公开(公告)号：EP3360928A1

公开(公告)日：2018-08-15

申请号：EP16863817.9

申请日：2016-10-28

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： SATO, Kazuyasu ,  OZAI, Toshiyuki ,  TABEI, Eiichi

IPC分类号： C08L83/07 ,  C08L83/05 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

CPC分类号： H01L33/56 ,  C08G77/58 ,  C08L83/14 ,  C08L2201/10 ,  C08L2203/206 ,  C08L2205/02 ,  C08L2314/08 ,  H01L23/29 ,  H01L23/31 ,  H01L51/0094 ,  H01L51/5246 ,  H01L2933/005

摘要： The present invention is directed to an addition curable type silicone resin composition which comprises (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (b) an organopolysiloxane represented by the formula, (R 1 R 2 2 SiO 1/2 ) m (R 1 R 2 SiO 2/2 ) n (R 2 2 SiO 2/2 ) p (R 1 SiO 3/2 ) q (R 2 (OR 3 )SiO 2/2 ) r (S iO 4/2 ) s , (c) an organohydrogen polysiloxane represented by R 4 a H b SiO (4-a-b)/2 , (d) a platinum group metal catalyst, and (e) a polyorganometallosiloxane containing an Si-O-Ce bond, and an Si-O-Ti bond, and contents of Ce and Ti of which are each 50 to 5,000 ppm, which cures by heating. According to this constitution, it is provided an addition curable type silicone resin composition which can provide a cured product excellent in transparency, and less change in hardness and weight loss under high temperature conditions.

公开(公告)号：EP3275943A4

公开(公告)日：2018-03-28

申请号：EP16769115

申请日：2016-03-24

申请人： LG CHEMICAL LTD

发明人： LEE SEUNG MIN ,  KIM SO YOUNG ,  SHIM JUNG SUP ,  YANG SE WOO

IPC分类号： C08L101/02 ,  C08L33/04 ,  C08L63/00 ,  C08L75/04

CPC分类号： C09J133/04 ,  C08L33/04 ,  C08L33/06 ,  C08L63/00 ,  C08L75/04 ,  C08L101/02 ,  C08L2203/206 ,  H01L51/5246

摘要： Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.

公开(公告)号：EP3275958A4

公开(公告)日：2018-03-14

申请号：EP16769110

申请日：2016-03-24

申请人： LG CHEMICAL LTD

发明人： KIM SO YOUNG ,  LEE SEUNG MIN ,  SHIM JUNG SUP ,  YANG SE WOO

IPC分类号： C09J9/00 ,  C08K5/103 ,  C08L63/00 ,  C09J11/04 ,  C09J123/00 ,  C09J123/22

CPC分类号： C09J9/00 ,  C08L2203/206 ,  C09J11/04 ,  C09J123/00 ,  C09J123/22 ,  C08L63/00 ,  C08K5/103

摘要： Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.

公开(公告)号：EP3163631A4

公开(公告)日：2018-02-21

申请号：EP15811905

申请日：2015-06-22

申请人： MITSUI CHEMICALS TOHCELLO INC

发明人： MUROFUSHI TAKANOBU ,  TOKUHIRO JUN

IPC分类号： C08K5/3492 ,  C08K5/5425 ,  C08L23/08 ,  H01L31/048

CPC分类号： C08K5/3435 ,  C08J5/18 ,  C08J2323/08 ,  C08J2479/04 ,  C08K5/34926 ,  C08K5/5425 ,  C08L23/08 ,  C08L23/0815 ,  C08L2201/08 ,  C08L2203/206 ,  H01L31/048 ,  H01L31/0481 ,  H01L31/049 ,  Y02E10/50

摘要： According to the present invention, a resin composition for a solar-cell encapsulating material includes an ethylene·±-olefin copolymer of which an MFR measured based on ASTM D123 8 under conditions of 190°C and a load of 2.16 kg is equal to or less than 10 g/10 minutes, a silane coupling agent, and a hindered amine-based photostabilizer. pH of the hindered amine-based photostabilizer, which is measured by using the following measuring method is equal to or less than 9.0. In the measuring method, the pH is measured by using a potential difference measuring device and by using a solution which contains 10 g of acetone, 1 g of water, and 0.01 g of the hindered amine-based photostabilizer, as a sample.

公开(公告)号：EP3270387A1

公开(公告)日：2018-01-17

申请号：EP16181699.6

申请日：2016-07-28

申请人： Huinnovation Co., Ltd.

