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公开(公告)号:EP3427866A3
公开(公告)日:2019-01-23
申请号:EP18181137.3
申请日:2018-07-02
Applicant: Rolls-Royce Deutschland Ltd & Co KG
Inventor: Roth-Fagaraseanu, Dan , Daenicke, Enrico
Abstract: Die Erfindung betrifft Verfahren zur Herstellung eines kriechbeständigen Werkstoffs. Eines der Verfahren sieht vor: Bereitstellen (301) eines Metallpulvers (1); Bereitstellen (302) von metallischen oder keramischen Nanopartikeln (6); Vermischen (303, 304) des Metallpulvers mit den Nanopartikeln (6), wobei bei dem Vermischen die Partikel des Metallpulvers (1) und die Nanopartikel (6) weder in ihrer Größe noch in ihrer Form verändert werden; und Konsolidieren (306) der Mischung von Metallpulver (1) und Nanopartikeln (6) zur Bildung eines Werkstoffs mit einer polykristallinen Metallstruktur, wobei die aus der Konsolidierung hervorgegangenen Einzelkristalle (4) der polykristallinen Metallstruktur aus den Partikeln des Metallpulvers entstanden und durch Korngrenzen (5) voneinander getrennt sind, und wobei an den Korngrenzen (5) die Nanopartikel (6) angeordnet sind.
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62.
公开(公告)号:EP3425085A1
公开(公告)日:2019-01-09
申请号:EP17180199.6
申请日:2017-07-07
Inventor: Miko, Csilla , Bazin, Jean-Luc
Abstract: L'invention concerne un procédé de traitement de surface d'un matériau métallique à l'état de poudre, ce procédé comprenant l'étape qui consiste à se munir d'une poudre formée d'une pluralité de particules du matériau métallique à traiter, et à soumettre ces particules de poudre métallique à un processus d'implantation ionique en dirigeant vers une surface extérieure de ces particules un faisceau d'ions (14) monochargés ou multichargés produit par une source d'ions monochargés ou multichargés par exemple du type à résonance cyclotron électronique ECR, ces particules présentant une forme générale sphérique avec un rayon (R).
L'invention concerne également un matériau à l'état de poudre formé d'une pluralité de particules ayant une couche extérieure (26) céramique et un coeur (24) métallique, ces particules ayant une forme générale sphérique avec un rayon (R).-
公开(公告)号:EP3422371A1
公开(公告)日:2019-01-02
申请号:EP18179914.9
申请日:2018-06-26
Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA , Tohoku University
Inventor: Sakuma, Noritsugu , Shoji, Tetsuya , Haga, Kazuaki , Sugimoto, Satoshi , Matsuura, Masashi
Abstract: [PROBLEM TO BE SOLVED]
To provide a rare earth magnet having excellent coercive force and a production method thereof.
