元11，其设置在第一空间中并构造成容纳电子设备15; 设置在远离电子设备壳体单元11的位置处的第一空间中的热交换器12; 设置在电子设备容纳单元11和热交换器12之间并与第一空间的其余部分隔离的第二空间21; 以及鼓风机13，其构造成以所述顺序通过电子设备容纳单元11，第二空间21和热交换器12使第一空间内的空气循环。

    MAGNETO-HYDRODYNAMIC HEAT SINK
    65.
    发明公开
    MAGNETO-HYDRODYNAMIC HEAT SINK 有权
    磁流体动力KÜHLKÖRPER

    公开(公告)号：EP3096202A1

    公开(公告)日：2016-11-23

    申请号：EP16166482.6

    申请日：2006-09-01

    Applicant: Oracle America, Inc.

    Inventor： OUYANG, Chien

    IPC: G06F1/20

    CPC classification number: G06F1/20 ,  G06F2200/201

    Abstract: A heat sink uses a pump assembly to generate a radial magnetic field. Pipes arranged to house a portion of a first channel and a portion of a second channel are formed in the heat sink. The direction of fluid flow in the first channel and the direction of fluid flow in the second channel is dependent on the radial magnetic field. The radial magnetic field causes fluid in the first channel to flow toward a heat source and fluid in the second channel to flow away from the heat source, thereby resulting in heat transfer between the first and second channels and between the heat sink and the respective first and second channels. The heat sink may also use a heat exchanger assembly that is connected to the heat source, where the heat exchanger assembly is formed of a plurality of channels that each propagate fluid in one of the directions of the first channel and the second channel.

    A WATER-BASED CLOSED-LOOP COOLING SYSTEM
    66.
    发明公开
    A WATER-BASED CLOSED-LOOP COOLING SYSTEM 审中-公开
    配备闭路电视含水冷却系统

    公开(公告)号：EP3094938A1

    公开(公告)日：2016-11-23

    申请号：EP15735475.4

    申请日：2015-01-08

    Applicant: Nautilus Data Technologies, Inc.

    Inventor： KEKAI, Daniel Kawaa ,  MAGCALE, Arnold Castillo

    IPC: F28D15/00 ,  G06F1/20

    CPC classification number: H05K7/20272 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2079

    Abstract: A water based closed loop cooling system employed to cool waterborne data center facility generally comprise a plurality of filtered water intake pipes, a plurality of filtered water exhaust pipes, a plurality of heat exchangers, a plurality of closed loop cooling systems or closed loop coolant distribution units that may use freshwater as a coolant, and a plurality of piping systems. The energy efficient water based closed loop cooling system and method described may use naturally occurring cold water as a heat sink in a plurality of heat exchange systems. The systems and methods described in this document may be employed to provide an energy efficient water-based closed-loop cooling system to maintain interior ambient conditions suitable for proper operation of the plurality of computer systems therein.

    MODULAR SUPER-CALCULATION ARCHITECTURE
    68.
    发明公开
    MODULAR SUPER-CALCULATION ARCHITECTURE 审中-公开
    模块化的超级计算机架构

    公开(公告)号：EP3069587A1

    公开(公告)日：2016-09-21

    申请号：EP14815032.9

    申请日：2014-11-14

    Applicant: Eurotech SPA

    Inventor： ROSSI, Mauro ,  PLEITER, Dirk ,  ARTS, Paulus Petrus Bernardus ,  TECCHIOLLI, Giampietro ,  WETTIG, Tilo

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: G06F1/20 ,  G06F1/185 ,  G06F2200/201 ,  H05K7/20218 ,  H05K7/20772

    Abstract: A modular super-calculation architecture comprises a plurality of electronic calculation modules communicating with each other in a network and liquid cooled. Each electronic calculation module includes a calculation node, one or more autonomous liquid cooling devices, an electric power device, a box-like container that encloses and protects inside it at least the calculation node, the electric power device, and the one or more liquid cooling devices. Each electronic calculation module is independent hydraulically, electrically, in terms of network communication and mechanically at least from the other electronic calculation modules, and can be inserted and/or removed or substituted hot from said architecture.

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