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    METHOD AND SYSTEM FOR SCRIBING BRITTLE MATERIAL FOLLOWED BY CHEMICAL ETCHING
    3.
    发明公开
    METHOD AND SYSTEM FOR SCRIBING BRITTLE MATERIAL FOLLOWED BY CHEMICAL ETCHING 审中-公开
    VERFAHREN UND SYSTEM ZUM RITZEN VONSPRÖDEMMATERIAL NACH CHEMISCHEMÄTZEN

    公开(公告)号：EP3102358A1

    公开(公告)日：2016-12-14

    申请号：EP15878300.1

    申请日：2015-12-30

    申请人： Rofin-Sinar Technologies, Inc.

    发明人： HOSSEINI, S., Abbas

    IPC分类号： B23K26/00

    CPC分类号： B23K26/402 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/361 ,  B23K26/362 ,  B23K26/364 ,  B23K2203/50

    摘要： Very fine closed form structures can be scribed via filamentation in the transparent substrate very quickly, the modified zone can be etched via dry or wet chemical etching to release the closed form. A metal layer engages the transparent substrate and is covered with photoresist. A portion of the photoresist and a portion of the metal are removed simultaneously with the creation of a filament through the transparent substrate. The photoresist protects the portion of the metal layer that is not removed. The desired closed form can be released by weakening the cut region using dry or wet chemical etching to remove the desired part.

    摘要翻译： 非常精细的封闭形式结构可以非常快速地在透明基底中通过丝网划线，可以通过干法或湿法化学蚀刻来蚀刻改质区以释放封闭形式。 金属层与透明基板接合并被光致抗蚀剂覆盖。 一部分光致抗蚀剂和一部分金属同时被除去，从而通过透明基底产生细丝。 光致抗蚀剂保护未被去除的金属层的部分。 通过使用干或湿化学蚀刻削弱切割区域以除去所需的部分，可以释放所需的封闭形式。

    Method for non-ablative and/or photo acoustic compression machining a transparent target
    5.
    发明公开
    Method for non-ablative and/or photo acoustic compression machining a transparent target 有权
    用于非消融和/或光声压缩加工透明目标的方法

    公开(公告)号：EP2837462A2

    公开(公告)日：2015-02-18

    申请号：EP14179402.4

    申请日：2014-07-31

    申请人： Rofin-Sinar Technologies, Inc.

    发明人： Hosseini, S. Abbas ,  Na, Jung Un ,  Albelo, Gilbert

    IPC分类号： B23K26/38

    CPC分类号： B23K26/0648 ,  B23K26/0069 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/382 ,  B23K2203/50 ,  Y10T428/24273

    摘要： The invention refers to a method for the processing of orifices in materials by laser filamentation that utilizes an optical configuration that focuses the incident laser light beam in a distributed manner along the longitudinal beam axis. This distributed focusing method enables the formation of filaments over distances, and the laser and focusing parameters are adjusted to determine the filament propagation and termination points so as to develop a single/double end stopped orifice, or a through orifice. Selected transparent substrates from a stacked or nested configuration may have orifices formed therein/therethrough without affecting the adjacent substrate. These distributed focusing methods support the formation filaments with lengths well beyond ten millimeters in borosilicate glass and similar brittle materials and semiconductors.

    摘要翻译： 本发明涉及一种通过激光成丝处理材料中的孔的方法，该方法利用沿着纵向射束轴以分布方式聚焦入射激光束的光学构造。 这种分布式聚焦方法能够在距离上形成长丝，并且调整激光和聚焦参数以确定长丝传播和终止点，从而形成单/双端停止孔或通孔。 来自堆叠或嵌套构造的所选透明基板可具有形成在其中/穿过其中的孔口而不影响相邻基板。 这些分布式聚焦方法支持硼硅酸盐玻璃和类似脆性材料和半导体中长度超过10毫米的地层细丝。

    Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
    7.
    发明公开
    Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses 有权
    用于通过激发脉冲超快激光脉冲的激光加工硅的方法和设备

    公开(公告)号：EP2898982A3

    公开(公告)日：2015-08-12

    申请号：EP14195892.6

    申请日：2014-12-02

    申请人： Rofin-Sinar Technologies, Inc.

    发明人： Hosseini, S. Abbas

    IPC分类号： B23K26/00

    CPC分类号： B23K26/009 ,  B23K26/0057 ,  B23K26/0617 ,  B23K26/0648 ,  B23K26/08 ,  B23K26/364 ,  B23K26/40 ,  B23K2203/50 ,  Y10T225/12 ,  Y10T428/12389 ,  Y10T428/24612

    摘要： A method for laser processing of Silicon includes placing a Kerr material into engagement with the Silicon forming an interface therebetween. A laser beam is applied having at least one subpulse in a burst envelope operating at a first wavelength. The laser beam passes through a distributive lens focusing assembly and to the Kerr material. The first wavelength is modified to a plurality of second wavelengths, some of which are effective for processing Silicon. Photoacoustic compression processing is produced by the laser pulse energy by a portion of second wavelengths delivered through the interface and to the Silicon which initiates Kerr Effect self-focusing which is propagated in the Silicon by additional energy input to the Silicon thus producing a filament within the Silicon.

