PROCESSING CONTENT FOR EXTENDED REALITY APPLICATIONS

    公开(公告)号:EP4391550A1

    公开(公告)日:2024-06-26

    申请号:EP23217393.0

    申请日:2023-12-18

    摘要: Methods and systems of processing content by a client are described wherein the method includes: receiving scene information defining two or more viewpoints in a scene, each of the two or more viewpoints being associated with an area in the scene and with a plurality of quality versions of video content, the video content defining one or more views in the scene associated with a viewpoint; receiving position information associated with a user of a playback device, the position information defining at least a user position and, optionally, a viewing direction of the user in the scene; if the user position is outside the areas associated with the two or more viewpoints, then selecting first content of a first quality associated with a first viewpoint and second content of a second quality associated with a second viewpoint in the scene based on the position information and the scene information; sending a request to a server system, the request comprising information about the first content of the first quality and the second content of the second quality and, optionally, the position and/or viewing direction of the user in the scene; and, receiving, in response to the request, video frames comprising the first and second content for generating synthesized content on the basis of the first and second content, wherein the synthesized content is associated with the position of the user in the scene; or, receiving video frames comprising synthesized content associated with the position of the user in the scene, wherein the synthesized content is synthesized based on the first and second content.

    METHOD AND DEVICE FOR DEPOSITING COMPONENTS ON A SUBSTRATE

    公开(公告)号:EP4383321A1

    公开(公告)日:2024-06-12

    申请号:EP22211797.0

    申请日:2022-12-06

    IPC分类号: H01L21/683 H05K3/04

    摘要: A deposition device (1) is provided for depositing components (CMP) on a substrate (STR). The deposition device (1) comprises a substrate holder (2), a component carrier (3), a power supply (4) and a support module (5) for supporting the component carrier (3). The substrate holder (2) has a substrate support surface (2s) for holding the substrate (STR). The component carrier (3), which is supported by the support module has a component carrier surface (3s) facing the substrate support surface (2s) for carrying the components to be deposited on the substrate. The component carrier (3) comprises a resistive heater layer (31) for thermally inducing a deformation of the component carrier (3) to move the component carrier surface (3s) towards the substrate support surface (2s). The power supply (4) is configured to generate a deflection pulse (Pd), being an electric power pulse to the resistive heater layer (31) for said thermally inducing a deformation. Also a corresponding deposition method is provided.