发明人： LEE, Moon Seok ,  LEE, Dong Kwon ,  SUH, Kwang Suck ,  LEE, June Ho ,  JEONG, Yeong Ho ,  KANG, Hyoung Ku

IPC分类号： H01B3/44 ,  C08L23/12

CPC分类号： C08L23/16 ,  C08L23/04 ,  C08L23/0853 ,  C08L23/0869 ,  C08L23/12 ,  C08L2203/206 ,  C08L2205/02 ,  C08L2207/02 ,  C08L2666/06 ,  H01B3/441 ,  C08L23/10

摘要： Disclosed is a heterophasic polymer composition for environmentally friendly cable insulation layers that exhibits excellent electrical, mechanical, and thermal properties while realizing the flexibility, bendability, and impact resistance performance characteristics of polypropylene. The heterophasic polymer composition for cable insulation layers is configured such that propylene copolymer particles each having a predetermined size are dispersed in a polypropylene matrix.

摘要翻译： 公开了一种用于环境友好的电缆绝缘层的多相聚合物组合物，其在实现聚丙烯的柔性，弯曲性和抗冲击性能特性的同时表现出优异的电，机械和热性能。 用于电缆绝缘层的多相聚合物组合物配置为使得各自具有预定尺寸的丙烯共聚物颗粒分散在聚丙烯基质中。

公开(公告)号：EP3242321A1

公开(公告)日：2017-11-08

申请号：EP17166464.2

申请日：2017-04-13

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： KUSHIHARA, Naoyuki ,  SUMITA, Kazuaki

IPC分类号： H01L23/29

CPC分类号： H01L21/56 ,  B29C70/72 ,  B29C70/882 ,  B29K2063/00 ,  B29K2105/20 ,  B29K2995/0005 ,  B29L2009/00 ,  B29L2031/3481 ,  C08G59/4238 ,  C08G59/621 ,  C08L63/00 ,  C08L2203/206 ,  H01L23/29 ,  H01L23/293 ,  H01L2924/186

摘要： Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175°C, (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

摘要翻译： 本发明提供一种封装方法，当用树脂组合物共同封装大面积硅晶片或基板时，不会导致填充失败和流痕等成型失败。 具体而言，提供使用含有环氧树脂（A），固化剂（B），预凝胶化剂（C）和填充剂（C）的固化性环氧树脂组合物来密封安装半导体元件的基材的方法。 d）。 （a）成型方法：压缩成型，（b）成型温度：100〜175℃，（c）成型时间：2〜20分钟，（d）成型压力 ：50至350kN。

公开(公告)号：EP3144350A4

公开(公告)日：2017-05-10

申请号：EP15792988

申请日：2015-04-22

申请人： PANASONIC IP MAN CO LTD

发明人： KOTANI YUKI ,  YODEN HIROYOSHI

IPC分类号： C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K9/08 ,  C09K5/14 ,  H01B3/00 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K9/08 ,  C08L63/00 ,  C08L101/00 ,  C08L2203/206 ,  C08L2205/03 ,  C08L2205/12 ,  C09K5/14 ,  H01B3/00

摘要： An insulating thermally conductive resin composition (10) includes a matrix resin (1) and insulators (2). The insulators (2) are dispersed in the matrix resin and have electrical insulation. The insulating thermally conductive resin composition further includes a thermally conductive phase (3) which has a higher thermal conductivity than the matrix resin and thermally connects the insulators with each other. The thermally conductive phase (3) is composed of an organic substance. The thermally conductive phase that thermally connects the insulators is composed of the organic substance, so that the resultant insulating thermally conductive resin composition has electrical insulation while having improved thermal conductivity.

摘要翻译： 绝缘导热树脂组合物（10）包括基体树脂（1）和绝缘体（2）。 绝缘体（2）分散在基体树脂中并具有电绝缘性。 绝缘导热树脂组合物还包括导热相（3），导热相（3）具有比基体树脂更高的热导率并且将绝缘体彼此热连接。 导热相（3）由有机物组成。 使绝缘体热连接的导热相由有机物组成，使得所得绝缘导热树脂组合物具有电绝缘性，同时具有改善的导热性。

公开(公告)号：EP3153517A1

公开(公告)日：2017-04-12

申请号：EP15803359.7

申请日：2015-05-29

申请人： Dow Corning Toray Co., Ltd.

发明人： IIMURA, Tomohiro ,  TODA, Nohno ,  INAGAKI, Sawako ,  MIYAMOTO, Yusuke ,  FURUKAWA, Haruhiko

IPC分类号： C07F7/08 ,  C08G59/10 ,  C08G77/388 ,  C08K5/544 ,  C08L83/05 ,  C08L83/07 ,  C08L83/08 ,  C09J11/06 ,  C09J183/07 ,  H01L23/29 ,  H01L23/31

CPC分类号： C08K5/5442 ,  C07D405/14 ,  C07F7/08 ,  C08G59/10 ,  C08G77/388 ,  C08K5/544 ,  C08L83/08 ,  C08L2203/206 ,  C08L2205/025 ,  C09J11/06 ,  H01L23/29 ,  H01L23/296 ,  H01L23/31 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An organosiloxane represented by the following general formula; a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) an adhesion promoter containing the organosiloxane; and (D) a catalyst for hydrosilylation reaction; and a semiconductor device in which a semiconductor element is encapsulated with a cured product of the composition. A novel organosiloxane, a curable silicone composition that contains the novel organosiloxane as an adhesion promoter and that forms a cured product having excellent adhesion to various base materials, and a semiconductor device that is formed by using the composition and that has excellent reliability are provided.