[MEANS TO SOLVE THE PROBLEM]
A rare earth magnet, wherein the rare earth magnet comprises a magnetic phase containing Sm, Fe, and N, a Zn phase present around the magnetic phase, and an intermediate phase present between the magnetic phase and the Zn phase, wherein the intermediate phase contains Zn and the oxygen content of the intermediate phase is higher than the oxygen content of the Zn phase; and a method for producing a rare earth magnet, including mixing a magnetic raw material powder having an oxygen content of 1.0 mass% or less and an improving agent powder containing metallic Zn and/or a Zn alloy, and heat-treating the mixed powder.-
公开(公告)号:EP2988893B1
公开(公告)日:2018-12-05
申请号:EP14725073.2
申请日:2014-05-13
Applicant: Siemens Aktiengesellschaft
Inventor: SCHÄFER, Martin , AYDIN, Ömer , PILZ, Heinz
CPC classification number: B22F1/02 , B05C19/00 , B05C19/04 , B22F1/0003 , B22F3/1055 , B22F2003/1056 , B29C64/153 , Y02P10/295
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公开(公告)号:EP3012047B1
公开(公告)日:2018-11-21
申请号:EP13887342.7
申请日:2013-06-19
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor: KAWASAKI Hiroyoshi , HASHIMOTO Tomohiko , IKEDA Atsushi , ROPPONGI Takahiro , SOMA Daisuke , SATO Isamu , KAWAMATA Yuji
IPC: B22F1/00 , B22F1/02 , B23K35/14 , B23K35/26 , C22C13/00 , H01L21/60 , H05K3/34 , B23K35/30 , B23K35/02 , C22C9/00 , C22C43/00 , H01L23/498 , H01L23/556 , H01L23/00
CPC classification number: H01L24/13 , B22F1/025 , B23K35/0244 , B23K35/26 , B23K35/262 , B23K35/30 , B23K35/302 , C22C9/00 , C22C13/00 , C22C43/00 , C23C28/021 , H01L23/49816 , H01L23/556 , H01L24/11 , H01L24/14 , H01L2224/111 , H01L2224/1112 , H01L2224/13014 , H01L2224/13016 , H01L2224/13111 , H01L2224/13147 , H01L2224/13347 , H01L2224/13411 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/16227 , H01L2924/1434 , H01L2924/3841 , H05K3/3457 , H05K2203/041 , H01L2924/01082 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/01049 , H01L2924/00012 , H01L2924/00014 , H01L2924/01028 , H01L2924/01027 , H01L2924/01051 , H01L2924/01032 , H01L2924/01015 , H01L2924/01026 , H01L2924/01079 , H01L2924/01092 , H01L2924/0109 , H01L2924/01033 , H01L2924/0105 , H01L2924/01048 , H01L2924/01016 , H01L2924/01203 , H01L2924/01204 , H01L2924/0103
Abstract: To provide a Cu core ball that prevents any soft errors and decreases any connection failure. A solder plating film formed on a surface of a Cu ball is an Sn solder plating film or is made of lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U content of 5 ppb or less and Th content of 5 ppb or less. The Cu ball includes purity of not less than 99.9 % through not more than 99.995%. Pb and/or Bi contents therein are a total of 1 ppm or more. A sphericity thereof is 0.95 or more. The obtained Cu core ball has ± dose of 0.0200 cph/cm 2 or less.
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公开(公告)号:EP3103565B1
公开(公告)日:2018-10-24
申请号:EP14881480.9
申请日:2014-02-04
Applicant: Senju Metal Industry Co., Ltd
Inventor: KAWASAKI Hiroyoshi , ROPPONGI Takahiro , SOMA Daisuke , SATO Isamu
IPC: B22F1/00 , B22F1/02 , B23K35/14 , B23K35/22 , B23K35/30 , C22B15/14 , C22C9/00 , C22F1/00 , C22F1/08 , C25D7/00 , B23K35/02 , C22C9/02 , C22C1/04
CPC classification number: B23K35/0244 , B22F1/0048 , B22F1/02 , B22F1/025 , B23K35/025 , B23K35/22 , B23K35/302 , C22C1/0425 , C22C9/00 , C22C9/02 , C22F1/00 , C22F1/08 , C25D7/00
Abstract: Provided are a Cu ball, a Cu core ball, a solder joint, solder paste and foamed solder, which are superior in the impact resistance to dropping and can inhibit any occurrence of poor joints a junction defect. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the Cu ball 20. The Cu ball 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.95, and Vickers hardness which is equal to or higher than 20HV and equal to or less than 60HV.
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公开(公告)号:EP3265256B1
公开(公告)日:2018-10-03
申请号:EP16712518.6
申请日:2016-03-02
Applicant: Fondazione Istituto Italiano di Tecnologia
Inventor: VOLIANI, Valerio , PIAZZA, Vincenzo
CPC classification number: B22F1/0051 , B22F1/0018 , B22F1/0062 , B22F1/02 , B22F9/20 , B22F9/24 , B22F2301/255 , B22F2304/05 , B22F2998/10 , B22F2999/00 , C01B33/18 , B22F1/0096
Abstract: The present invention relates to hollow nanoparticles having inside their cavity a metal core constituted by metal seeds agglomerated with a cationic polyelectrolyte, useful in medicine as well as in the bio-imaging and/or radio-therapeutic or chemo-therapeutic techniques and also in the industry as starting materials for preparing catalysts or metamaterials in non-linear optical processes.
