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17 条记录 (耗时 0.012 秒)

    Means for coupling an optical fiber to an opto-electronic device
    4.
    发明公开
    Means for coupling an optical fiber to an opto-electronic device 失效
    用于将光纤耦合到光电设备的手段

    公开(公告)号：EP0305112A3

    公开(公告)日：1991-04-03

    申请号：EP88307663.0

    申请日：1988-08-18

    申请人： AT&T Corp.

    发明人： Pimpinella, Richard Joseph ,  Segelken, John Maurice

    IPC分类号： H01L31/0203 ,  H01L33/00 ,  H01L23/14 ,  G02B6/42

    CPC分类号： H01L31/0203 ,  G02B6/3644 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/3696 ,  G02B6/4202 ,  G02B6/4204 ,  G02B6/423 ,  G02B6/4231 ,  G02B6/4239 ,  H01L33/58 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/30107 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The disclosed means for coupling an optical fiber (52) and an opto-electronic device (e.g., LED, laser, or photodetector) (40) comprises a first body (10) having two substantially parallel major surfaces, with a recessed portion (a "well") (11) formed in one surface, and a through-aperture extending from the other surface to the well. Conductive means (21, 24) extend from the former surface onto the bottom of the well, and the opto-electronic device typically is mounted in the well such that the device does not protrude above the plane of the associated surface, such that the electrical contact is established between the device and the conductive means, and such that the active region of the device is centered upon the through-aperture. The first body is advantageously produced from a (100) Si wafer by means of standard Si processing techniques, including selective etching. The assembly can be mounted on a substrate, e.g., a Si wafer with appropriate metallization thereon, and the end of an optical fiber inserted into the through-aperture and secured to the first body. The assembly can be operated at relatively high speed, due to its relatively low parasitic capacitance and inductance, and can be mounted on the substrate in substantially the same was as IC chips are mounted, in close proximity to associated electrical components.

    Optical assembly comprising optical fiber coupling means
    5.
    发明公开
    Optical assembly comprising optical fiber coupling means 失效
    Optisches Modal mit faseroptischen Kopplungsmitteln。

    公开(公告)号：EP0413489A2

    公开(公告)日：1991-02-20

    申请号：EP90308649.4

    申请日：1990-08-06

    申请人： AT&T Corp.

    发明人： Pimpinella, Richard Joseph ,  Segelken, John Maurice ,  Tai, King Lien ,  Thompson, Ross Job

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4292 ,  G02B6/4202 ,  G02B6/4204 ,  G02B6/421

    摘要： Disclosed is a novel "hermetic" optical assembly. A radiation-­transmissive member (10) seals an aperture (22) in the assembly housing. The member comprises two major surfaces and a recess (12) that extends from one surface towards the other, with a "septum" (14) between the bottom of the recess and the other surface. An optical or opto-electronic device (23) typically is mounted on the inside surface of the member, and the end of an optical fiber is maintained outside of the assembly in coupling relationship with the device. In a currently preferred embodiment the recess extends from the outward-facing surface of the member and serves to position the end of the optical fiber with respect to a device mounted in a "well" (11) in the inward-facing surface of the member. In another embodiment, the outward facing surface of the member comprises geometrical features (e.g., recesses) that mate with corresponding features (e.g., protrusions) on a guide plate that serves to position the ends of a multiplicity of fibers with respect to devices mounted on the bottom of a recess extending from the inward-facing surface of the radiation-transmissive member. In all embodiments radiation is transmitted through the septum. In preferred embodiments the radiation-transmissive member is (100) Si, with the recess (and other features) produced by means comprising photolithography and anisotropic etching.

    摘要翻译： 公开了一种新颖的“密封”光学组件。 辐射透射构件（10）密封组件壳体中的孔（22）。 该构件包括两个主表面和从一个表面朝向另一个表面延伸的凹部（12），在凹部的底部和另一个表面之间具有“隔膜”（14）。 光学或光电子器件（23）通常安装在构件的内表面上，并且光纤的端部在与装置的耦合关系中保持在组件的外部。 在当前优选的实施例中，凹部从构件的面向外的表面延伸并且用于相对于安装在构件的向内表面中的“井”（11）中的装置定位光纤的端部 。 在另一个实施例中，构件的面向外的表面包括几何特征（例如，凹部），其与引导板上的相应特征（例如，突起）相配合，该引导板用于相对于安装在其上的装置定位多根纤维的端部 从辐射透射构件的向内的表面延伸的凹部的底部。 在所有实施例中，辐射通过隔膜传播。 在优选实施例中，辐射透射构件是（100）Si，其中通过包括光刻和各向异性蚀刻的手段产生凹部（和其它特征）。

    Signal routing in a stacked array of multiprocessor boards
    8.
    发明公开
    Signal routing in a stacked array of multiprocessor boards 失效
    Signalweglenkungfüraufeinandergestapelte Multiprozessormodule。

    公开(公告)号：EP0478121A2

    公开(公告)日：1992-04-01

    申请号：EP91306586.8

    申请日：1991-07-19

    申请人： AT&T Corp.

    发明人： Segelken, John Maurice ,  Shively, Richard Robert ,  Stanziola, Christopher Anthony ,  Wu, Lesley Jen-Yuan

    IPC分类号： G06F13/40 ,  H05K7/02

    CPC分类号： H05K7/023 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/19107 ,  H05K1/144 ,  H01L2924/00014

    摘要： A system is described for arraying multi-device processing nodes (1,2) in a 3-dimensional computing architecture and for flexibly connecting their ports. The topology of each processing node is of a fixed and constant physical geometry. The nodes may comprise a digital signal processor chip, a static RAM, and a communications and network controller. The nodes or tiles are 4-connected, each having logical north, east, south and west ports. The nodes are mounted on boards (17,18,19). Selective connection of essentially any one port to another on a different board is effected by use of a routing and spacer element (50) having internal routing paths preselected to support a desired node interconnection architecture. Novel multiprocessing architectures and connections to a Host computer are also disclosed.

    摘要翻译： 描述了用于在三维计算架构中排列多设备处理节点（1,2）并且用于灵活地连接其端口的系统。 每个处理节点的拓扑结构具有固定和恒定的物理几何。 节点可以包括数字信号处理器芯片，静态RAM以及通信和网络控制器。 节点或瓦片是4连接的，每个节点或瓦片具有逻辑的北，东，南和西端口。 节点安装在板（17,18,19）上。 通过使用具有预选的支持所需节点互连体系结构的内部路由路径的路由和间隔元件（50）来实现基本上任何一个端口到另一板上的不同板上的选择性连接。 还公开了新的多处理架构和与主机的连接。