摘要翻译： 由以下通式表示的有机硅氧烷： 一种可固化有机硅组合物，其包含：（A）在分子中具有至少两个烯基的有机聚硅氧烷; （B）分子中具有至少两个与硅原子键合的氢原子的有机氢聚硅氧烷; （C）含有机硅氧烷的粘合促进剂; 和（D）氢化硅烷化反应的催化剂; 以及其中半导体元件被组合物的固化产物包封的半导体器件。 提供一种新型有机硅氧烷，其包含新型有机硅氧烷作为粘合促进剂并且形成对各种基材具有优异粘附性的固化产物的可固化有机硅组合物，以及通过使用该组合物形成并具有优异可靠性的半导体器件。

公开(公告)号：EP2832797B1

公开(公告)日：2017-02-15

申请号：EP13769799.1

申请日：2013-03-14

申请人： Mitsubishi Gas Chemical Company, Inc.

发明人： ITOH, Syouichi ,  FUKASAWA, Emi ,  UENO, Yoshitaka ,  YAGINUMA, Michio

IPC分类号： C08L71/12 ,  B32B15/08 ,  B32B27/00 ,  C08J5/24 ,  C08K5/5313 ,  C08K5/5399 ,  C08L25/04 ,  C08L63/00 ,  H05K1/03 ,  C08K5/315 ,  B32B15/14

CPC分类号： C08L71/126 ,  B32B15/08 ,  B32B15/14 ,  B32B2260/046 ,  B32B2305/076 ,  C08J5/24 ,  C08J2371/12 ,  C08J2425/06 ,  C08J2463/04 ,  C08J2475/00 ,  C08J2485/02 ,  C08K3/36 ,  C08K5/315 ,  C08K5/5313 ,  C08K5/5399 ,  C08L25/06 ,  C08L63/00 ,  C08L63/04 ,  C08L71/12 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/035 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/0209 ,  H05K2203/06 ,  Y10T156/10 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31529

摘要： The present invention provides a resin composition that not only has high flame retardancy but also has excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and a single-layer or laminated sheet using the same, a metal foil-clad laminate using the prepreg, and the like. The resin composition of the present invention is a resin composition having polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by the following formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. wherein m represents an integer of 1 to 3.

公开(公告)号：EP3015487A4

公开(公告)日：2017-01-25

申请号：EP14817315

申请日：2014-06-26

申请人： HITACHI CHEMICAL CO LTD

发明人： NISHIYAMA TOMOO ,  YOSHIE SHIGEMITSU ,  HARA NAOKI ,  FUKUDA KAZUMASA ,  KUWANO ATSUSHI ,  MIYAZAKI YASUO

IPC分类号： C08G59/62 ,  C08K3/22 ,  C08K3/38 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

CPC分类号： C08G59/621 ,  B32B15/092 ,  B32B27/08 ,  B32B27/38 ,  B32B37/06 ,  B32B2305/72 ,  B32B2311/00 ,  B32B2363/00 ,  B32B2457/20 ,  C08J5/18 ,  C08J2363/04 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/003 ,  C08L63/00 ,  C08L63/04 ,  C08L2203/206 ,  H01L23/295 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/00 ,  H01L2924/00014

摘要： A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 µm and less than 1 µm, not less than 1 µm and less than 10 µm, from 10 µm to 50 µm, and from 20 µm to 100 µm, and in which a peak present in a range of from 10 µm to 50 µm includes an aluminum oxide particle, and a peak present in a range of from 20 µm to 100 µm includes a boron nitride particle. In Formula (I) each of R 1 , R 2 and R 3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7.

摘要翻译： 一种树脂组合物包含环氧树脂单体，酚醛清漆树脂，其包括具有由式（I）表示的结构单元，和填料的化合物; 其中填料具有至少四个峰在通过激光衍射法测定的粒度分布，其中，所述峰的4分别存在于不小于0时01微米，小于1微米，不小于1微米且小于的范围 10微米，10微米至50微米，并从20微米至100微米，并且其中存在于〜50的范围从10微米的峰包括的范围从20的氧化铝粒子的微米，和当前峰值 微米至100微米包括氮化硼颗粒。 在式（I）中，R 1，R 2和R 3unabhängigdarstellt氢原子，烷基上的基团，或类似物。 米darstellt 0至2，并且n 1 darstellt至第七