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61.发明公开CONVEYORIZED HORIZONTAL PROCESSING LINE AND METHOD OF WET-PROCESSING A WORKPIECE 审中-公开水平输送机和方法湿处理的工件
公开(公告)号：EP1481116A1
公开(公告)日：2004-12-01
申请号：EP03743315.8
申请日：2003-02-20
发明人： KOPP, Lorenz
CPC分类号： C25D21/12 , C25D17/28 , C25F7/00 , H05K3/0085
摘要： The problem confronting manufacturers of printed circuit boards (2) of differing thickness is that, as the current density increases and the diameter of the holes decreases, the treatment effect on various locations on the outer side of the boards and inside the holes becomes more irregular. To resolve this problem, a conveyorized horizontal processing line and a method of wet-processing printed circuit boards (2) is described. To manufacture the printed circuit boards (2), data about the thickness of the workpiece (2) are acquired before it enters the conveyorized processing line and are stored in a data memory, the workpiece (2) is conveyed through the conveyorized processing line and a structural component, which is provided with at least one transport member (3) for the workpiece (2) and with at least one processing facility (6) and which is disposed above the conveying path (100) in the conveyorized processing line, is adjusted in such a manner that the structural component is raised or lowered and/or pivoted relative to the conveying path as a function of the thickness of the respective one of the workpieces passing said structural component.
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62.发明公开
公开(公告)号：EP1217102A3
公开(公告)日：2004-08-11
申请号：EP01128158.1
申请日：2001-11-27
申请人： EBARA CORPORATION
发明人： Fukunaga, Akira , Nagasawa, Hiroshi
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D21/12 , G01N30/461 , B01D15/34 , B01D15/327
摘要： A plating apparatus comprises a plating unit having a plating bath for holding a plating liquid therein, and a plating liquid monitoring unit having a liquid chromatography device and an arithmetical unit. The liquid chromatography device serves to separate and quantify an additive in a sample of the plating liquid. The arithmetical unit serves to compare a quantified value of the additive with a given concentration predetermined for the additive and to produce an output signal representing the compared result. The plating apparatus further comprises an additive replenishing unit for adding a solution including the additive from an additive tank to the plating liquid in the plating bath based on the output signal from the arithmetical unit in the plating liquid monitoring unit.
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63.发明公开
公开(公告)号：EP1438447A2
公开(公告)日：2004-07-21
申请号：EP02781274.2
申请日：2002-10-21
发明人： HÜBEL, Egon
摘要： In order to avoid an edge-effect (increased electrical field line density at the edges of electrolytically to be processed work pieces) during the electrolytic processing of work pieces 3.x in a conveyorized system, the electric currents originating from various counter electrodes 5.x in the plant are set to values in function of the electrolytically to be processed surface areas of the work pieces 3.x as far as they are located directly opposite the respective ones of the various counter electrodes 5.x. Moreover, the distance between the work pieces 3.x and the counter electrodes 5.x is chosen to be 50mm maximum. Means 19 for individually controlling and adjusting every single current supply unit 15.x of the counter electrodes 5.x are provided for this purpose. Said means 19 are configured in such a manner that the respective electric currents originating from the various counter electrodes 5.x are settable to values in function of the electrolytically to be processed surface areas of the work pieces 3.x, as far as they are located directly opposite the respective various counter electrodes 5.x.
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64.发明公开
公开(公告)号：EP1431424A2
公开(公告)日：2004-06-23
申请号：EP03008503.9
申请日：2003-04-11
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/2885
摘要： A plating apparatus (10) for plating a substrate (W). The apparatus (10) is provided with a plating unit (20a to 20d), a substrate cleaning unit (22a, 22b), a substrate transport mechanism (TR) , a post-treatment agent supplying section (4), a minor constituent managing section (3) for managing minor constituents (an accelerator, a retarder and chlorine) of a plating liquid being used in the plating unit (20a to 20d), an enclosure (30) which houses therein a substrate treating section (1) including the plating unit (20a to 20d), the cleaning unit (22a, 22b) and the substrate transport mechanism (TR) , and a system controller (155) for controlling the entire apparatus.
