公开(公告)号：EP1881090A1

公开(公告)日：2008-01-23

申请号：EP06014519.0

申请日：2006-07-13

申请人： ENTHONE, INCORPORATED

发明人： Gollan, Dieter Harald, Dr. ,  Patron, Gerard ,  Helden, Thomas ,  Kirchhof, Andreas Heinz, Dr.

IPC分类号： C25D3/56 ,  C23C18/50

CPC分类号： C25D3/565 ,  C23C18/50

摘要： Die vorliegende Erfindung betrifft eine Elektrolytzusammensetzung sowie ein Verfahren zur Abscheidung von Zink-Nickel-Legierungsschichten auf Substraten, insbesondere Gußeisen- oder Stahlsubstraten. Die erfindungsgemäßen Elektrolytzusammensetzungen weisen Aminoessigsäure auf. Die aus den erfindungsgemäßen Elektrolytzusammensetzungen abgeschiedenen Legierungsschichten sind korrosionsfest, glänzend und weisen nahezu keine innere Spannung auf.

摘要翻译： 为锌 - 镍合金层上的基片含10〜18％（重量）的镍的分离电解质组合物（I），包括锌离子，镍离子，氨基乙酸和钠，钾醋酸盐和/或 的铵，其中乙酸的摩尔比为氨基乙酸是12:35：0.91。 一个独立的claimsoft被包括用于在衬底分离所述锌 - 镍合金层，优选为铸造铁或钢基片包括具有（I）的流接触的基片。

公开(公告)号：EP1601924A4

公开(公告)日：2007-10-10

申请号：EP03796527

申请日：2003-12-02

申请人： MCCOMAS EDWARD ,  UNIVERSAL CHEMICAL TECHNOLOGIE

发明人： MCCOMAS EDWARD

IPC分类号： F41A21/00 ,  C23C18/18 ,  C23C18/32 ,  C23C18/50 ,  C25D3/56 ,  F41A21/22

CPC分类号： F41A21/22 ,  C23C18/1662 ,  C23C18/1689 ,  C23C18/1844 ,  C23C18/34 ,  C25D3/562 ,  F41A29/04 ,  Y10T428/12014 ,  Y10T428/12028 ,  Y10T428/12493 ,  Y10T428/12986

摘要： The invention is directed to a nodular nickel boron coating having lubricating properties. Nodular and columnar boron coatings made by the above methods disclosed in the above patents have a low coefficient of friction. The above process results in a columnar structure with nodules in the surface layer. Nodules can be produced in other nickel coatings by blasting the surface with hard particles to form the nodules. Using blasting to form the nodules produces an inferior coating in contrast to the electroless nickel boron coatings having a columnar structure.

公开(公告)号：EP0727826B1

公开(公告)日：2004-11-03

申请号：EP96301052.5

申请日：1996-02-16

申请人： SHARP KABUSHIKI KAISHA

发明人： Tomita, Takashi ,  Nomoto, Katsuhiko ,  Yamamoto, Yoshihiro ,  Sannomiya, Hitoshi ,  Takagi, Sae

IPC分类号： H01L31/20 ,  C23C18/50 ,  C23C16/50

CPC分类号： C23C16/515 ,  H01L31/202 ,  Y02E10/50 ,  Y02P70/521

公开(公告)号：EP1428903A2

公开(公告)日：2004-06-16

申请号：EP03257747.0

申请日：2003-12-10

申请人： GENERAL ELECTRIC COMPANY

发明人： Grady, Wayne Ray ,  Kelly, Thomas Joseph ,  Weimer, Michael James ,  Das, Nripendra Nath ,  Rosenzweig, Mark Alan

