METHOD FOR SPLITTING END PART OF METAL PLATE OR METAL ROD, METAL PARTS MANUFACTURED BY SUCH END SPLITTING METHOD, AND METHOD FOR BONDING SUCH METAL PARTS
    3.
    发明公开
    METHOD FOR SPLITTING END PART OF METAL PLATE OR METAL ROD, METAL PARTS MANUFACTURED BY SUCH END SPLITTING METHOD, AND METHOD FOR BONDING SUCH METAL PARTS 审中-公开
    用于分解金属板或金属杆端部的方法,由这种端部分割方法制造的金属部件以及用于接合这种金属部件的方法

    公开(公告)号:EP3296034A1

    公开(公告)日:2018-03-21

    申请号:EP17197611.1

    申请日:2012-11-21

    Inventor: SEKI, Masakatsu

    Abstract: Provided are a method for splitting longitudinally an end part of a metal plate (1) or a metal rod (2) having a rectangular, polygonal, or elliptical shape, in which the length of incision in the split portion can be freely adjusted and smooth split face can be formed; a metal part manufactured by such method; and a method for bonding such metal part. The present invention is characterized by the process comprising the steps of securing a metal plate by pinching both sides thereof with a clamping device (3), or securing a metal rod by pinching at least two opposite-facing portions on the periphery thereof with a clamping device (3); splitting longitudinally by slitting or cleaving the metal plate, or the metal rod, by pressing a slitting punch (4) or a cleaving punch (5) against the face of one end of the metal plate (1), or the metal rod (2); and advancing the splitting further by repeating the same operation of pressing the same punch stated above against the cleft of the splitting. In each press-splitting operation, the position of the clamping device (3) on at least one side is moved in advance of the next pressing by a stroke corresponding to the distance from one end of the metal plate (1), or the metal rod (2), to the distal end of a split-desired portion.

    Abstract translation: 本发明提供一种方法,用于纵向分割具有矩形,多边形或椭圆形状的金属板(1)或金属杆(2)的端部,其中分离部分中的切口长度可以自由调节并且平滑 可以形成分裂面; 通过这种方法制造的金属部件; 以及用于粘合这种金属部件的方法。 本发明的特征在于包括以下步骤:通过用夹紧装置(3)夹紧金属板的两侧来固定金属板;或者通过夹紧至少两个相对的部分在其周边上通过夹紧来固定金属棒 装置(3); 或者通过将金属板(1)或金属棒(2)的一端的表面按压切割冲头(4)或劈开冲头(5),通过切割或劈开金属板或金属棒纵向地分裂 ); 并通过重复将上述相同的冲头按压在裂缝的裂缝上的相同操作来进一步推进裂开。 在每个分压操作中,夹紧装置(3)在至少一侧上的位置在下一次挤压之前移动与金属板(1)的一端的距离对应的行程,或者金属 杆(2)延伸到分裂期望部分的远端。

    Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
    8.
    发明公开
    Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses 有权
    用于通过激发脉冲超快激光脉冲的激光加工硅的方法和设备

    公开(公告)号:EP2898982A3

    公开(公告)日:2015-08-12

    申请号:EP14195892.6

    申请日:2014-12-02

    Abstract: A method for laser processing of Silicon includes placing a Kerr material into engagement with the Silicon forming an interface therebetween. A laser beam is applied having at least one subpulse in a burst envelope operating at a first wavelength. The laser beam passes through a distributive lens focusing assembly and to the Kerr material. The first wavelength is modified to a plurality of second wavelengths, some of which are effective for processing Silicon. Photoacoustic compression processing is produced by the laser pulse energy by a portion of second wavelengths delivered through the interface and to the Silicon which initiates Kerr Effect self-focusing which is propagated in the Silicon by additional energy input to the Silicon thus producing a filament within the Silicon.

    Abstract translation: 用于硅的激光加工的方法包括将克尔材料放置成与硅接合,在其间形成界面。 施加激光束,其在以第一波长工作的突发包络中具有至少一个子脉冲。 激光束通过分布式透镜聚焦组件和克尔材料。 第一波长被修改为多个第二波长,其中一些对于处理硅是有效的。 光声压缩处理是由激光脉冲能量通过一部分第二波长通过界面传递到硅上而产生的,该部分启动克尔效应自聚焦,通过附加能量输入到硅中在硅中传播,从而在硅 硅。

Patent Agency Ranking