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公开(公告)号：EP3784007A1
公开(公告)日：2021-02-24
申请号：EP19192351.5
申请日：2019-08-19
摘要： An electronic component (1) is connected to a conductive track (2) on a flexible substrate (3). A connection layer (4) of a composition comprising a thermoplastic material (TPM1) is provided on the conductive track (2). The connection layer (4) has at least one cutout (5) aligned to overlap the conductive track (2). A thermosetting material (TSM1) in liquid state is used to fill the cutout (5). The electronic component (1) is provided on top of the connection layer (4). By applying heat, a temperature of the connection layer (4) is raised to above a softening temperature of the thermoplastic material (TPM1). Pressure is applied to form a mechanical connection. By the application of heat (H) a temperature of the thermosetting material (TSM1) is raised above its thermosetting temperature for solidifying the thermosetting material (TSM1) and forming an electrical connection (E).
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公开(公告)号：EP2529607B1
公开(公告)日：2019-01-23
申请号：EP11704856.1
申请日：2011-01-31
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公开(公告)号：EP3699570A1
公开(公告)日：2020-08-26
申请号：EP19158064.6
申请日：2019-02-19
发明人： SMITS, Edsger Constant Pieter , VAN HECK, Gerardus Titus , KINGMA, Boris René Motrona , VAN DEN BRAND, Jeroen
摘要： The present disclosure concerns a core body temperature sensor for measuring the core body temperature of a body in a non-invasive way via applying the core body temperature sensor to a surface of the bod. The core body temperature sensor comprises: at least a first thermistor pair of opposing thermistors across a first thermal insulator and a second thermistor pair, adjacent to the first thermistor pair, of opposing thermistors across a second thermal insulator, wherein the core body temperature sensor is an essential planar sandwich structure formed of the at least first and second thermistor pairs across the respective first and second thermal insulators sandwiched between opposing carriers. The present disclosure further concerns a method for determining a core body temperature and a method for the manufacturing of a core body temperature sensor.
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公开(公告)号：EP2529409B1
公开(公告)日：2019-08-28
申请号：EP11704487.5
申请日：2011-01-31
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公开(公告)号：EP2529409A1
公开(公告)日：2012-12-05
申请号：EP11704487.5
申请日：2011-01-31
IPC分类号： H01L31/042 , H05K1/02
CPC分类号： H05K1/0277 , G09F9/00 , G09F19/22 , H01L27/3293 , H01L31/0392 , H01L31/042 , H01L51/5203 , H01L2251/5338 , H01L2251/5361 , H01R4/04 , H01R4/70 , H01R12/7076 , H05B33/0896 , H05B33/10 , H05K1/0283 , H05K1/038 , H05K1/147 , H05K1/189 , H05K3/321 , H05K3/325 , H05K3/365 , H05K13/04 , H05K2201/029 , H05K2201/0311 , H05K2201/046 , H05K2201/083 , H05K2201/09081 , H05K2201/09281 , H05K2201/10106 , H05K2201/10287 , H05K2201/10484 , Y02E10/50 , Y10T29/4913
摘要： An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.
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公开(公告)号：EP3864712A2
公开(公告)日：2021-08-18
申请号：EP19828875.5
申请日：2019-10-08
IPC分类号： H01L41/113 , H01L41/083
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公开(公告)号：EP3583624A1
公开(公告)日：2019-12-25
申请号：EP18711179.4
申请日：2018-02-16
IPC分类号： H01L23/498 , H05K1/02
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公开(公告)号：EP3251473B1
公开(公告)日：2018-12-05
申请号：EP16711363.8
申请日：2016-01-26
发明人： DE KOK, Margaretha Maria , VAN HECK, Gerardus Titus , VAN DEN BRAND, Jeroen , ATHAUDA, Arachchige Tharindu Niroshan , RAMCHANDANI, Vivek Vashdev , WEERASEKARA, Mudiyanselage Praneeth Maheeka Bandara
CPC分类号： H05K1/038 , H01R12/77 , H05K1/189 , H05K3/365 , H05K2201/0129 , H05K2201/0281 , H05K2201/029 , H05K2201/09145 , H05K2201/10106 , H05K2201/10151 , H05K2201/10598
摘要： A device module (100) and method for connection to a textile fabric (50) with electrically conductive threads (51, 52) to provide a fabric layer assembly (150). The device module (100) comprises a flexible foil (10) and a thermoplastic layer (20) to enable a mechanical connection (M) between the flexible foil (10) and the textile fabric (50). The device module (100) has an outer circumference (C) comprising inward notches (N1,N2) configured as anchor points for respective conductive threads (51, 52) for holding and guiding the conductive threads (51,52) over and in contact with the respective conductive areas (11, 12) for providing the respective electrical connections (E1,E2) while the mechanical connection (M) by the thermoplastic layer (20) is established.
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10.发明公开FLEXIBLE DEVICE MODULE FOR FABRIC LAYER ASSEMBLY AND METHOD FOR PRODUCTION 审中-公开用于织物层组件的柔性装置模块和生产方法
公开(公告)号：EP3251473A1
公开(公告)日：2017-12-06
申请号：EP16711363.8
申请日：2016-01-26
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO , MAS Active Trading (Private) Limited
发明人： DE KOK, Margaretha Maria , VAN HECK, Gerardus Titus , VAN DEN BRAND, Jeroen , ATHAUDA, Arachchige Tharindu Niroshan , RAMCHANDANI, Vivek Vashdev , WEERASEKARA, Mudiyanselage Praneeth Maheeka Bandara
CPC分类号： H05K1/038 , H01R12/77 , H05K1/189 , H05K3/365 , H05K2201/0129 , H05K2201/0281 , H05K2201/029 , H05K2201/09145 , H05K2201/10106 , H05K2201/10151 , H05K2201/10598
摘要： A device module (100) and method for connection to a textile fabric (50) with electrically conductive threads (51, 52) to provide a fabric layer assembly (150). The device module (100) comprises a flexible foil (10) and a thermoplastic layer (20) to enable a mechanical connection (M) between the flexible foil (10) and the textile fabric (50). The device module (100) has an outer circumference (C) comprising inward notches (N1,N2) configured as anchor points for respective conductive threads (51, 52) for holding and guiding the conductive threads (51,52) over and in contact with the respective conductive areas (11, 12) for providing the respective electrical connections (E1,E2) while the mechanical connection (M) by the thermoplastic layer (20) is established.
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