IPC分类号： C23C14/06 ,  C23C14/16 ,  C23C14/24 ,  C23C18/50

CPC分类号： C23C28/021 ,  C23C28/023 ,  C23C28/321 ,  C23C28/322 ,  C23C28/3455 ,  F05B2230/80 ,  F05B2230/90 ,  F05C2253/12 ,  Y02T50/67 ,  Y10T428/12493 ,  Y10T428/12535 ,  Y10T428/12611 ,  Y10T428/12736 ,  Y10T428/12771 ,  Y10T428/12875 ,  Y10T428/12944

摘要： A coated article has a metallic substrate (26) with a substrate composition, and a metallic coating (28) overlying and contacting the metallic substrate (26). The metallic coating (28) has a metallic-coating composition different from the substrate composition. A protective coating (30) overlies and contacts the metallic coating (28). The protective coating (30) includes an aluminide layer (32) overlying and contacting the metallic coating (28), and optionally a thermal barrier coating (36) overlying and contacting the aluminide layer (32). This structure may be used to restore a key dimension of an article that has previously been in service and to protect the article as well.

摘要翻译： 一种涂覆的制品具有与组合物的基材的金属基材（26），和一金属涂层（28）上覆且接触所述金属基材（26）。 所述金属涂层（28）具有从所述组合物的基材不同的金属涂料组合物。 的保护性涂层（30）覆盖并接触该金属涂层（28）。 所述保护涂层（30）包括在铝化物层（32）上覆且接触所述金属涂层（28），和任选的热障涂层（36）覆盖并接触所述铝化物层（32）。 这种结构可以用来恢复的一篇文章的一个关键方面没有此前一直在服务，并保护物品为好。

公开(公告)号：EP1343921A1

公开(公告)日：2003-09-17

申请号：EP01992803.5

申请日：2001-10-04

申请人： ATOTECH Deutschland GmbH

发明人： BRANDES, Mariola ,  MIDDEKE, Hermann ,  DYRBUSCH, Brigitte

IPC分类号： C23C18/16 ,  C23C18/20 ,  C23C18/24 ,  C23C18/28 ,  C23C18/32 ,  C23C18/34 ,  C23C18/44 ,  C23C18/50 ,  C23C18/18

CPC分类号： C23C18/34 ,  C23C18/1844 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/50

摘要： A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selectively coat the substrates to be treated only, and not the surfaces of the racks. The method involves the following steps: a. pickling the surfaces with a solution containing chromate ions; b. activating the pickled surfaces with a silver colloid containing stannous ions; c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces; and d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising borane compounds.

公开(公告)号：EP0926263A3

公开(公告)日：2002-11-06

申请号：EP98309198.4

申请日：1998-11-10

申请人： MacDermid, Incorporated

发明人： Redline, Ronald ,  Justice, Lucia ,  Taytsas, Lev

IPC分类号： H05K3/38 ,  C23C18/34 ,  C23C18/44 ,  C23C18/50

CPC分类号： H05K3/385 ,  C23C18/54 ,  H05K3/384 ,  H05K3/4611 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1157

摘要： A process for improving the adhesion of a copper surface to a resinous layer, said process comprising contacting said copper layer with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of gold, silver, palladium, ruthenium, rhodium, zinc, nickel, cobalt, iron and alloys of the foregoing metals.

公开(公告)号：EP0927776A4

公开(公告)日：2001-01-10

申请号：EP98900430

申请日：1998-01-20

申请人： TAIHO KOGYO CO LTD

发明人： OKAMOTO SHINICHI ,  YAMAGUCHI YASUSHI ,  KITAGAWA YOSHIAKI ,  KONDO KENICHI

IPC分类号： C23C18/36 ,  C23C18/50 ,  F16C33/12

CPC分类号： C23C18/50 ,  C23C18/36 ,  F16C33/12 ,  F16C2204/20 ,  Y10S384/912 ,  Y10T428/1275 ,  Y10T428/12944

摘要： A medium-P/high-P type Ni-P plating film which has a higher hardness is employed as an Ni-P plating layer on the surface of a sliding member. However, it does not exhibit the expected abrasion-resistance. Although a conventional Ni-P-B electroless plating film has a lower P-content that an ordinary Ni-P electroless plating film, the Ni crystallinity is significantly disturbed and hence it exhibits poor sliding characteristics. In order to resolve these problems, an Ni-P-B electroless plating film which contains 0.05-5 wt.% of P and 0.01-0.05 wt.% of B is provided. Further, barrel polishing, shot-blast, laser beam application, high frequency induction heating, etc., are applied to the plating film.

