摘要:
The present invention comprises an anisotropic magnetoresistive (AMR) sensor without a set and reset device (100) comprising a substrate (140), an exchange bias layer (130), an AMR layer (110) and a collection of barber-pole electrodes (122). An exchange bias layer (130) is deposited on the substrate (140), and an AMR layer (110) is deposited on the exchange bias layer (130). The AMR layer (110) is composed of multiple groups of AMR strips, wherein each group of AMR strips is composed of several AMR strips. The barber-pole electrodes (122) are arranged on each AMR strip under certain rules. The AMR sensor (100) achieves coupling by using the exchange bias layer (130), without requiring a reset/set coil. Because a coil is not be used, the power consumption of the chip is reduced greatly, and the manufacturing process is simpler, providing improved yield and lower cost.
摘要:
The present invention discloses a design and manufacturing method for a single-chip magnetic sensor bridge. The sensor bridge comprises four magnetoresistive elements. The magnetization of the pinned layer of each of the four magnetoresistive elements is set in the same direction, but the magnetization directions of the free layers of the magnetoresistive elements on adjacent arms of the bridge are set at different angles with respect to the pinned layer magnetization direction. The absolute values of the angles of the magnetization directions of the free layers of all four magnetoresistive elements are the same with respect with their pinning layers. The disclosed magnetic biasing scheme enables the integration of a push-pull Wheatstone bridge magnetic field sensor on a single chip with better performance, lower cost, and easier manufacturability than conventional magnetoresistive sensor designs.
摘要:
A single-package bridge-type magnetic-field angle sensor comprising one or more pairs of magnetic tunnel junction sensor chips rotated relative to each other by 90 degrees in order to detect two magnetic field components in orthogonal directions respectively is disclosed. The magnetic-field angle sensor may comprise a pair of MTJ full-bridges or half-bridges interconnected with a semiconductor package lead. The magnetic-field angle sensor can be packaged into various low-cost standard semiconductor packages.
摘要:
A TMR high-sensitivity single-chip push-pull bridge magnetic field sensor (30) comprises a substrate (31) and two comb-shaped soft ferromagnetic flux concentrators with an interdigitated structure formed on the substrate. The two comb-shaped soft ferromagnetic flux concentrators (36, 37) respectively comprise N and N-1 rectangular comb teeth and corresponding comb seats wherein N is an integer greater than 1. Gaps are formed between the comb teeth of one comb-shaped soft ferromagnetic flux concentrator (36) and the comb seat of the other comb-shaped soft ferromagnetic flux concentrator (37) in an X direction. Adjacent comb teeth in a +Y direction form 2m-1 odd space gaps and 2m even space gaps. Here, m is an integer greater than zero and less than N. The push magnetoresistive sensing element strings (38) and the pull magnetoresistive sensing element strings (39) are located respectively in the odd space gaps and the even space gaps, and they are electrically interconnected into a push-pull magnetoresistive sensor bridge. The magnetization alignment directions of the ferromagnetic pinned layer of the magnetic sensing element strings are Y direction. A magnetic field gain coefficient ANS between the external magnetic field B (x-ext) in the X direction and a B y magnetic-field component in the gaps in the Y direction is given as to B y /B (x-ext) , and it is greater than 1. This magnetoresistive sensor (30) has a simple structure with the advantages of high sensitivity and low power consumption.
摘要:
The present invention relates to a permanent magnet suitable for a magnetic angle encoder. The permanent magnet (100, 300) has a cylindrical ring structure and comprises a first permanent magnet unit (101, 301) and a second permanent magnet unit (102, 302). The first permanent magnet unit (101, 301) and the second permanent magnet unit (102, 302) are geometrically symmetrical with respect to a diametral cross section (110, 310). The magnetization intensity (103, 303) of the first permanent magnet unit (101, 301) and the magnetization intensity (104, 304) of the second permanent magnet unit (102, 302) are parallel to the axial direction of the cylindrical ring and are in opposite directions, or the magnetization intensity (103, 303) of the first permanent magnet unit (101, 301) and the magnetization intensity (104, 304) of the second permanent magnet unit (102, 302) are perpendicular to the diametral cross section (110, 310) and are parallel to one another and in the same direction.
摘要:
An integrated current sensor comprising a Z axis gradiometer and a lead frame primary coil (15), wherein the Z-axis gradiometer (13) is a magnetoresistive Z-axis gradient sensor, comprising a substrate (10), with two elongated soft magnetic flux concentrators placed upon the substrate (A1, B1). The soft ferromagnetic flux concentrators (A1, B1) are located above or below but displaced from a long-axis centerline (11) equidistant from the magnetoresistive sensor strings, such that the combined magnetoresistive sensing unit detects the magnetic field perpendicular to the long-axis center line (11), and it is configured as a gradiometer sensor bridge. The lead frame serves as the primary coil (15), and the Z-axis gradiometer (13) is placed above or below a cross-section of the current carrying portion of the lead frame (151), such that the current detection direction (17) is parallel to the long-axis centerline (11). This sensor can detect currents of up to 5 to 50 A, it has low power consumption, small size, and fully integrated.
摘要:
A copper thermal resistance thin-film temperature sensor chip comprises a substrate (3), a temperature sensor, and two electrode plates (1, 2), the temperature sensor which has a plurality of electrically connected resistance elements (4) is placed on the substrate (3), a portion of the resistance elements form a resistance adjustment circuit (5). Integrated circuit elements are deposited by thin-film technology. It consists seed layer, copper thermal resistance thin-film layer above the seed layer and passivation layer above the copper thermal resistance thin-film layer. Through semiconductor manufacturing and processing technology, the thermistor layer of this structure is to be fabricated into a serious of thermistor wires and then to form the temperature sensor, furthermore this temperature sensor has a resistance adjustment circuit (5) which is used to adjust resistance value precisely. The preparation method of the sensor chip comprises depositing thin-film on the surface of the substrate, and then a final sensor chip can be obtained through the processing of magnetron sputtering, schematize, peeling, and etching. This sensor chip has the advantages of high impedance, excellent thermal stability, good linearity and low cost.
摘要:
A mini lead screw pump (2) monitors the rotation of a lead screw (22) by using a magnetoresistive sensor (28) and an MCU (50), and uses feedback to control the rotation direction and speed of the lead screw (22) through a motor controller (48) so as to control the speed of infusion to a patient. Furthermore, this mini lead screw pump (2) can control the infusion speed of insulin according to the patient's blood sugar concentration monitored by CGM (45). This mini lead screw pump (2) has several advantages, comprising high sensitivity, high reliability, low power consumption, low cost, and ease of use.