公开(公告)号：EP3778693A1

公开(公告)日：2021-02-17

申请号：EP19777376.5

申请日：2019-03-15

Applicant: Sekisui Chemical Co., Ltd.

Inventor： WAKIOKA, Sayaka ,  OATARI, Yuta ,  TAKEDA, Kohei ,  SHINDO, Masami ,  SHINJO, Takashi ,  KAWAHARA, Yuko ,  BABA, Susumu ,  HAYASHI, Tatsushi

IPC: C08G59/40 ,  C08G73/10 ,  C09J7/35 ,  C09J163/00 ,  C09J179/04 ,  C09J201/00 ,  H05K1/03 ,  H05K3/46

Abstract: The present invention aims to provide a curable resin composition excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. The present invention also aims to provide an adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition.
Provided is a curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less.

公开(公告)号：EP3763755A1

公开(公告)日：2021-01-13

申请号：EP19763905.7

申请日：2019-03-08

Applicant: Idemitsu Kosan Co.,Ltd.

Inventor： YOKOTA, Kiyohiko ,  KOBAYASHI, Kenji ,  KUROKI, Masakatsu

IPC: C08F232/00 ,  C08F212/00 ,  C08F212/08 ,  C09J11/06 ,  C09J201/00

Abstract: The present invention relates to a petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm; and a hydrogenated petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm.

公开(公告)号：EP3513955B1

公开(公告)日：2021-01-13

申请号：EP17850946.9

申请日：2017-09-13

Inventor： MIZUSAWA ,Ryuma ,  ANDO, Tomoyuki

IPC: B32B37/02 ,  B32B33/00 ,  B29C65/78 ,  B29C65/40 ,  B29C65/48 ,  B32B3/26 ,  B32B7/14 ,  C09J5/00 ,  C09J7/00 ,  C09J201/00 ,  G03F7/09 ,  B32B3/10 ,  G03F7/26

公开(公告)号：EP2799505B1

公开(公告)日：2020-11-18

申请号：EP12862905.2

申请日：2012-12-20

Applicant: DIC Corporation

Inventor： KOMATSUZAKI Yuki ,  IWASAKI Takeshi ,  TAKEI Hideaki

IPC: C09J7/26 ,  C08J9/06 ,  C09J201/00

公开(公告)号：EP3733803A1

公开(公告)日：2020-11-04

申请号：EP18893394.9

申请日：2018-12-27

Applicant: Nichiban Co., Ltd.

Inventor： INAGAKI Tomoyuki ,  KOGA Yukinori

IPC: C09J7/24 ,  B32B3/30 ,  B32B7/06 ,  B32B27/00 ,  B32B27/32 ,  C09J201/00

Abstract: The present invention provides an adhesive tape or sheet with a separator comprising
an adhesive tape or sheet comprising a support layer and an adhesive layer laminated on the upper side of the support layer; and
a separator located on the upper side of the adhesive layer,
wherein
the separator has a three-layer structure in which a first A layer, a B layer, and a second A layer are laminated in this order from the lower side;
the first A layer and the second A layer are formed of the same type of unstretched polyolefin film, and the B layer is formed of a biaxially stretched polyolefin film; and
the thickness of the first A layer is 70% or more and 130% or less of the thickness of the second A layer.

公开(公告)号：EP2592127B1

公开(公告)日：2020-07-22

申请号：EP11803479.2

申请日：2011-06-28

Applicant: Dexerials Corporation

Inventor： SAKAMOTO Jun ,  KONISHI Misao

IPC: C09J201/00 ,  C09J7/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01B5/16 ,  H01R4/04 ,  H01R11/01 ,  C08K3/08

公开(公告)号：EP3647838A1

公开(公告)日：2020-05-06

申请号：EP18825418.9

申请日：2018-05-24

Applicant: Nitto Denko Corporation

Inventor： KONTANI, Tomohiro ,  OHMORI, Yutaka

IPC: G02B5/26 ,  B32B7/02 ,  B32B17/06 ,  C09J7/20 ,  C09J201/00 ,  G02B5/28

Abstract: Provided is an infrared reflective substrate having both a high visible light transmittance and a high heat shielding property. The infrared reflective substrate comprises a transparent substrate member and an infrared reflective layer, wherein the infrared reflective substrate has a visible light absorption rate of 0.3 or less, and a reflectance whose slope in a wavelength range of 700 nm to 600 nm is 0.12 or more.

公开(公告)号：EP3608380A1

公开(公告)日：2020-02-12

申请号：EP18781545.1

申请日：2018-03-30

Applicant: Lintec Corporation

Inventor： ISHIKAWA, Masakazu

IPC: C09J7/30 ,  B32B27/00 ,  C09J11/04 ,  C09J201/00

Abstract: The invention provides a high-frequency dielectric heating adhesive sheet, which requires no releasable sheet, exhibiting excellent handleability and workability to an adherend even when a size of the high-frequency dielectric heating adhesive sheet is large, and an adhesion method of the high-frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet includes a sheet-shaped base material and a high-frequency dielectric adhesive layer containing a thermoplastic resin as a component A and a dielectric filler as a component B.

公开(公告)号：EP3608128A1

公开(公告)日：2020-02-12

申请号：EP18780584.1

申请日：2018-03-28

Applicant: Bridgestone Corporation

Inventor： SUZUKI, Takahiro ,  KON, Seiji

IPC: B60C9/00 ,  B60C5/01 ,  B60C9/08 ,  B60C9/20 ,  B60C15/04 ,  C09J7/20 ,  C09J201/00

Abstract: A metal-resin composite member for a tire, comprising plural metal cords that are positioned alongside each other, an adhesive layer that is disposed on the metal cords, and a resin layer that is disposed on the adhesive layer, the metal-resin composite member satisfying at least one of the following (1) or (2): (1) the adhesive layer is independently disposed on each of the plural metal cords, and at least one of the adhesive layers has a cross-sectional shape that has a projecting portion; (2) the adhesive layer is integrally disposed on all of the plural metal cords, and a region consisting of the metal cords and the adhesive layer has a cross-sectional shape that has, between the metal cords, a portion that is narrower in width than a portion at which the metal cords are disposed.

公开(公告)号：EP3608101A1

公开(公告)日：2020-02-12

申请号：EP18781019.7

申请日：2018-04-02

Applicant: Denka Company Limited

Inventor： FUJIWARA, Junpei ,  IWASAKI, Takayuki ,  HIROKAW, Yasushi

IPC: B32B27/00 ,  B29C47/06 ,  C09J181/06 ,  C09J201/00 ,  B29K81/00 ,  B29L7/00 ,  B29L9/00

Abstract: [Problem] The present invention is to provide: a film which is excellent in film moldability, is also excellent in heat resistance and transparency, and has a small shrinkage factor and a small heating weight loss ratio even under a high-temperature atmosphere; and a heat-resistant adhesive tape comprising the same.
[Solution] A multilayer film having alternately laminated therein one or more layers of each of a substrate layer (A) comprising a sulfone-based resin having a glass transition temperature of 200°C or more and an adhesive layer (B) comprising a thermoplastic resin having a glass transition temperature of 190°C or more, and a multilayer film excellent in film moldability, heat resistance, and transparency is obtained due to at least one outermost layer of the multilayer film comprising the adhesive layer (B) and the arithmetic mean surface roughness Ra of a surface of at least one outermost layer of the multilayer film being greater than 0.1 µm and less than 10.0 µm.