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公开(公告)号：EP1601005A2
公开(公告)日：2005-11-30
申请号：EP05076250.9
申请日：2005-05-27
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , Y10T156/1179 , Y10T156/1983
摘要： A peeling device is provided for detachment of a chip from an adhesive tape on which it is mounted. The device comprises a platform including a first surface and a raised contact surface set at a determinate height with respect to the first surface. The raised contact surface has a width that is smaller than a width of the chip for contacting the adhesive tape at a position of the chip. Further, an elevation device is projectable from the raised contact surface and movable with respect to the platform for lifting the chip away from the adhesive tape.
摘要翻译： 设置有剥离装置用于从安装其上的胶带剥离芯片。 该装置包括平台，该平台包括相对于第一表面设置在确定高度的第一表面和凸起的接触表面。 凸起的接触表面的宽度小于在芯片的位置处与胶带接触的芯片的宽度。 此外，升降装置可从凸起的接触表面突出并且相对于平台可移动，以将芯片从胶带上提起。
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2.发明公开Apparatus and method for semiconductor chip detachment 有权Apparat und Methode zumAblöseneines Halbleiter-Chips
公开(公告)号：EP1596422A2
公开(公告)日：2005-11-16
申请号：EP05076097.4
申请日：2005-05-10
IPC分类号： H01L21/00
CPC分类号： H01L21/6838 , H01L21/67132 , H01L21/67144 , H01L2221/68322 , Y10S156/943 , Y10T29/4913 , Y10T29/49815 , Y10T29/53091 , Y10T29/53191 , Y10T29/53274 , Y10T156/1978 , Y10T156/1983
摘要： An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved
摘要翻译： 提供了一种用于将半导体芯片从其上安装有的粘合带分离的装置和方法。 该装置包括适于在芯片的位置处接触粘合带的平台和联接到平台的保持力发生器，用于沿远离芯片的方向拉伸胶带。 升降装置可从平台投射，该平台可跨过平台的表面横向移动，并相对于平台垂直移动以升高芯片。 通过在升高芯片的同时将升降装置移动跨越芯片的宽度，可以实现芯片的控制提升和芯片与胶带之间的分层传播。
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公开(公告)号：EP1450191B1
公开(公告)日：2008-05-21
申请号：EP04075551.4
申请日：2004-02-23
IPC分类号： G02B6/42
CPC分类号： G02B6/4225 , G02B6/4227 , G02B6/4237
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公开(公告)号：EP1596422A3
公开(公告)日：2009-11-11
申请号：EP05076097.4
申请日：2005-05-10
CPC分类号： H01L21/6838 , H01L21/67132 , H01L21/67144 , H01L2221/68322 , Y10S156/943 , Y10T29/4913 , Y10T29/49815 , Y10T29/53091 , Y10T29/53191 , Y10T29/53274 , Y10T156/1978 , Y10T156/1983
摘要： An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved
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5.发明公开Apparatus and method for active alignment of optical components 有权奥斯福特（Vorrichtung und Verfahren）和奥斯威力（Ausrichtung Optischer Bauteile）
公开(公告)号：EP1450191A1
公开(公告)日：2004-08-25
申请号：EP04075551.4
申请日：2004-02-23
IPC分类号： G02B6/42
CPC分类号： G02B6/4225 , G02B6/4227 , G02B6/4237
摘要： The invention provides an apparatus and method for the active alignment and coupling of separate optical components consisting of a light-emitting component (3) and a light-receiving component (15). It comprises first alignment means having a relatively lower optical resolving power stage (1) that is adapted to perform coarse alignment of the light-emitting component (3) to locate an approximate location of its point of highest intensity, and second alignment means having a relatively higher optical resolving power stage (2) that is adapted to perform fine alignment of the light-emitting component (3) to locate a more precise location of the said point of highest intensity. Accordingly, coarse alignment may be performed using a multi-mode fiber (7) and fine alignment may be performed using a single-mode fiber (15) that may further be coupled to the light-emitting component (3).
摘要翻译： 本发明提供了一种用于主动对准和耦合由发光部件（3）和受光部件（15）组成的分离的光学部件的装置和方法。 它包括具有相对较低的光学分辨能力级（1）的第一对准装置，其适于执行发光部件（3）的粗略对准以定位其最高强度点的近似位置，以及第二对准装置具有 相对较高的光学分辨力级（2），其适于执行发光部件（3）的精细对准以定位所述最高强度点的更精确的位置。 因此，可以使用多模光纤（7）进行粗略对准，并且可以使用可以进一步耦合到发光部件（3）的单模光纤（15）进行精细对准。
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公开(公告)号：EP1596422B1
公开(公告)日：2012-08-01
申请号：EP05076097.4
申请日：2005-05-10
CPC分类号： H01L21/6838 , H01L21/67132 , H01L21/67144 , H01L2221/68322 , Y10S156/943 , Y10T29/4913 , Y10T29/49815 , Y10T29/53091 , Y10T29/53191 , Y10T29/53274 , Y10T156/1978 , Y10T156/1983
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公开(公告)号：EP1601005A3
公开(公告)日：2008-11-12
申请号：EP05076250.9
申请日：2005-05-27
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , Y10T156/1179 , Y10T156/1983
摘要： A peeling device is provided for detachment of a chip from an adhesive tape on which it is mounted. The device comprises a platform including a first surface and a raised contact surface set at a determinate height with respect to the first surface. The raised contact surface has a width that is smaller than a width of the chip for contacting the adhesive tape at a position of the chip. Further, an elevation device is projectable from the raised contact surface and movable with respect to the platform for lifting the chip away from the adhesive tape.
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