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公开(公告)号:EP2826874B1
公开(公告)日:2018-10-03
申请号:EP13768524.4
申请日:2013-03-29
Applicant: Schneider Electric Industries SAS
Inventor: LIU, Nan , ZHAO, Binyuan , LAI, Yijian
IPC: B22F1/02 , B22F9/24 , C22C1/05 , C22C5/06 , C22F1/14 , H01H1/023 , H01H1/027 , H01B1/02 , H01B1/04 , C01B32/28
CPC classification number: H01B1/04 , B22F1/02 , B22F9/24 , B22F2304/056 , B22F2304/058 , B22F2304/10 , B22F2998/10 , C01B32/25 , C22C1/05 , C22C5/06 , C22F1/14 , H01B1/02 , H01H1/023 , H01H1/027 , H01H11/04 , H01H11/048 , H01H2300/036 , B22F1/0059 , B22F3/10
Abstract: The present invention relates to a new method for preparing a silver-based electrical contact material, comprising following steps of: (a) providing a carbonaceous mesophase solution; (b) adding a silver source into the carbonaceous mesophase solution and stirring to obtain a compound; (c) removing a solvent from the compound to obtain a solid; (d) performing a heat treatment on the solid, and obtaining a silver-based electrical contact material. The silver source is silver powder prepared by means of a chemical method. By means of the method, a uniform carbonaceous coating on silver is implemented, the silver is uniformly distributed in a nanometer scale, and a diamond is generated in situ of a material after being sintered. The silver-based electrical contact material processed by means of this method shows an excellent mechanical wear resistance and electrical property.
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公开(公告)号:EP3361482A1
公开(公告)日:2018-08-15
申请号:EP16853601.9
申请日:2016-10-05
Applicant: NTN Corporation
Inventor: KAKO, Noritaka , OOHIRA, Kouya
Abstract: To provide a pressed powder magnetic material having excellent work safety during production of a pressed powder magnetic core and imposing less environmental burden; a pressed powder magnetic core having a high magnetic flux density, a high magnetic permeability, a low iron loss, and excellent mechanical strength; and a production method thereof. The pressed powder magnetic core material contains a granulation binder, a soft magnetic powder in which an insulating coating film is formed on the particle surface, and a glass frit whose softening point is a temperature being at least 100°C lower than a magnetic annealing temperature; the soft magnetic powder being an iron-based amorphous alloy powder, the glass frit being contained in an amount of 0.3 to 1.0% by mass, the granulation binder being a polyvinyl alcohol having a degree of polymerization of 1000 or less and a degree of saponification of 50 to 100% by mole.
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70.
公开(公告)号:EP3354375A1
公开(公告)日:2018-08-01
申请号:EP17305087.3
申请日:2017-01-27
Inventor: SPADAVECCHIA, Jolanda
CPC classification number: A61K49/1878 , A61K49/1881 , B22F1/0018 , B22F1/0062 , B22F1/025 , B22F9/24
Abstract: A method for producing nanomaterial product which comprises at least one nanoparticle Gold-metal-Polymer, the polymer comprising at least one biopolymer, the atoms of metal being linked with the atom of Gold, the metal being chosen among: Gd, Co, Eu, Tb, Ce, Mn, Fe, Zn, Ag, the method being realized in an aqueous solvent, without reactive or stabilizer agent, and presenting a step of reducing: tetrachloroauric acid (HAuCl 4 ) and metal ions, in the presence of the biopolymer, the biopolymer being used as a stabilizer agent.
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