摘要翻译： 一种用于电镀衬底（W）的电镀设备（10）。 设备（10）设置有电镀单元（20a至20d），基板清洁单元（22a，22b），基板输送机构（TR），后处理剂供应部分（4），管理 用于管理电镀单元（20a至20d）中使用的电镀液体的次要成分（促进剂，缓凝剂和氯）的部分（3），容纳在其中的基板处理部分（1）的外壳（30） 电镀单元（20a〜20d），清洁单元（22a，22b）和基板输送机构（TR），以及用于控制整个设备的系统控制器（155）。
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公开(公告)号：EP1143039A3
公开(公告)日：2003-06-25
申请号：EP01113153.9
申请日：1999-10-07
摘要： Verfahren zum Steuern einer Behandlungslinie, wobei man a) eine Korrelation zwischen einem oder mehreren variablen Parametern der chemischen und/oder physikalischen Prozesse der Behandlungslinie und einer oder mehreren Kenngrößen, die für den Erfolg der Behandlung charakteristisch sind, erstellt, hieraus Regeln ableitet, die die Abhängigkeit der Kenngröße oder der Kenngrößen von den variablen Parametern beschreiben, und die Korrelation und/oder die hieraus abgeleiteten Regeln in einem Steuersystem für die Behandlungslinie abspeichert, b) kontinuierlich oder diskontinuierlich die eine oder mehrere Kenngrößen mißt c) bei einer Abweichung dieser Kenngrößen von einem vorgegebenen Sollwertbereich denjenigen oder diejenigen variablen Parameter, der oder die am stärksten mit dieser Kenngröße korreliert sind, in diejenige Richtung verändert, die der Abweichung der Kenngröße oder der Kenngrößen vom Sollbereich entgegenwirkt.
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66.发明公开Manufacturing method of electrodeposited copper foil, electrodeposited copper foil, copper-clad laminate and printed wiring board 有权一种用于制造电沉积铜箔，电解铜箔，覆铜层压板及印刷电路板的过程
公开(公告)号：EP1059367A3
公开(公告)日：2002-11-27
申请号：EP00304865.9
申请日：2000-06-08
发明人： Imada, Nobuyuki , Hirasawa, Yutaka , Hara, Yasuji , Matsushita, Naoya, Kitaurawa Okino Kopu 301
摘要： A process for producing an electrodeposited copper foil, comprising electrodepositing a copper foil from an electrolyte containing copper sulfate dissolved therein, in which said electrolyte contains a small amount of lead (Pb) ions, which comprises adding a salt of a metal of Group IIA of the periodic table to the electrolyte in an amount of 10 to 150 mol per mol of lead (Pb) ions contained in the electrolyte so that the lead (Pb) ions contained in the electrolyte react with the metal of Group IIA of the periodic table to thereby form an insoluble composite substance to precipitate, said insoluble composite substance followed by removing it from the electrolyte and forming an electrodeposited copper foil in the electrolyte having the lead (Pb) ions removed therefrom. The invention further provides an electrodeposited copper foil produced by the above process, a copper-clad laminate comprising an insulating substrate having at least one side thereof laminated with this electrodeposited copper foil, and a printed wiring board having desirable wiring pattern formed from the electrodeposited copper foil of the copper-clad laminate.
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公开(公告)号：EP1199386A2
公开(公告)日：2002-04-24
申请号：EP01308819.0
申请日：2001-10-17
申请人： THE BOC GROUP, INC.
CPC分类号： C25D7/12 , C23C18/1617 , C25D17/001 , C25D21/12 , C25D21/14
摘要： A method and system are disclosed for plating objects. At least one aspect associated with the object plating is monitored to determine the amount of at least one by-product created during the plating and/or the reduction in the amount of at least one plating component. Based on this monitored aspect, an adjustment is made to the flow rate of substances added to a plating cell and/or the flow rate of used plating substances drained from the plating cell. The used plating substances are purified to remove at least some of the by-product and then the purified plating substances are combined with at least one component before passing back into the plating cell to reuse at least some of the plating substances. The method and system could be used during the plating of semiconductor wafers with copper.
