摘要:
The method and system of the present invention superimposes read and write operations by connecting the global bit lines that are not selected to the Vdd. The respective local sense amplifiers for the non-selected global bit lines just read and refresh the respective memory cells resulting in smaller local sense amplifiers and one global sense amplifiers for several memory cells (and local sense amplifiers). In one embodiment, eight global bit lines are shared by one global sense amplifier and are multiplexed. Only one global bit line pair generates voltage development as an input to a respective local sense amplifier during a write operation, while the other three global bit line pairs are disconnected from their respective local sense amplifiers and thus have no voltage development. Thus, the respective activated sense amplifiers amplify only the cell data which reassembles a read and refresh operation.
摘要:
An improved multi-wordline memory architecture providing decreased bitline coupling for increased speed and reduced power consumption comprising an interleaving arrangement for connecting adjacent bitcells to different wordlines, coupled to a multiplexing arrangement for sharing bitlines of adjacent bitcells.
摘要:
A common bit/common source line high density 1T1R (one transistor/one resistor) R-RAM array, and method for operating said array are provided. The R-RAM array comprises a first transistor with a drain connected to a non-shared bit line with a first memory resistor. The gates of the first, second, third, and fourth transistors are sequentially connected to a common word line. The R-RAM array comprises at least one common bit line. A second memory resistor is interposed between the drain of the second transistor and the common bit line. Likewise, a third memory resistor is interposed between the drain of the third transistor and the common bit line. A common source line is connected to the sources of the third and fourth transistors. The R-RAM array comprises m rows of n sequential transistors.
摘要:
Present invention describes an efficient implementation of differential sensing in single ended DRAM arrays. According to one embodiment of the present invention, a respective local sense amplifier compares the accessed memory cell data with a dummy cell data in the opposite or adjacent block of the accessed block that is connected to a respective local bit line in the opposite block, amplifies the result of the comparison and puts the data on a global bit line. In one embodiment, the invention is process and temperature invariant using reference method and means for canceling cross coupling between read lines and write lines.
摘要:
Non-volatile, electrically alterable semiconductor memory, comprising at least one two-dimensional array of memory cells with a plurality of rows (R0-R511) and a plurality of columns (C(0;0)-C(127;31)), column selection means (CADD,3;CADD,10,INT_CADD,3) for selecting columns among said plurality of columns, and a write circuit (7) for simultaneously writing a first number of memory cells. A plurality of doped semiconductor regions (40-4127) is provided, extending transversally to the rows and subdividing a set of memory cells of each row in a corresponding plurality of subsets of memory cells, each subset of memory cells including memory cells of the row formed in a respective doped semiconductor region distinct from the remaining doped semiconductor regions and defining an elementary memory block (P) that can be individually erased. The plurality of doped semiconductor regions define a plurality of column packets (C(0;0)-C(0;31),...,C(127;0)-C(127;31)) each one containing a second number of columns equal to or higher than said first number, memory cells (MC) belonging to columns of a same column packet being formed in a same doped semiconductor region distinct from the doped semiconductor regions in which memory cells belonging to columns of the other column packets are formed. The column selection means are such that within each column packet columns containing memory cells that can be written simultaneously by the write circuit are distributed among the columns of the column packet so as to be at the substantially maximum distance from each other allowable within the column packet.
摘要:
A memory device may include a first structure (ST1) and a second structure (ST2) bonded to the first structure (ST1). The first structure (ST1) may have a plurality of planes (PL1-PL6) and a pad part (PDP; PDP1, PDP2) between two planes adjacent to each other among the plurality of planes (PL1-PL6). Each of the plurality of planes (PL1-PL6) may include a memory cell. The second structure (ST2) may include a peripheral circuit. The plurality of planes (PL1-PL6) may be minimum units in which operations are independently performed and may be in an n x m array (n and m being integers of 2 or larger). The pad part (PDP; PDP1, PDP2) may be between the rows and/or between the columns of the n x m array.