公开(公告)号：EP1042540A1

公开(公告)日：2000-10-11

申请号：EP98952056.4

申请日：1998-10-05

申请人： LeaRonal, Inc.

发明人： MARTIN, James, L. ,  MENARD, Stephane ,  MICHELEN, David

IPC分类号： C25D5/18 ,  C25D3/38

CPC分类号： C25D3/38 ,  C25D5/18 ,  H05K3/241 ,  H05K3/423 ,  Y10S205/92

摘要： The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current density; and varying the ratio of peak reverse current density to peak forward current density in periodic cycles to provide metal deposits of uniform thickness and appearance upon the substrate. The invention also relates to a process for improving the properties of an electrodeposit, particularly on substrates having uneven surfaces or apertures, by using programmed pulse periodic reverse current modulation. More particularly, it involves varying the anodic to cathodic current density ratio, in order to improve the surface uniformity appearance, grain structure and levelling of the deposit while maintaining high current density throwing power.

公开(公告)号：EP0693577B1

公开(公告)日：1998-10-28

申请号：EP95111344.8

申请日：1995-07-19

申请人： LeaRonal, Inc.

发明人： Nobel, Fred I. ,  Brasch, William ,  Thomson, Donald ,  Garay, Luis Henry

IPC分类号： C25B1/00 ,  B01D61/44

CPC分类号： B01D61/44 ,  C25B1/00

公开(公告)号：EP0079975B1

公开(公告)日：1989-05-10

申请号：EP81109802.9

申请日：1981-11-20

申请人： LeaRonal, Inc.

发明人： Brasch, William Robert

IPC分类号： C23C18/28

CPC分类号： C23C18/28

公开(公告)号：EP0076523B1

公开(公告)日：1988-06-29

申请号：EP82109233.5

申请日：1982-10-06

申请人： LeaRonal, Inc.

发明人： Martin, James Leslie ,  McCaskie, John Edward ,  Toben, Michael Philip

IPC分类号： C25D3/50 ,  C25D5/08 ,  C25D5/04

CPC分类号： C25D5/08 ,  C25D3/50 ,  C25D3/52 ,  C25D5/04

公开(公告)号：EP0112561B1

公开(公告)日：1988-03-30

申请号：EP83112994.5

申请日：1983-12-22

申请人： LeaRonal, Inc.

发明人： Nobel, Fred I.

IPC分类号： C25D3/56

CPC分类号： C25D3/567

公开(公告)号：EP0150733A3

公开(公告)日：1987-01-14

申请号：EP85100212

申请日：1985-01-11

申请人： LeaRonal, Inc.

发明人： Brasch, William R. ,  Favini, Carlo Elga Ronal, SRL

IPC分类号： H05K03/18

CPC分类号： H05K3/184 ,  H05K3/381 ,  H05K3/427 ,  H05K2203/0716 ,  H05K2203/122 ,  H05K2203/1415

摘要： The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.

公开(公告)号：EP0198038A1

公开(公告)日：1986-10-22

申请号：EP85905287.0

申请日：1985-10-10

申请人： LeaRonal, Inc.

发明人： NOBEL, Fred, I. ,  SCHRAM, David, N.

IPC分类号： C25D3 ,  C25D5 ,  H05K3

CPC分类号： C25D5/02 ,  C25D3/60 ,  H05K3/3473

摘要： Bain et procédé de dépôt électrolytique d'un alliage d'étain/plomb sur des substrats composites possédant une partie métallique (4) (5) recouvrable par dépôt électrolytique et une partie inorganique non conductrice (1) (2) (3). L'alliage se dépose uniquement sur les parties métalliques du substrat et ne produit pas d'effets négatifs sur les parties inorganiques non conductrices.

公开(公告)号：EP0164757A3

公开(公告)日：1986-03-19

申请号：EP85107432

申请日：1982-10-29

申请人： LeaRonal, Inc.

发明人： Brasch, William Robert

IPC分类号： C23F01/18 ,  H05K03/06

CPC分类号： C23F1/46 ,  C23F1/18 ,  C25C1/12

摘要： The present invention relates to a method of etching copper with a hydrogen peroxide-sulfuric acid etchant containing an acid soluble phosphonic acid in the manufacture of electronic circuits utilizing a masked copper surface and an etch solution.

公开(公告)号：EP0039507A1

公开(公告)日：1981-11-11

申请号：EP81103382.8

申请日：1981-05-05

申请人： LeaRonal, Inc.

发明人： Thomson, Donald Walter ,  Martin, James Leslie

IPC分类号： H01L21/60 ,  H01L23/48

CPC分类号： H01L21/4825 ,  H01L23/057 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48644 ,  H01L2224/83444 ,  H01L2224/85444 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01047

摘要： Semiconductive circuit packages and process of packaging semiconductive circuits utilizing a first layer of goldsilver alloy with or without a second outer layer for wire lead bonding and also for silicon chip alloying when applicable.

摘要翻译： 半导体电路封装和封装半导体电路具有或不具有用于引线键合引线的第二外层和因此对于硅芯片的合金利用金银合金制成的第一层在适用的情况的过程。

公开(公告)号：EP1062383A4

公开(公告)日：2002-08-14

申请号：EP99906970

申请日：1999-02-11

申请人： LEARONAL INC

发明人： TOBEN MICHAEL P ,  MARCKTELL DANIEL C ,  BROWN NEIL D ,  DOYLE COLLEEN A

IPC分类号： C25D3/60 ,  H05K3/34

CPC分类号： C25D3/60 ,  H05K3/3463 ,  H05K3/3473

摘要： The invention relates to an electrolyte for depositing tin-rich tin-silver alloys upon a substrate. This electrolyte includes a basis solution containing a solution soluble tin and silver compounds; a tin chelating agent of a polyhydroxy compound in an amount sufficient to complex tin ions provided by the tin compound; and a silver chelating agent of a heterocyclic compound in an amount sufficient to complex silver ions provided by the silver compound. Preferably, the tin and silver compounds are present in relative amounts to enable deposits containing about 85 to 99 % by weight tin and about 0.5 to 15 % by weight silver to be obtained.