公开(公告)号：EP0520776A3

公开(公告)日：1994-04-06

申请号：EP92305816.8

申请日：1992-06-24

申请人： GENERAL ELECTRIC COMPANY

发明人： Iacovangelo, Charles Dominic

IPC分类号： C23C18/50

CPC分类号： C23C18/50

摘要： A method of improving adhesion of a nickel alloy to the surfaces of diamond particles and articles made therefrom comprises electrolessly nickel plating with a nickel alloy formed with a transitional metal, such as molybdenum, titanium, niobium and chromium,gradually heating at a steady rate from room temperature to a desired heat treatment temperature in a non-oxidizing atmosphere formed for example by argon containing 10% hydrogen. Articles made by the aforementioned process include grinding wheels having uniformly dispersed abrasive diamond particles having a Ni/Mo alloy coat thereon and printed circuit boards.

摘要翻译： 改善镍合金对金刚石颗粒和由其制成的制品表面的粘合性的方法包括用由过渡金属例如钼，钛，铌和铬形成的镍合金的无电镀镍，以稳定的速率从 在例如由含有10％氢气的氩气形成的非氧化气氛中，将室温冷却至期望的热处理温度。 通过上述方法制造的制品包括其上均匀分散有具有Ni / Mo合金涂层的磨料金刚石颗粒和印刷电路板的磨轮。

公开(公告)号：EP0322895A3

公开(公告)日：1992-04-15

申请号：EP88121794

申请日：1988-12-28

申请人： DOMAIN TECHNOLOGY

发明人： ESPARZA, LEONARD ,  TANG, GEORGE H.

IPC分类号： C23C18/36 ,  G11B5/858 ,  C23C18/50 ,  H01F41/14

CPC分类号： G11B5/858

摘要： A plating bath for the electroless coating of magnetic recording media substrates includes cobalt, nickel, and zinc metal ions in a buffered solution including a reducing agent, a strong base, and chelating agents. Typically, the reducing agent will include phosphorous which will form a portion of the ferromagnetic layer being deposited on the substrate. By utilizing malic acid or a malate salt as a chelating agent, magnetic media having improved signal-to-noise ratios, switching field distributions, and corrosion resistance, have been obtained.

摘要翻译： 用于磁记录介质基板的无电涂层的电镀液包括在包括还原剂，强碱和螯合剂的缓冲溶液中的钴，镍和锌金属离子。 通常，还原剂将包括将形成沉积在基底上的铁磁层的一部分的磷。 通过利用苹果酸或苹果酸盐作为螯合剂，已经获得了具有改善的信噪比，开关场分布和耐腐蚀性的磁性介质。

公开(公告)号：EP0179602A1

公开(公告)日：1986-04-30

申请号：EP85307345.0

申请日：1985-10-14

申请人： C4 Carbides (International) Limited

发明人： Nicolson, Peter John

IPC分类号： B23K1/04 ,  B23K35/32 ,  C23C2/00 ,  C23C6/00 ,  C23C18/50

CPC分类号： B23K1/0004

摘要： The invention relates to a process for brazing refractory particles, notably tungsten carbide grits, onto a substrate such as a tool blank to provide an armour coating or a cutting edge thereon, which process comprises applying to the substrate a brazing material, a particulate refractory material to be brazed onto the substrate and a binder composition; and connecting the substrate to a source of an electric current to cause the current to flow through the substrate whereby the substrate is heated to sufficient temperature to cause the brazing material to fuse.
The invention also provides apparatus for carrying out the invention.