公开(公告)号：EP1596422A2

公开(公告)日：2005-11-16

申请号：EP05076097.4

申请日：2005-05-10

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheung, Yiu Ming ,  Liu, Chou Kee, Peter ,  Yiu, Ching Hong ,  Chong, Chi Ming

IPC: H01L21/00

CPC classification number: H01L21/6838 ,  H01L21/67132 ,  H01L21/67144 ,  H01L2221/68322 ,  Y10S156/943 ,  Y10T29/4913 ,  Y10T29/49815 ,  Y10T29/53091 ,  Y10T29/53191 ,  Y10T29/53274 ,  Y10T156/1978 ,  Y10T156/1983

Abstract: An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved

Abstract translation: 提供了一种用于将半导体芯片从其上安装有的粘合带分离的装置和方法。 该装置包括适于在芯片的位置处接触粘合带的平台和联接到平台的保持力发生器，用于沿远离芯片的方向拉伸胶带。 升降装置可从平台投射，该平台可跨过平台的表面横向移动，并相对于平台垂直移动以升高芯片。 通过在升高芯片的同时将升降装置移动跨越芯片的宽度，可以实现芯片的控制提升和芯片与胶带之间的分层传播。

公开(公告)号：EP1596422A3

公开(公告)日：2009-11-11

申请号：EP05076097.4

申请日：2005-05-10

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheung, Yiu Ming ,  Liu, Chou Kee, Peter ,  Yiu, Ching Hong ,  Chong, Chi Ming

IPC: H01L21/00 ,  H01L21/68

CPC classification number: H01L21/6838 ,  H01L21/67132 ,  H01L21/67144 ,  H01L2221/68322 ,  Y10S156/943 ,  Y10T29/4913 ,  Y10T29/49815 ,  Y10T29/53091 ,  Y10T29/53191 ,  Y10T29/53274 ,  Y10T156/1978 ,  Y10T156/1983

Abstract: An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved

公开(公告)号：EP1596422B1

公开(公告)日：2012-08-01

申请号：EP05076097.4

申请日：2005-05-10

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheung, Yiu Ming ,  Liu, Chou Kee, Peter ,  Yiu, Ching Hong ,  Chong, Chi Ming

IPC: H01L21/00 ,  H01L21/68

CPC classification number: H01L21/6838 ,  H01L21/67132 ,  H01L21/67144 ,  H01L2221/68322 ,  Y10S156/943 ,  Y10T29/4913 ,  Y10T29/49815 ,  Y10T29/53091 ,  Y10T29/53191 ,  Y10T29/53274 ,  Y10T156/1978 ,  Y10T156/1983