Production of semiconductor material and devices using oblique angle etched templates
    9.
    发明公开
    Production of semiconductor material and devices using oblique angle etched templates 审中-公开
    半导体材料和装置的制造使用以斜角模具蚀刻

    公开(公告)号:EP2136390A2

    公开(公告)日:2009-12-23

    申请号:EP09163286.9

    申请日:2009-06-19

    申请人: Nanogan Limited

    发明人: Wang, Wang Nang

    IPC分类号: H01L21/20 H01L21/36

    摘要: A method of producing a semiconductor material comprises the steps of:
    (a) providing a base comprising a substrate having a plurality of semiconductor nano-structures located thereon, the nano-structures having respective major axes arranged at an oblique angle to the substrate, and
    (b) growing a semiconductor material onto the oblique angle nano-structures using an epitaxial growth process.

    摘要翻译: 制造半导体材料的方法包括下列步骤:(a)提供基极,其包括具有位于其上的半导体纳米结构的多个A基片,具有在以倾斜角度设置成使所述衬底respectivement长轴纳米结构,和 (b)中生长半导体材料到使用外延生长工艺的斜角纳米结构。