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    VERFAHREN ZUM FÜHREN EINES RISSES IM RANDBEREICH EINES SPENDERSUBSTRATS MIT EINEM GENEIGTEN LASERSTRAHL
    3.
    发明公开
    VERFAHREN ZUM FÜHREN EINES RISSES IM RANDBEREICH EINES SPENDERSUBSTRATS MIT EINEM GENEIGTEN LASERSTRAHL 审中-公开
    用调整的激光束在分配器基板的边缘范围内引导RIP的方法

    公开(公告)号：EP3313604A1

    公开(公告)日：2018-05-02

    申请号：EP16732274.2

    申请日：2016-06-23

    申请人： Siltectra GmbH

    发明人： SWOBODA, Marko ,  BEYER, Christian ,  SCHILLING, Franz ,  RICHTER, Jan

    IPC分类号： B23K26/00 ,  B28D1/00 ,  B28D1/22 ,  B28D5/00 ,  C03B33/02 ,  C03B33/09 ,  C03B33/095 ,  H01L21/268 ,  H01L21/304 ,  B23K26/53 ,  B23K101/40

    摘要： The invention relates to a method for cutting solids wafers (1) off a donor substrate (2). The method comprises the following steps: providing a donor substrate (2), and producing at least one modification (10) in the interior of the donor substrate (2) by means of at least one laser beam (12), said laser beam (12) penetrating the donor substrate (2) via a flat surface (16) of the donor substrate (2). The laser beam (12) is inclined with respect to the flat surface (16) of the donor substrate (2) such that it penetrates the donor substrate at an angle of not equal to 0° or 180° relative to the longitudinal axis of the donor substrate. The laser beam (12) is focused in order to produce the modification (10) in the donor substrate (2) and the solids wafer (1) detaches itself from the donor substrate (2) as a result of the modifications (10) produced. Or a stress-inducing layer (14) is produced in or arranged on the flat surface (16) of the donor substrate (2) and mechanical stress is produced in the donor substrate (2) by exposing the stress-inducing layer (14) to heat. The mechanical stress produces a crack (20) for separating a solids layer (1), which crack propagates along the modifications (10).

    GLASS TUBE CLEANING AND CUTTING DEVICE AND METHOD FOR THE SAME
    4.
    发明公开
    GLASS TUBE CLEANING AND CUTTING DEVICE AND METHOD FOR THE SAME 有权
    玻璃管清洁和切割装置及其方法

    公开(公告)号：EP2808308A4

    公开(公告)日：2015-12-02

    申请号：EP12866747

    申请日：2012-11-20

    申请人： NIPPON ELECTRIC GLASS CO

    发明人： HOSHIBA KENICHI ,  ICHIKAWA MASAHIRO ,  HASEGAWA TORU

    IPC分类号： C03B33/095 ,  B08B5/02

    CPC分类号： C03B33/105 ,  B08B5/023 ,  C03B33/095 ,  Y10T83/0443 ,  Y10T83/242

    摘要： A glass tube cleaning and cutting device (10; 20) and a method for same configured to cut a continuous glass tube (G1) at a predetermined length (L) by intermittently contacting a cutting blade (16) with the outer circumference surface of the continuously travelling continuous glass tube (G1) formed by tube pulling while blowing air (A1) to impose scratches and thermal shock on the outer circumference surface of the continuous glass tube (G1) so as to obtain a plurality of cut-off glass tubes (G2), the glass tube cleaning and cutting device (10, 20) includes: a blower (2) provided on a more downstream side of the travelling continuous glass tube (G1) than the cutting blade(16), the blower (2) being configured to blow opposing air (A2) opposed to air (A1) into a tip end opening (F1) of the continuous glass tube (G1).

    摘要翻译： 一种玻璃管清洁和切割装置（10; 20）及其方法，用于通过间歇地将切割刀片（16）与所述切割刀片（16）的外周表面间歇地接触而将预定长度（L）切割成连续的玻璃管（G1） 连续行进的连续玻璃管（G1）通过在吹送空气（A1）的同时拉管而形成，以在连续玻璃管（G1）的外周表面上施加划痕和热冲击，以获得多个切断的玻璃管 G2），所述玻璃管清扫切割装置（10,20）具备：与所述切割刀片（16）相比，设置在所述行进连续玻璃管（G1）的下游侧的鼓风机（2） 被配置为将与空气（A1）相对的相对空气（A2）吹入连续玻璃管（G1）的末端开口（F1）。

    VERFAHREN ZUM SCHNEIDEN VON HOHLGLAS
    7.
    发明授权
    VERFAHREN ZUM SCHNEIDEN VON HOHLGLAS 失效
    方法切割中空玻璃

    公开(公告)号：EP0738241B1

    公开(公告)日：1998-08-26

    申请号：EP94912438.2

    申请日：1994-03-30

    申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

    发明人： DÖLL, Walter ,  BEINERT, Joachim ,  ROTH, Marcus ,  SCHINKER, Martin, G. ,  KOLLOFF, Rainer ,  SPIESS, Gerd ,  STAHN, Dieter

    IPC分类号： C03B33/095

    CPC分类号： C03B33/0955

    摘要： In a process for cutting hollow glassware, especially hollow glassware (3) with a rounded cross-section, an upper (36) and a lower (37) stress region on either side of an intended cut are produced thermally in the glass at a temperature slightly below its softening temperature by two laser beams (33, 34) substantially symmetrically to the intended cut. A crack inducing point (13) brought briefly into contact with the glass surface between the stress regions (36, 37) is used to make an initial crack on a section of the cut line which extends to form a high-grade cut around the entire circumference, thus obviating the need for subsequent grinding of the separation surface. The initial crack may also be made by focussing the laser beams (39, 40) in the area be tween the stress regions (35, 36). It is also possible to use only one laser beam to produce a single stress region, and in this case the initial crack is made substantially in the middle of the single stress region.