摘要翻译： 公开了电镀对象的方法和系统。 监测与对象电镀相关的至少一个方面以确定在电镀期间产生的至少一种副产物的量和/或至少一种电镀组分的量的减少。 基于该监视方式，对添加到电镀单元的物质的流量和/或从电镀单元排出的使用电镀物质的流量进行调整。 净化所用的电镀物质以除去至少一些副产物，然后将纯化的电镀物质与至少一种组分结合，然后再返回到电镀池中以再利用至少一些电镀物质。 该方法和系统可以在用铜电镀半导体晶片期间使用。
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公开(公告)号：EP1113094A2
公开(公告)日：2001-07-04
申请号：EP00125141.2
申请日：2000-11-17
申请人： EBARA CORPORATION
IPC分类号： C25D21/12
CPC分类号： C25D21/12
摘要： A plating analysis method is disclosed for electroplating in a system in which resistance of an anode and/or a cathode cannot be neglected. This method comprises giving a three-dimensional Laplace's equation, as a dominant equation, to a region containing a plating solution; discretizing the Laplace's equation by the boundary element method; giving a two-dimensional or three-dimensional Poisson's equation dealing with a flat surface or a curved surface, as a dominant equation, to a region within the anode and/or the cathode; discretizing the Poisson's equation by the boundary element method or the finite element method; and formulating a simultaneous equation of the discretized equations to calculate a current density distribution i and a potential distribution ∅ in the system. The method can obtain the current density and potential distributions efficiently for a plating problem requiring consideration for the resistance of an electrode. The method also optimizes the structure of a plating bath for uniformizing current, which tends to be concentrated in the outer peripheral portion of the cathode, thereby making the plating rate uniform.
摘要翻译： 公开了一种电镀分析方法，用于在不能忽视阳极和/或阴极电阻的系统中进行电镀。 该方法包括给出包含电镀溶液的区域的三维拉普拉斯方程作为主导方程; 用边界元法离散拉普拉斯方程; 将平面或曲面的二维或三维泊松方程作为主导方程提供给阳极和/或阴极内的区域; 用边界元法或有限元法离散泊松方程; 并制定离散方程的联立方程，以计算系统中的电流密度分布i和电势分布∅。 该方法可以有效地获得电流密度和电势分布，用于需要考虑电极电阻的电镀问题。 该方法还优化了用于均匀化电流的电镀槽的结构，电流趋于集中在阴极的外周部分，由此使电镀速率均匀。
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69.发明公开Improved process for synthesizing a palladium replenisher for electroplating baths 审中-公开Verbeetes Verfahren zur Synthese eines钯再生器fürElektroplattierungsbäder
公开(公告)号：EP1057902A2
公开(公告)日：2000-12-06
申请号：EP00304357.7
申请日：2000-05-23
CPC分类号： C01G55/002 , C01P2006/80 , C25D21/12 , C25D21/18
摘要： This invention provides for a palladium replenisher comprising a complex of palladium tetraammine sulfate made according to a process whereby the processing temperature is maintained at or below about 115°C in the presence of excess nitrate solution. The replenisher of the invention is used to replenish depleted palladium during palladium electroplating to maintain the palladium concentration in the bath within from about 5 to about 10 weight percent of recommended plating bath levels.
摘要翻译： 本发明提供了一种钯补充剂，其包含根据一种方法制备的四硫酸钯复合物，由此在过量硝酸盐溶液的存在下，加工温度保持在约115℃或低于约115℃。 本发明的补充剂用于在钯电镀期间补充贫化的钯以将浴中的钯浓度保持在推荐电镀浴水平的约5至约10重量％之内。
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70.发明公开APPARATUS AND METHODS FOR CONTROLLING WORKPIECE SURFACE EXPOSURE TO PROCESSING LIQUIDS DURING THE FABRICATION OF MICROELECTRONIC COMPONENTS 审中-公开设备及方法处理液体OVER微电子元件的生产工件的表面撞击
公开(公告)号：EP1029342A1
公开(公告)日：2000-08-23
申请号：EP98950863.5
申请日：1998-09-30
申请人： SEMITOOL, INC.
CPC分类号： H01L21/6715 , C25D7/12 , C25D17/001 , C25D21/12 , H01L21/68
摘要： An apparatus (10) for use in processing a workpiece (W) to fabricate a microelectronic component is set forth. The apparatus comprises a process container (14) having a process fluid (38) therein for processing the workpiece and a workpiece holder (16) configured to hold the workpiece. A position sensor is employed to provide position information indicative of the spacing between a surface (S1) of the workpiece and a surface (39) of the process fluid. A drive system provides relative movement between the surface of the workpiece and the surface of the process fluid in response to the position information. Preferably, the relative movement provided by the drive system comprises a first motion that causes the surface of the workpiece to contact the surface of the process fluid, and a second motion opposite the direction all of and following the first to generate and maintain a column of process fluid between the surface of the process fluid and the surface of the workpiece. In one embodiment, the apparatus is configured to electroplate a material onto the surface of the workpiece.
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