    摘要翻译： 用于硅的激光加工的方法包括将克尔材料放置成与硅接合，在其间形成界面。 施加激光束，其在以第一波长工作的突发包络中具有至少一个子脉冲。 激光束通过分布式透镜聚焦组件和克尔材料。 第一波长被修改为多个第二波长，其中一些对于处理硅是有效的。 光声压缩处理是由激光脉冲能量通过一部分第二波长通过界面传递到硅上而产生的，该部分启动克尔效应自聚焦，通过附加能量输入到硅中在硅中传播，从而在硅 硅。

    A method of laser processing a transparent material
    8.
    发明公开
    A method of laser processing a transparent material 审中-公开
    Verfahren zur Laserbearbeitung eines transparenten材料

    公开(公告)号：EP2859984A2

    公开(公告)日：2015-04-15

    申请号：EP14179404.0

    申请日：2014-07-31

    申请人： Rofin-Sinar Technologies, Inc.

    发明人： Hosseini, S. Abbas

    IPC分类号： B23K26/00

    CPC分类号： B23K26/0626 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0648 ,  B23K26/082 ,  B23K26/38 ,  B23K26/53 ,  B23K2103/00 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  C03B33/0222 ,  C03B33/033 ,  C03B33/04 ,  C03B33/07 ,  C03B33/09 ,  C03C14/002 ,  C03C2214/02 ,  H01L21/78

    摘要： Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.

    摘要翻译： 描述了用于在透明材料中形成连续激光丝的系统和方法。 聚焦超快激光脉冲的突发，使得在正在处理的材料外部形成束腰，而不形成外部等离子体通道，同时在材料内的延伸区域内形成足够的能量密度以支持形成连续细丝 ，而不会在材料内引起光学击穿。 根据该方法形成的丝可以表现出超过10mm的长度。 在一些实施例中，使用像差光学聚焦元件来产生外部光束腰部，同时产生入射光束在材料内的分布式聚焦。 描述了促进在透明基板内形成丝束阵列以进行切割/分割和/或标记的各种系统。 纤维的光学监测可用于提供反馈以促进过程的主动控制。

    A system for laser processing a transparent material
    9.
    发明公开
    A system for laser processing a transparent material 有权
    激光加工透明材料的系统

    公开(公告)号：EP2859983A2

    公开(公告)日：2015-04-15

    申请号：EP14179403.2

    申请日：2014-07-31

    申请人： Rofin-Sinar Technologies, Inc.

    发明人： Hosseini, S. Abbas

    IPC分类号： B23K26/00

    CPC分类号： B23K26/0626 ,  B23K26/0006 ,  B23K26/0057 ,  B23K26/0624 ,  B23K26/0648 ,  B23K26/082 ,  B23K26/38 ,  B23K2203/00 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  B23K2203/54 ,  B23K2203/56 ,  C03B33/0222 ,  C03B33/033 ,  C03B33/04 ,  C03B33/07 ,  C03B33/09 ,  C03C14/002 ,  C03C2214/02 ,  H01L21/78

    摘要： Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding up to 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.

    摘要翻译： 描述了用于在透明材料中形成连续激光丝的系统和方法。 一束超快激光脉冲被聚焦，使得束腰形成在被处理材料的外部而不形成外部等离子体通道，同时在材料内的延伸区域内形成足够的能量密度以支持形成连续长丝 ，而不会导致材料内的光学击穿。 根据这种方法形成的长丝可以表现出超过10mm的长度。 在一些实施例中，使用像差光学聚焦元件来产生外部束腰，同时在该材料内产生入射束的分布式聚焦。 描述了便于在透明基板内形成用于切割/分割和/或标记的灯丝阵列的各种系统。 可以采用光纤的光学监测来提供反馈以促进过程的主动控制。

    METHOD FOR NON-ABLATIVE AND/OR PHOTO ACOUSTIC COMPRESSION MACHINING A TRANSPARENT TARGET
    10.
    发明公开
    METHOD FOR NON-ABLATIVE AND/OR PHOTO ACOUSTIC COMPRESSION MACHINING A TRANSPARENT TARGET 审中-公开
    非消色和/或光声压缩机加工透明目标的方法

    公开(公告)号：EP3292941A1

    公开(公告)日：2018-03-14

    申请号：EP17184442.6

    申请日：2014-07-31

    申请人： Rofin-Sinar Technologies, Inc.

    发明人： Hosseini, S. Abbas

    IPC分类号： B23K26/38 ,  B23K26/06 ,  C03B33/09 ,  B23K26/18 ,  B23K26/40 ,  B23K26/00

    摘要： The invention refers to a method for the processing of orifices in material (10) by laser filamentation that utilizes an optical configuration that focuses the incident laser light beam (46) in a distributed manner along the longitudinal beam axis. This distributed focusing method enables the formation of filaments over distances, and the laser and focusing parameters are adjusted to determine the filament propagation and termination points so as to develop a single/double end stopped orifice, or a through orifice. Selected transparent substrates (10) from a stacked or nested configuration may have orifices formed therein/therethrough without affecting the adjacent substrate (10). These distributed focusing method support the formation filaments with lengths well beyond ten millimeters in borosilicate glass and similar brittle materials and semiconductors.

    摘要翻译： 本发明涉及一种通过激光成丝处理材料（10）中的孔口的方法，该方法利用沿着纵向射束轴线以分布方式聚焦入射激光束（46）的光学配置。 这种分布式聚焦方法能够在距离上形成长丝，并且调整激光和聚焦参数以确定长丝传播和终止点，从而形成单/双端停止孔或通孔。 来自堆叠或嵌套构造的所选透明基板（10）可具有形成在其中/穿过其中的孔口而不影响相邻基板（10）。 这些分布式聚焦方法支持硼硅酸盐玻璃和类似脆性材料和半导体中长度超过10毫米的地层细丝。